Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Technologies
- Product Families
- Chemical Structure
- Low warpage
- High adhesion to various substrates
- Hydrophobic
- Thermal stability
Features & Benefits
- CASE Ingredients Features
Applications & Uses
- Markets
- Compatible Polymers & Resins
- RECOMMENDED FORMULATION USE
PEAM-1044 is recommended for use as a base resin. It has excellent adhesion with low stress due to its high Tg DCPD units. The oligomer has good solubility in both aliphatic and aromatic resins. Exceptionally low warpage can be achieved with the addition of polybutadiene type resins.
Properties
- Physical Form
- Appearance
- Amber liquid
- Typical Properties
Value | Units | Test Method / Conditions | |
Viscosity at 25°C (typical) | 4500 | cP | Haake Rheometer |
Functionality | 2 | — | — |
Molecular Weight | 1044 | daltons | — |
Weight Loss at 300°C | max. 3.0 | % | TGA |
Decomposition Temperature | min. 375 | °C | TGA |
Recommended Storage Temp | 10°C or below | °C | — |
Glass Transition Temperature (cured with 2% Dicumyl Peroxide) | -25 (24) | °C | TMA (DMA) |
Coefficient of Thermal Expansion (cured with 2% Dicumyl Peroxide) | α1 93 (α2 225 ) | ppm/°C | TMA |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide -65°C | 2600 | MPa | Rheometrics Rheometer |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 25°C | 55 | MPa | Rheometrics Rheometer |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 150°C | 15 | MPa | Rheometrics Rheometer |