Products

118-43(LPS) is an extremely flexible, pad printable, electrically conductive ink, coating and adhesive suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 118-43(LPS) include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors. 118-43(LPS) is a crosslinking version of 118-43T.Features Extremely flexible electrically conductive ink, ideal for elastomeric and difficult substrates.

128-06(PP) is a pad printable, electrically conductive, medical grade ink, and coating, suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing in both mechanical and electrical stability. Some applications for 128- 06(PP) include, but are not limited to, transdermal drug delivery, ECG electrodes, tens electrodes and muscle stimulator electrodes. 128-06(PP) is a pad printable version of 113-09T.Features Electrode ink

109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound

115-02 is a silver/ silver chloride, based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 115-02 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments, medical electrodes and static elimination. 115-02 is a silver / silver chloride version of 114-50.Features Electrode ink for ECG electrodes

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

126-22 is a pre-catalyzed, solvent-resistant, anisotropic conductive adhesive. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern.Features Solvent resistant epoxy adhesive Ideal for LED bonding

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

127-20 is a two component, pad printable, conductive ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to Polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 127-20 include, but are not limited to, emi/rfi shielding, flexible circuits, and membrane switches.Features Low temp curing, adhesion to difficult substrates

127-48D is a matte finish, flexible, electrically insulating ink and coating suitable for application by screen printing, dipping, and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, polycarbonate, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing. Some applications for 127-48D include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 127-48D is a thermosetting version of 124- 18T.Features Solvent resistant washable dielectric ink ideal for fabrics

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive