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Farboset® 2270

1 of 35 products in this brand
Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.

Polymer Name: Epoxy Resins & Compounds

End Uses: Capacitors, Encapsulant, Resistor

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Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers End Uses
Product Applications

It is designed for the encapsulation of capacitors, resistors, hybrids and other electrical and electronic components.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength16000.0psi
Flexural Strength1125.0kg/cm²
Compressive Strength40000.0psi
Compressive Strength2800.0kg/cm²
Tensile Strength10000.0psi
Tensile Strength700.0kg/cm²
Hardness (Shore D)90.0
Impact Strength (Izod Notched)0.022kg-m/cm
Impact Strength (Izod Notched)0.4ft-Ib/inch
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)145.0°C
Linear Thermal Expansion (Alpha 1)35x 10⁻⁶cm/cm/°C
Linear Thermal Expansion (Alpha 2)80x 10⁻⁶cm/cm/°C
Thermal Conductivity22 x 10⁻⁴cal/cm-sec-°C
Maximum Intermittent Operating Temperature200.0°C
Hot Plate Cure Time (at 150 °C)39.0seconds
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180.0seconds
Dissipation Factor (1 KHz)0.004ASTM 150
Dielectric Constant (1 KHz)4.0
Dielectric Strength (Short Time, 125 mils)min. 400volts/mil
Loss Factor (1 KHz)0.016ASTM 150
Volume Resistivity2.0x 10¹⁵Ohm - cm
Surface Resistivity1.0 x 10¹⁶ohm-cm
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density1.0gm/cc
Molding Pressure14 - 70kg/cm²
Molding Pressure200 - 1,000psi
Molding Temperature302 - 356°F
Molding Temperature150-180°C
Post Cure (at 180°C)4 - 16hours
Cure Time (at 150°C)1 - 2minutes
Molded Density1.9gm/cc
Spiral Flow102.0cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
6 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6