company tower banner
Envalior Company Logo
ForTii® F11 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It provides an excellent balance of flow, toughness, and stiffness, enabling the production of thin walls or complex geometries in electronics and electrical applications. The material is VDE (Verband der Elektrotechnik) approved for all colors, has a high RTI electrical rating of 140 °C at 0.75 mm, and a CTI rating of 800 V, ensuring thermal and electrical performance. It is phosphorous-free and VDE-certified. The processing technology for this product is injection molding.

Polymer Name: Polyphthalamide (PPA)

Processing Methods: Injection Molding

Fillers Included: Glass Fiber

Flexural Modulus: 11000.0 - 11000.0 MPa

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods
Fuse Holder Application Data

Details

The fuse holder is a vital element in LVSG that protects different electrical loads against short circuit current. The application houses the fuse and facilitates easy assembly or replacement. Herein, the thermoplastic materials from Envalior offer an advantage over traditional materials.

Benefits

  • ForTii® allows the Fuse holder to withstand high temperatures and the material has a high impact resistance
  • Productivity improvement
  • Laser printing
  • Snap fitting
  • DIN rail mounting
Speed Sensor Application Data

Details

Many different sensor types/systems: Hall-, ABS-, Oil-, MAF-, Air Bag-, Throttle- Sensor Crankshaft, Camshaft, ETC, Seat position.

Benefits

  • Stanyl® PA46, ForTii® PA4T, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high toughness levels and good electrical insulation properties
  • Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs
  • ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C
WtB and BtB Connectors Application Data

Details

Performance materials like our Stanyl® and ForTii® are helping manufacturers respond to trends for increased miniaturization (and therefore complexity) inside electronic devices – while also providing a more robust alternative to traditional materials like Liquid Crystal Polymer (LCP). Both Stanyl® and ForTii® are available in halogen and red phosphorous-free grades.

Benefits

  • Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high-heat resistance, a unique balance of high stiffness and good flowability and high strength and creep resistance levels leading to good pin retention
  • Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs
Automotive E-Motor Bobbins Application Data

Details

Stanyl® PA46 also used in connectors, e-motor parts, bobbins, sensors, fuse boxes. Thermoconductive Stanyl XL-T (P968A) in use as well; ForTii® PA4T and Xytron™ PPS also materials to be used in electromotor applications

Benefits

  • Stanyl® PA46 allows for reliable solutions due to a high temperature resistance (UL1446 class H certified) and creep resistance at elevated temperatures, high toughness levels and good electrical insulation properties
  • Stanyl® PA46 allows for cost effective solutions due to a good flowability and processability enabling therefore thin wall designs
  • Xytron™ PPS allows for super high temperatrue resistance for long term.
Positition Sensor Application Data

Details

Many different sensor types/systems: Hall-, ABS-, Oil-, MAF-, Air Bag-, Throttle- Sensor Crankshaft, Camshaft, ETC, Seat position.

Benefits

  • Stanyl® PA46, ForTii® PA4T, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high toughness levels and good electrical insulation properties
  • Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs
  • ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C
Reflow Connectors Application Data

Details

PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption

Benefits

  • Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)
  • ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering
  • Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)
Brushholders (Electro Motors) Application Data

Details

Stanyl® PA46 also used in connectors, e-motor parts, bobbins, sensors, fuse boxes. Thermoconductive Stanyl XL-T (P968A) in use as well; ForTii® PA4T and Xytron™ PPS also materials to be used in electromotor applications

Benefits

  • Stanyl® PA46 allows for reliable solutions due to a high temperature resistance (UL1446 class H certified) and creep resistance at elevated temperatures, high toughness levels and good electrical insulation properties
  • Stanyl® PA46 allows for cost effective solutions due to a good flowability and processability enabling therefore thin wall designs
  • Xytron™ PPS allows for super high temperatrue resistance for long term.
EGR Sensor Application Data

Details

Sensor measures temperature of EGR (exhaust gas recirculation) and verifies function of EGR valve. Max temperature at tip of 300°C.

