Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Technologies
- Product Families
- Chemical Structure
- High Tg
- High adhesion to various substrates
- Low CTE
- Thermal stability
Features & Benefits
- CASE Ingredients Features
Applications & Uses
- Applications
- RECOMMENDED FORMULATION USE
PEAM-645 is recommended for use as a base resin in adhesive applications or coating applications. The material if used alone can exhibit brittleness and the incorporation of a toughener (such as ABS, or hyperbranched polyester) is recommended. The oligomer has good solubility in both aliphatic and aromatic co-monomers.
Properties
- Physical Form
- Appearance
- Amber liquid
- Typical Properties
Value | Units | Test Method / Conditions | |
Viscosity at 40°C | 5000 | cP | Haake Rheometer |
Functionality | 2 | — | — |
Molecular Weight | 645 | daltons | — |
Weight Loss at 300°C | min. 3.0 | % | TGA |
Decomposition Temperature | max. 375 | °C | TGA |
Recommended Storage Temp | 10°C or below | — | — |
Recommended Storage Temperature | 10 or Below | °C | — |
Glass Transition Temperature (cured with 2% Dicumyl Peroxide) | 160 (183) | °C | TMA (DMA) |
Coefficient of Thermal Expansion (cured with 2% Dicumyl Peroxide) | α1 50 (α2 173) | ppm/°C | TMA |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide -65°C | 4100 | MPa | Rheometrics Rheometer |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 25°C | 3400 | MPa | Rheometrics Rheometer |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 150°C | 1600 | MPa | Rheometrics Rheometer |