Farboset

Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.

Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.

Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.

Farboset® 1712 is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.

Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.

Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.

Farboset® 2471VO is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for various thermoset molding applications, ensuring safety and reliability in its intended use.

Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

Farboset® 2477BB is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.