Benefits

  • ForTii® PA4T and Stanyl® PA46 allow for reliable solutions due to their high melting point of 325 and 295 °C resulting in no deformation at very high sensor tip temperatures and to their resistance to erosion from contamination in the exhaust stream
  • ForTii® PA4T and Stanyl® PA4 allow for cost effective solutions versus PEEK, LCP or other PPA
Endlaminates (Electro Motors) Application Data

Details

Stanyl® PA46 also used in connectors, e-motor parts, bobbins, sensors, fuse boxes. Thermoconductive Stanyl XL-T (P968A) in use as well; ForTii® PA4T and Xytron™ PPS also materials to be used in electromotor applications

Benefits

  • Stanyl® PA46 allows for reliable solutions due to a high temperature resistance (UL1446 class H certified) and creep resistance at elevated temperatures, high toughness levels and good electrical insulation properties
  • Stanyl® PA46 allows for cost effective solutions due to a good flowability and processability enabling therefore thin wall designs
  • Xytron™ PPS allows for super high temperatrue resistance for long term.
Coil Insulation Application Data

Details

Stanyl® PA46 also used in connectors, e-motor parts, bobbins, sensors, fuse boxes. Thermoconductive Stanyl XL-T (P968A) in use as well; ForTii® PA4T and Xytron™ PPS also materials to be used in electromotor applications

Benefits

  • Stanyl® PA46 allows for reliable solutions due to a high temperature resistance (UL1446 class H certified) and creep resistance at elevated temperatures, high toughness levels and good electrical insulation properties
  • Stanyl® PA46 allows for cost effective solutions due to a good flowability and processability enabling therefore thin wall designs
  • Xytron™ PPS allows for super high temperatrue resistance for long term.
High Voltage Connector E-Motor Application Data

Details

Application requirements Electrical insulation High CTI 600 V UL94 V0 halogen-free Thermal cycles/shock resistant Material properties Low moisture uptake Chemical resistant Thermal cycles/fatigue Electric insulative

Benefits

  • Robust (wire load) design
  • Harsh environment
  • Improved lifetime/safety vs PA66/PBT
Reflow Connectors -3 Application Data

Details

PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption

Benefits

  • Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)
  • ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering
  • Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)
HDMI Connectors Application Data

Details

PA4T good flow (> PPA, = LCP) PA4T low moisture absorption

Benefits

  • ForTii® PA4T allows for reliable solutions due to its high melting temperature (ideal for reflow process), high mechanical performance (also after reflow soldering), a high dimensional stability (result from low, isotropic CLTE), a high co-planarity and low warpage after soldering, and good dielectrics due to low moisture uptake
  • ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs
  • ForTii® PA4T allow for even more sustainable solutions with reduced environmental impact due to its lower carbon footprint as compared to alternative materials
Reflow Connectors -2 Application Data

Details

PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption

Benefits

  • Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)
  • ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering
  • Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)
Temperature Sensor Application Data

Details

Many different sensor types/systems: Hall-, ABS-, Oil-, MAF-, Air Bag-, Throttle- Sensor Crankshaft, Camshaft, ETC, Seat position.

Benefits

  • Stanyl® PA46, ForTii® PA4T, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high toughness levels and good electrical insulation properties
  • Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs
  • ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C
Medium Voltage Circuit Breakers Application Data

Details

Most grades are available with halogenfree flameretardancy, and in specific electro-gray color for housings. ForTii® has a Heat Deflection Temperature (HDT) of 305°C .

Benefits

  • ForTii® PA4T allows for more sustainable solutions in end-products due to lower CO₂ footprint as compared to solutions with epoxy Xlink agent
  • ForTii® PA4T allows for potential system cost reduction opportunities due to part integration possibilities , possible thinner wall design withlower profiles possibilities, reduced cycle times with lower production losses
Contactors Application Data

Details

Most grades are available with halogenfree flameretardancy, and in specific electro-gray color for housings. Also Lasermarkable grades are available. ForTii® has a Heat Deflection Temperature (HDT) of 305°C .

