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Creative Materials 124-33(S)

124-33(S) is a solvent resistant flexible electrically conductive adhesive. This product features excellent adhesion to Kapton®, Mylar®, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 124-33(S) include, but are not limited to, electrical attachments for surface mounted devices and heat-sealing openings in emi/rfi enclosures. 124-33(S) is a thermosetting version of 124-33 that is chemical and age resistant.

Features

  • Extremely flexible conductive adhesive

Product Type: Conductive Adhesive

Application Area: Electrical Components

Compatible Substrates & Surfaces: Plastics, Polyimide

Application Method: Screen Coating

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Pot LifeLatent
Conductivity0.0005
Viscosity (HAT, #TA at 10 rpm)18,000 - 22,000cps
FillerSilver
Volume Resistance0.0005Ω-cm
Sheet Resistivity0.2Ω/sq./mil
Hydrolytic StabilityExcellent
Useful Temperature Range-55 to 120ºC
Thermal StabilityGood to 200°C

Regulatory & Compliance

Certifications & Compliance

Safety & Health

Safety & Handling
  • Use with adequate ventilation.
  • Keep away from sparks and open flames.
  • Avoid prolonged contact with skin and breathing of vapors.
  • Wash with soap and water to remove from skin.

Storage & Handling

Shelf Life
2 months at 25°C, 6 months at 5°C, 12 months at -10°C
Suggested Handling & Curing

124-33(S) is ready to use as supplied. Further thinning may be accomplished by adding small amounts of CMI thinner 102-03. Prior to using, be certain to re-suspend silver. Best properties, for most applications, result when dried several minutes at 85°C followed by curing for 5-10 minutes at 175°C. Good properties are obtained on a variety of substrates by curing at temperatures ranging from 110°C to 175°C. Not recommended for applications that cannot cure above 110°C. When used as a sealant, apply adhesive to surfaces to be bonded and dry for several minutes at 85°C, then place substrates together while heating and applying slight pressure and cure. End user is advised to experimentally determine temperature and time best suited for individual applications.