Bondline

Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6571 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6576 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6905 is a combination flux and underfill epoxy encapsulant. After solder reflow the gelled underfill epoxy is post cured at 150-160°C for 90-120 minutes. It’s low extractable ions make it suitable for flip chip on-board (FCOB) and chip scale packages (CSP’s). Stable to 250°C, weight loss starts at 270°C.

Bondline 6959 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Bondline 6968 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Bondline 7247 is a premixed and frozen electronic grade epoxy adhesive. This low coefficient of expansion epoxy offers high reliability when bonding and sealing critical electronic instruments

Bondline 7780 is a medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, or lid sealing adhesive

Bondline 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver, and copper.

Bondline 2156 is a resilient tungsten and silver filled premixed and frozen epoxy. It provides good adhesion, low volume resistivity and thermal conductivity.

Bondline 2158 is a resilient tungsten and silver filled premixed and frozen epoxy. It provides good adhesion, low volume resistivity and thermal conductivity with an elevated cure.