- Ready to Use Product Type:2K (2 component) Sealant, Solvent free (100% Solids) Sealant, Potting Compound
- Application Area:Electrical Components
- Cure Method:Heat Cure
- Chemical Family:Silicones
PAKCOOL® TPC-213-08 is 1:1 two-component liquid electronic potting material, available at room temperature or at elevated temperatures damage caused by changes in operating temperatures cured. In addition to the characteristics of high thermal conductivity, this product also has a thermal expansion rate Low and high insulation characteristics, so as to eliminate electronic elements more effectively damage caused by changes in operating temperature.