Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Application Area
- Application Method
- Product Applications
This compound is designed ideally suited for film and ceramic capacitors which need to be processed in low temperatures. It can be applied using fluidized bed, wheel coaters, or electrostatic spray techniques.
Properties
- Thermal Properties
- Electrical Properties
- Powder Characteristics
- Moisture Properties
Value | Units | Test Method / Conditions | |
Glass Transition Temperature (Tg) | 110.0 | °C | — |
Linear Thermal Expansion | 50 x 10⁻⁶ | cm/cm/°C | — |
Plate Flow (at 150 °C ,60° angle) | 23.0 | mm | — |
Hot Plate Gel Time (at 150 °C) | 35.0 | seconds | — |
Value | Units | Test Method / Conditions | |
Dissipation Factor (1 KHz) | 0.006 | — | ASTM 150 |
Dielectric Constant (1 KHz) | 4.0 | — | ASTM 150 |
Dielectric Strength | 900.0 | volts/mil | ASTM 149 |
Loss Factor (1 KHz) | 0.014 | — | ASTM 150 |
Value | Units | Test Method / Conditions | |
Particle Size (U.S. Mesh, +80 max) | 1.0 | % | — |
Particle Size (U.S. Mesh, -325) | 27 - 33 | % | — |
Edge Coverage | 30.0 | % | ASTM D-2967 |
Cure Time (at 110°C) | 60.0 | minutes | — |
Cure Time (at 150°C) | 10.0 | minutes | — |
Molded Density | 1.6 | gm/cc | — |
Value | Units | Test Method / Conditions | |
Water Absorption (at 23 °C, 24 hours) | 0.1 | % | — |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 6 months
- Storage and Shelf life Conditions
Storage Specification Data Recommended Storage Temperature °C 18 Storage Life (Not more than 40% loss of spiral flow based on original values.) 4 °C , months 6