Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
- Application Method
- Compatible Substrates & Surfaces
- Product Applications
This compound is ideally suited for both radial and axial components such as ceramic and film capacitors, coils, thermistors and resistors. It can be applied using fluidized bed, wheel coaters, or electrostatic spray techniques.
Properties
- Thermal Properties
- Electrical Properties
- Powder Characteristics
- Moisture Properties
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature (Tg) | 125.0 | °C | — |
| Linear Thermal Expansion | 50x 10⁻⁶ | cm/cm/°C | — |
| Plate Flow (at 150 °C ,60° angle) | 36.0 | mm | — |
| Hot Plate Gel Time (at 150 °C) | 58.0 | seconds | — |
| Value | Units | Test Method / Conditions | |
| Dissipation Factor (1 KHz) | 0.006 | — | ASTM 150 |
| Dielectric Constant (1 KHz) | 4.2 | — | ASTM 150 |
| Dielectric Strength | 900.0 | volts/mil | ASTM 149 |
| Loss Factor (1 KHz) | 0.025 | — | ASTM 150 |
| Value | Units | Test Method / Conditions | |
| Particle Size (U.S. Mesh, +80 max) | 1.0 | % | — |
| Particle Size (U.S. Mesh, -325) | 27 - 33 | % | — |
| Application and Cure Range | 125 - 175 | °C | — |
| Cure Time (at 130 °C) | 60.0 | minutes | — |
| Cure Time (at 150 °C) | 30.0 | minutes | — |
| Cure Time (at 160 °C) | 20.0 | minutes | — |
| Edge Coverage | 40.0 | % | ASTM D-2967 |
| Molded Density | 1.53 | gm/cc | — |
| Value | Units | Test Method / Conditions | |
| Water Absorption (at 23 °C, 24 hours) | 0.1 | % | — |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 6 months
- Storage and Shelf life Conditions
Storage Specification Data Recommended Storage Temperature °C 18 Storage Life 4 °C , months 6