- Ready to Use Product Type:2K (2 component) Sealant, Solvent free (100% Solids) Sealant, Potting Compound
- Application Area:Electrical Components
- Cure Method:Heat Cure
- Chemical Family:Silicones
PAKCOOL® TPC-219 is 1:1 two-component liquid electronic potting material, available at room temperature or warmed under curing. In addition to the characteristics of high thermal conductivity, this product also has thermal low expansion rate and high insulation characteristics, so as to be more effective eliminate the destructive effect of electronic components due to changes in operating temperature.