Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Fillers Included
- Polymer Name
- Plastics & Elastomers Functions
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Plastics & Elastomers End Uses
- Product Applications
This compound was especially formulated for improved resistance to moisture ingress along with a high glass transition temperature for optimum reliability performance. It is designed to encapsulate a wide range of devices including tantalum and ceramic capacitors, resistors, resistor networks and high performance coils.
Properties
- Flame Rating
- Flame Rating
- UL 94 V0
- Mechanical Properties
- Thermal Properties
- Electrical Properties
- Processing Information (Molding)
| Value | Units | Test Method / Conditions | |
| Flexural Strength | 14000 | kg/cm² | — |
| Flexural Strength | 985 | psi | — |
| Compressive Strength | 26000 | kg/cm² | — |
| Compressive Strength | 1830 | psi | — |
| Tensile Strength | 9000 | kg/cm² | — |
| Tensile Strength | 630 | psi | — |
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature (Tg) | 169 | °C | — |
| Linear Thermal Expansion (Alpha 1) | 39x 10⁻⁶ | cm/cm/°C | — |
| Linear Thermal Expansion (Alpha 2) | 30x 10⁻⁶ | cm/cm/°C | — |
| Hot Plate Cure Time (at 150 °C) | 25 | seconds | — |
| Thermal Conductivity | 30x10⁻⁴ | cal/cm-sec-°C | — |
| Value | Units | Test Method / Conditions | |
| Dielectric Constant (1 MHz) | 4.2 | — | — |
| Dielectric Constant (60 Hz) | 4.4 | — | — |
| Dissipation Factor (60 Hz) | 0.004 | — | ASTM 150 |
| Dissipation Factor (1 MHz) | 0.013 | — | ASTM 150 |
| Dissipation Factor (10 KHz) | 0.012 | — | ASTM 150 |
| Dielectric Constant (10 KHz) | 4.3 | — | — |
| Dielectric Strength (Short Time, 125 mils) | 300 | volts/mil | — |
| Volume Resistivity | 1.8 x 10¹⁵ | Ohm - cm | — |
| Value | Units | Test Method / Conditions | |
| Bulk Density | 1 | gm/cc | — |
| Molding Pressure | 14 - 70 | kg/cm² | — |
| Molding Pressure | 200 - 1,000 | psi | — |
| Molding Temperature | 145 - 180 | °C | — |
| Molding Temperature | 293 - 356 | °F | — |
| Mold Shrinkage | 0.005 | cm/cm | — |
| Cure Time (at 150°C) | 1 - 2 | minutes | — |
| Molded Density | 2.03 | gm/cc | — |
| Spiral Flow | 89 | cm | EMMI 1-66A |
Regulatory & Compliance
Storage & Handling
- Shelf Life
- 6 months
- Storage and Shelf life Conditions
Storage Specification Data Recommended Storage Temperature °C 4 Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6