Products

126-22-F is an anisotropic conductive, solvent-resistant, transferable adhesive film. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern. This product is available in thicknesses from 1 to 5 mils

102-32G1 is a flexible electrically conductive silicone adhesive. 102-32G1 features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of theproduct. Some applications for 102-32G1 include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32G1 is one of the few conductive adhesives that can bond to silicone substrates and surfaces. In addition, it can be bonded to some types of Teflon® surfaces. 102-32G1 features better conductivity than 102-32 when cured at lower temperatures

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

111-27 is an electrically insulating coating and encapsulant suitable for application by spraying, dipping, syringe dispensing, pouring, and screen printing. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing when used as a coating. Some applications for 111-27 include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, environmental and humidity protection of surface mount components, insulating and diffusive layers of LEDs, and membrane switches. 111-27 also protects components from moisture, salts, and abrasion and features a high surface hardness with good toughness which reduces the risk of stress-fracturing bonded components. 111-27 is suitable for UV inspection.Features High dielectric strength coating

122-07-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 122- 07-F include, but are not limited to, die attach bonding, circuit board fabrication, advanced material composites, sealing, and high performance coatings. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils.Features Excellent Thermal Conductivity Easy Liner Release Excellent Chemical Resistance Low Ionics