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Applied Technologies 5933 Silver Epoxy

Applied Technologies 5933 Silver Epoxy is a 100% solids, two component, silver filled epoxy designed for easy non-critical 1:1 mixing and quick cure responses at room temperature (20-25°C). Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, rear window defroster attachment, and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Application Area: Printed Circuit Boards

Compatible Substrates & Surfaces: Ceramic, Glass, Metal, Plastics

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Components

(2) Part A - Epoxy/Silver Part B - Hardener/Silver

Consistency

Viscous, Thixotropic Paste

Applications & Uses

Application Area
Compatible Substrates & Surfaces
Applications
  • Making/repairing flexible circuitry
  • Chip bonding
  • Die attachment
  • Solderless wire connections
  • Repair of automotive rear window defogger and antenna circuits
Instructions
  1. Be sure that all surfaces to be bonded or coated with 5933 silver epoxy are clean, dry, and free of any grease or oil.
  2. Thoroughly mix equal amounts (by weight or volume) of Part-A and Part-B. * Typical mixing times for small batches up to 5 grams is approximately 1 ½-2 minutes. After 3-4 minutes, the viscosity of the mixed material will begin to increase. Larger quantities of mixed material exceeding a total of 6 gm is not recommended and may cause excessive heat and/or a significantly shorter pot life.
  3. Since 5933 silver epoxy is designed to be a “Rapid Cure Adhesive”, it is recommended that applications be made within 2-5 minutes of mixing. After this time the material will exhibit drastic increases in viscosity.
  4. For cleanup of uncured material use acetone, isopropyl alcohol, or MEK.
Curing Schedule

16-24 Hours at 25°C or 10 Minutes at 80-100°C

Mix-Ratio

1:1 (by weight or volume)

Pot Life

3-5 Minutes at 20-25°C (3-5 gm mixed mass)*

Properties

Color
Typical Properties
ValueUnitsTest Method / Conditions
Silver Content84.0%
Specific Gravity4.05
Volume Resistivitymax. 0.001ohm-cm
Thermal Conductivity (in/F² hr °F)11.0BTU
Thermal Coefficient of Expansion (under 83°C)40 x 10⁻⁶in/in/°C
Hardnessmin. 70.0Shore D
Tensile Lap Shearmin. 1,200psi
Service Temperature Range-55 - (+)100°C

Storage & Handling

Shelf Life

(6) months sealed, at room temperature, unmixed.