Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
Applications & Uses
- Markets
- Product Applications
This compound is designed for encapsulation of hybrids, mica capacitors and other semi conductor grade devices requiring very high purity and optimum moisture performance. It is an ideal candidate for chip on board applications due to its excellent adhesion characteristics.
Properties
- Thermal Properties
- Electrical Properties
- Powder Characteristics
- Moisture Properties
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature (Tg) | 160.0 | °C | — |
| Linear Thermal Expansion | 38 x 10⁻⁶ | cm/cm/°C | — |
| Plate Flow (at 150 °C ,60° angle) | 35.0 | mm | — |
| Hot Plate Gel Time (at 150 °C) | 45.0 | seconds | — |
| Value | Units | Test Method / Conditions | |
| Dissipation Factor (1 KHz) | 0.005 | — | ASTM 150 |
| Dielectric Constant (1 KHz) | 3.5 | — | ASTM 150 |
| Dielectric Strength | 900.0 | volts/mil | ASTM 149 |
| Loss Factor (1 KHz) | 0.018 | — | ASTM 150 |
| Value | Units | Test Method / Conditions | |
| Particle Size (U.S. Mesh, +80 max) | 1.0 | % | — |
| Particle Size (U.S. Mesh, -325) | 27 - 33 | % | — |
| Application and Cure Range | 125 - 175 | °C | — |
| Cure Time (at 130°C ) | 60.0 | minutes | — |
| Cure Time (at 150°C ) | 30.0 | minutes | — |
| Edge Coverage | 35.0 | % | ASTM D-2967 |
| Molded Density | 1.41 | gm/cc | — |
| Value | Units | Test Method / Conditions | |
| Water Absorption (at 23 °C, 24 hours) | 0.7 | % | — |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 6 months
- Storage and Shelf life Conditions
Storage Specification Data Recommended Storage Temperature °C 18 Storage Life 4 °C , months 6