Products

Applied Technologies 5902 Silver Epoxy is a high solids, two component, silver filled epoxy designed for easy noncritical 1:1 mixing and quick cure responses at room temperature (20-25 °C), or low heat (100°C). Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/ grounding, thermal dissipation, and use as a general electrically conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety or substrates including ceramic, glass, metal, and plastic.

Applied Technologies 5933 Silver Epoxy is a 100% solids, two component, silver filled epoxy designed for easy non-critical 1:1 mixing and quick cure responses at room temperature (20-25°C). Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, rear window defroster attachment, and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Applied Technologies 7975-HP-E Silver Conductive Polyimide Adhesive is a one component, screen printable silver filled polyimide adhesive designed for use in making high temperature heating grids on glass, kapton, and ceramic substrates. When properly cured, this adhesive exhibits outstanding resistance to most chemicals and solvents, is highly conductive, and can withstand brief excursions to 450°C.

Applied Technologies 5978-14 Silver Epoxy is a high solids, one-component, silver filled epoxy designed for screen printing. Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, windshield bus bars and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Applied Technologies 5995 Silver Epoxy is a 100% solids, two component, silver filled epoxy designed for quick cure responses at room temperature (20-25C). Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, rear window defroster attachment, and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.