Products

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

126-22-F is an anisotropic conductive, solvent-resistant, transferable adhesive film. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern. This product is available in thicknesses from 1 to 5 mils