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Farboset® 1190

1 of 35 products in this brand
Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.

Polymer Name: Epoxy Resins & Compounds

End Uses: Coils, Encapsulant, Power Transformers, Switches

Volume Resistivity: 10000000000000.0 - 10000000000000.0 Ohm-m

Flexural Strength: 137.788 - 137.788 MPa

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers End Uses
Product Applications

It is designed for the encapsulation of coils, transformers, switches and other electrical and electronic components requiring excellent thermal shock resistance. This material exhibits superior resistance to cracking.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength14000psi
Tensile Strength985kg/cm²
Flexural Strength20000psi
Flexural Strength1406kg/cm²
Compressive Strength35000psi
Compressive Strength2450kg/cm²
Hardness (Shore D)85
Impact Strength (Izod Notched)0.033kg-m/cm
Impact Strength (Izod Notched)0.6ft-Ib/inch
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)130°C
Thermal Conductivity20x10⁻⁴cal/cm-sec-°C
Heat Distortion Temperature (at 18.6 kg/cm²)110°C
Heat Distortion Temperature (at 264 psi)230°F
Maximum Intermittent Operating Temperature200°C
Hot Plate Cure Time (at 150 °C)42seconds
Electrical Properties
ValueUnitsTest Method / Conditions
Surface Resistivity1.0 x 10¹⁶ohm-cm
Arc Resistance200seconds
Dissipation Factor (1 KHz)0.004ASTM 150
Dielectric Constant (1 KHz)38
Dielectric Strength (Short Time, 125 mils)350volts/mil
Loss Factor (1 KHz)0.015ASTM 150
Volume Resistivity1.0 x 10¹⁵Ohm - cm
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density10gm/cc
Molding Pressure3.5 - 70kg/cm²
Molding Pressure50 - 1,000psi
Molding Temperature150 - 180°C
Molding Temperature302 - 356°F
Mold Shrinkage0.005cm/cm
Cure Time (at 150°C)1.5 - 3minutes
Molded Density1.91gm/cc
Spiral Flow69cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
2 days - 6 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6
Storage Life (Not more than 40% loss of spiral flow based on original values.) 25 °C , weeks 1
Storage Life (Not more than 40% loss of spiral flow based on original values.) 35 °C, days 2