Products

Bondline 6576 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6968 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Bondline 2485 is a silver filled, electrically conductive epoxy adhesive. This premixed, frozen and solvent free adhesive is designed for microelectronic chip bonding.

Bondline 6571 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 2158 is a resilient tungsten and silver filled premixed and frozen epoxy. It provides good adhesion, low volume resistivity and thermal conductivity with an elevated cure.

Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

Bondline 2156 is a resilient tungsten and silver filled premixed and frozen epoxy. It provides good adhesion, low volume resistivity and thermal conductivity.

Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 7780 is a medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, or lid sealing adhesive

Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

Bondline 6959 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Bondline 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver, and copper.

Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6905 is a combination flux and underfill epoxy encapsulant. After solder reflow the gelled underfill epoxy is post cured at 150-160°C for 90-120 minutes. It’s low extractable ions make it suitable for flip chip on-board (FCOB) and chip scale packages (CSP’s). Stable to 250°C, weight loss starts at 270°C.

Bondline 7247 is a premixed and frozen electronic grade epoxy adhesive. This low coefficient of expansion epoxy offers high reliability when bonding and sealing critical electronic instruments