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Farboset® 1707-2

1 of 35 products in this brand
Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

Polymer Name: Epoxy Resins & Compounds

End Uses: Bushings, Coils, Encapsulant, Power Transformers

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Materials Features

Applications & Uses

Plastics & Elastomers End Uses
Product Applications

It is designed for the encapsulation of coils, transformers, bushings, and other electrical and electronic components requiring high thermal shock resistance.

Properties

Flame Rating
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength19000.0psi
Flexural Strength1388.0kg/cm²
Compressive Strength32000.0psi
Compressive Strength2250.0kg/cm²
Tensile Strength12000.0psi
Tensile Strength850.0kg/cm²
Hardness (Shore D)95.0
Impact Strength (Izod Notched)0.028kg-m/cm
Impact Strength (Izod Notched)0.52ft-Ib/inch
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity30 x 10⁻⁴cal/cm-sec-°C
Heat Distortion Temperature (at 18.6 kg/cm²)110.0°C
Heat Distortion Temperature (at 264 psi)230.0°F
Maximum Intermittent Operating Temperature200.0°C
Hot Plate Cure Time (at 150 °C)38.0seconds
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180.0seconds
Dissipation Factor (1 KHz)0.005ASTM 150
Dielectric Constant (1 KHz)3.6
Dielectric Strength (Short Time, 125 mils)350.0volts/mil
Loss Factor (1 KHz)0.018ASTM 150
Volume Resistivity6.0x 10¹⁵Ohm - cm
Surface Resistivity1x 10¹⁶ohm-cm
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density1.0gm/cc
Molding Pressure3.5 - 70kg/cm²
Molding Pressure50 - 1,000psi
Molding Temperature150 - 180°C
Molding Temperature302 - 356°F
Mold Shrinkage0.006cm/cm
Cure Time (at 150°C)1 - 3minutes
Molded Density1.95gm/cc
Spiral Flow94.0cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
12 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 12