Products

Applied Technologies 5922 Silver Epoxy is a highly flexible, two component, silver filled epoxy designed for easy noncritical 1:1 mixing and cure responses at either room temperature (20-25°C) or low heat (100°C). This material may also be used on surfaces which may be exposed to damp or wet environments. Applications include making and/or repairing flexible circuitry on a variety of plastic substrates, including both raw and Indium Tin Oxide coated polyester films. Other uses include chip bonding, die attachment, solderless wire connections, and repair of automotive rear window defogger and antenna circuits. This material, when properly cured, is highly conductive, exhibits outstanding adhesion, and is extremely crack resistant, even when creased at 180°. It also has excellent shock resistant properties when applied to rigid substrates like glass, metals, and hard plastics.

Applied Technologies 5921 Silver Epoxy is a highly flexible, two component, silver filled epoxy designed for easy noncritical 1:1 mixing and cure responses at either room temperature (20-25°C) or low heat (100°C). Applications include making and/or repairing flexible circuitry on a variety of plastic substrates including both raw and Indium Tin Oxide coated polyester films. Other uses include chip bonding, die attachment, and solderless wire connections. This material when properly cured, is highly conductive, exhibits outstanding adhesion, and is extremely crack resistant - even when creased at 180°C.

Applied Technologies 7485 Gold Conductive Polyimide Adhesive is a one component, gold filled polyimide adhesive designed primarily for use in bonding quartz crystals. When properly cured, this adhesive exhibits outstanding resistance to most chemicals and solvents, is highly conductive, and can withstand brief excursions to 450°C.

Applied Technologies 5902 Silver Epoxy is a high solids, two component, silver filled epoxy designed for easy noncritical 1:1 mixing and quick cure responses at room temperature (20-25 °C), or low heat (100°C). Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/ grounding, thermal dissipation, and use as a general electrically conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety or substrates including ceramic, glass, metal, and plastic.

Applied Technologies 5933 Silver Epoxy is a 100% solids, two component, silver filled epoxy designed for easy non-critical 1:1 mixing and quick cure responses at room temperature (20-25°C). Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, rear window defroster attachment, and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Applied Technologies 5978-14 Silver Epoxy is a high solids, one-component, silver filled epoxy designed for screen printing. Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, windshield bus bars and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Applied Technologies 7975-HP-E Silver Conductive Polyimide Adhesive is a one component, screen printable silver filled polyimide adhesive designed for use in making high temperature heating grids on glass, kapton, and ceramic substrates. When properly cured, this adhesive exhibits outstanding resistance to most chemicals and solvents, is highly conductive, and can withstand brief excursions to 450°C.

Applied Technologies 5995 Silver Epoxy is a 100% solids, two component, silver filled epoxy designed for quick cure responses at room temperature (20-25C). Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, rear window defroster attachment, and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.