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Designer Molecules PEAM-645

Designer Molecules Peam-645 is a polyester acrylate/methacrylate that exhibits low CTE, high Tg, and high modulus. The oligomer has very high thermal stability and low volatility. It can be used as a base resin in a formulation or as an additive. It exhibits good adhesion on various substrates. The oligomer also exhibits good hydrolytic stability. .

Chemical Family: Polyester Acrylates

Features: Improves Adhesion

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Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies
Chemical Structure
  • High Tg 
  • High adhesion to various substrates 
  • Low CTE 
  • Thermal stability

Designer Molecules PEAM-645 Chemical Structure

Features & Benefits

CASE Ingredients Features

Applications & Uses

RECOMMENDED FORMULATION USE

PEAM-645 is recommended for use as a base resin in adhesive applications or coating applications. The material if used alone can exhibit brittleness and the incorporation of a toughener (such as ABS, or hyperbranched polyester) is recommended. The oligomer has good solubility in both aliphatic and aromatic co-monomers.

Properties

Physical Form
Appearance
Amber liquid
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity at 40°C5000cPHaake Rheometer
Functionality2
Molecular Weight645daltons
Weight Loss at 300°Cmin. 3.0%TGA
Decomposition Temperaturemax. 375°CTGA
Recommended Storage Temp10°C or below
Recommended Storage Temperature10 or Below°C
Glass Transition Temperature (cured with 2% Dicumyl Peroxide)160 (183)°CTMA (DMA)
Coefficient of Thermal Expansion (cured with 2% Dicumyl Peroxide)α1 50 (α2 173)ppm/°CTMA
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide -65°C4100MPaRheometrics Rheometer
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 25°C3400MPaRheometrics Rheometer
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 150°C1600MPaRheometrics Rheometer