Products

Resbond™ 940LE is an adhesive specially designed to bond low expansion materials or use in difficult applications. Resbond 940LE cures in minutes to form an electrically and chemically resistant bond that will prevent cracking in thermal shock applications.

Durabond™ 4701 is a one component, toughened adhesive and casting compound that has excellent adhesion to metals, glass, ceramics and most plastics.

Durabond™ 455 is a 100% solids, all purpose structural adhesive. Filled with ultra fine active aluminum, Durabond 455 provides the strength required for the most demanding applications.

Resbond™ 989 is a high purity, general purpose, room temperature curing adhesive with excellent adhesion to ceramics, graphite, metals and glass. 989 offers high bond strength and solvent and electrical resistance and can be dispensed automatically for high speed production applications.

Resbond™ 940HT is new, fast setting, Alumina adhesive can be used continuously to 2800ºF. 940HT sets in 15 minutes and cures in 5 minutes at 175ºF.

Duralco™ 128 is highly conductive, ceramic filled, electrically resistant adhesive and potting compound. Just mix, apply and cure at room temperature. 128 is ideal for use in rectifiers, high power devices, semi-conductors, etc.

Duralco™ 4420 is a single component, ceramic filled epoxy. Easy to use. Just apply and heat cure.

Duralco™ 4461 has excellent adhesion to metals, plastics, ceramics and glass, high bond strength, low moisture absorption, high temp. stability, low shrinkage and excellent chemical, electrical and radiation resistance.

Bond-IT™ 7050 is an activated epoxy that incorporates adhesion promoters right into the epoxy’s backbone structure permanently improving the epoxy’s adhesion and bond strength.

Resbond™ 940 is specially formulated with a catalytic activator making it ideal for use in production applications. It has excellent adhesion to ceramics, metals, glass, etc. and provides high electrical, thermal and shock resistance.

Duralco™ 4538 offers the flexibility of silicones and the chemical stability of epoxies.

Duralco™ 4525 offers high bond strength, high temp stability, low moisture absorption, low shrinkage and excellent chemical, electrical and radiation resistance.

Duralco™ 132 is Aluminum metal filled epoxy that cures at room temp to form machinable, thermally conductive bond lines. Duralco 132 offers the maximum conductivity available in a 500ºF epoxy system.

Resbond™ 904 is a smooth, creamy paste that is easily applied and air dries to form a hard surface. 904 is resistant to molten metals, oxidizing and reducing atmospheres, most chemicals and solvents.

Duralco™ 133 is a two component, heat curing, Aluminum filled, Conductive epoxy. Suitable for high temp. tooling and applications requiring machinable repairs. Duralco 133 combines the excellent properties of Duralco 132 with Cotronics higher temperature epoxy system to provide up to 600°F service.