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Farboset® 2461

1 of 35 products in this brand
Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.

Polymer Name: Epoxy Resins & Compounds

End Uses: Capacitors, Encapsulant, Inductor Coil, Resistor, Resistor Network

Volume Resistivity: 22000000000000.0 - 22000000000000.0 Ohm-m

Flexural Strength: 85.436 - 85.436 MPa

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Product Applications

This compound was especially formulated to achieve a high glass transition temperature for optimum reliability performance in very thin sections. It is designed to encapsulate a wide range of devices including capacitors, resistors, resistor networks and inductor coils.

Properties

Flame Rating
Flame Rating
UL 94 V0
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength8200psi
Tensile Strength580kg/cm²
Flexural Strength12400psi
Flexural Strength873kg/cm²
Compressive Strength34200psi
Compressive Strength2400kg/cm²
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)163°C
Linear Thermal Expansion (Alpha 1)27x 10⁻⁶cm/cm/°C
Linear Thermal Expansion (Alpha 2)60x 10⁻⁶cm/cm/°C
Thermal Conductivity23x10⁻⁴cal/cm-sec-°C
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance194seconds
Dissipation Factor (1 KHz)0.012ASTM 150
Dielectric Constant (1 KHz)5.12
Dielectric Strength (1/4 Inch Section)387volts/mil
Surface Resistivitymin. 1.5x 10¹⁶ohm-cm
Volume Resistivity2.2x 10¹⁵Ohm - cm
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density0.9gm/cc
Molding Pressure14 - 70kg/cm²
Molding Pressure200 - 1,000psi
Molding Temperature145 - 180°C
Molding Temperature293 - 356°F
Mold Shrinkage0.004cm/cm
Cure Time (at 150°C)1 - 2minutes
Post Cure (at 150°C)4hours
Molded Density2.08gm/cc
Spiral Flow76cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
6 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6