Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Performance and Features
- This series of potting compounds are suitable for various potting modes.
- Low stress, more effective protection of electrical components.
- Excellent high and low temperature resistance, excellent weather resistance and radiation resistance and excellent dielectric properties.
- Stable chemical and mechanical properties.
This product also has high resistance Low temperature and high insulation characteristics, low colloidal stress after curing, so as to more effectively eliminate the production of electronic components due to changes in operating temperature. destructive effect. This product is suitable for double-layer package light of laser potting and fixing of fibers on aluminum fiber optic reels. Since TPC-200 is not pro Water, with the characteristics of moisture-proof, can effectively slow down the moisture on the outer layer influence and prolong the fiber life. This product has excellent properties before curing Good fluidity and leveling, no volatiles are generated after curing. The curing system of this product has good anti-toxicity, in general Under these circumstances, no special treatment is required for solder and paint.
Applications & Uses
- Applications
- Application Area
- Cure Method
- Application Areas
- Controller
- Telecommunications Equipment
- Integrated Chip
- Automotive Electronics
- Power Modules
- Led Assembly
- Computer and Its Accessories
- Power Module
Properties
- Color
- Typical Properties
| Value | Units | Test Method / Conditions | |
| A/B Mixing Ratio | 1:1 | - | - |
| Continous Use Temperature | -50 to 200 | °C | - |
| Density | 0.92 - 1.02 | g/cm³ | ASTM D792 |
| Dielectric Strength | min. 18 | kV/mm | ASTM D149 |
| Hardness | 20 - 30 | Shore A | ASTM D2240 |
| Operating Period (20°C) | min. 20 | - | - |
| Thermal Conductivity | 0.2 - 0.3 | W/m.k | ASTM D5470 |
| Viscosity | 2500 - 3500 | Cps | Brookfield Viscometer |
| Volume Resistance | 3x10¹³ | Ω∙cm | ASTM D257 |
Technical Details & Test Data
- Crosslinking/Curing Time
TPC-200 silica gel can be left at room temperature for 4 to 8 hours Cures naturally. Its crosslinking (full cure) time will vary with temperature rise and shorten.
25°C 4-8 Hours 75°C 10-20 Minutes The data in this specification were obtained under laboratory conditions. But because Due to differences in the use environment and process, it cannot be guaranteed that the product will be correctness and suitability for certain usages and uses. User is using when using it, be sure to test it first to confirm that it is suitable for your purpose.
Storage & Handling
- Shelf Life
- 6 Months (at less than 20°C)