Benefits

  • Akulon® PA6 and ForTii® PA4T allow for reliable solutions due to good electrical and thermal endurance
  • Akulon® PA6 and ForTii® PA4T allow for more design freedom and/or potential system cost reductions due to part integration and thinner wall design and lower profiles possibilities, reduced cycle time with lower production losses
Industrial Control Gear Application Data

Details

Most grades are available with halogenfree flameretardancy, and in specific electro-gray color for housings. ForTii® Heat Deflection Temperature (HDT) of 305°C .

Benefits

  • Akulon® PA6 and ForTii® PA4T allow for reliable solutions due to good electrical and thermal endurance
  • Akulon® PA6 and ForTii® PA4T allow for more design freedom and/or potential system cost reductions due to part integration and thinner wall design and lower profiles possibilities, reduced cycle time with lower production losses
Start/Stop: Alternator and Starter Parts Application Data

Details

Stanyl® PA46 also used in connectors, e-motor parts, bobbins, sensors, fuse boxes.

Benefits

  • Stanyl® PA46 allows for reliable solutions due to a high temperature resistance and creep resistance at elevated temperatures, high toughness levels, excellent wear and friction behavior and good electrical insulation properties
  • ForTii® PA4T allows for reliable solutions due to a very high peakt temperature resistance due to its melting point of 325 C
  • Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs
Molded Case Circuit Breakers Application Data

Details

Most grades are available with halogenfree flameretardancy, and in specific electro-gray color for housings.

Benefits

  • Akulon® PA6, Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to up-to 30% improved electrical endurance compared to conventional materials
  • Akulon® PA6, Stanyl® PA46 and ForTii® PA4T allow for more appealing solutions due to enhanced esthetics
  • Akulon® PA6, Stanyl® PA46 and ForTii® PA4T allow for system cost reduction up to 15% compared to thermoset compounds due to potential reduction of wall thicknesses by up to 2/3rd and due to potential part integration possibilities
FPC Connectors Application Data

Details

ForTii® offers a halogen-free alternative for ICT components that enables the latest interface technology with lower power consumption and provides higher efficiency, optimized performance and reduced environmental impact, including a lower carbon footprint vs. existing solutions and full compatibility with lead-free reflow soldering; ForTii® offers a unique balance of high melt temperature (325°C), High glass transition temperature (125°C), high stiffness and very low moisture absorption.

Benefits

  • Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to high stiffness even at elevated lead-free reflow assembly temperatures with hot spots up to 300°C
  • Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to very low warpage levels to minimizing rejects significantly therefore
  • ForTii® PA4T allow for even more sustainable solutions with reduced environmental impact due to its lower carbon footprint as compared to alternative materials
Motor Starter/Overload Relays Application Data

Details

Most grades are available with halogenfree flameretardancy, and in specific electro-gray color for housings. Also Lasermarkable grades are available. ForTii® has a Heat Deflection Temperature (HDT) of 305°C .

Benefits

  • Akulon® PA6, Arnite® PBT, Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to good electrical and thermal endurance
  • Akulon® PA6, Arnite® PBT, Stanyl® PA46 and ForTii® PA4T allow for more design freedom and/or potential system cost reductions due to part integration and thinner wall design and lower profiles possibilities, reduced cycle time with lower production losses
Miniature Circuit Breakers Application Data

Details

As they move away from halogenated thermoplastic and thermoset materials, producers of low voltage switchgear (LVSG) are turning to more environmentally friendly solutions. Manufacturers of miniature circuit breaker enclosures are now using halogen-free flame retardant Polyamide 6 (PA6).

Benefits

  • Akulon® PA6 allows for reliable solutions due to up to 30% improved electrical endurance compared to conventional materials
  • Akulon® PA6 allows for more appealing solutions due to enhanced esthetics
  • Akulon® PA6 allows for system cost reduction up to 15% compared to thermoset compounds due to potential reduction of wall thicknesses by up to 2/3rd and due to potential part integration possibilities
Medium Voltage Circuit Breaker Isolators Application Data

Details

Most grades are available with halogenfree flameretardancy, and in specific electro-gray color for housings. ForTii® has a Heat Deflection Temperature (HDT) of 305°C .

Benefits

  • ForTii® PA4T allows for more sustainable solutions in end-products due to lower CO₂ footprint as compared to solutions with epoxy Xlink agent
  • ForTii® PA4T allows for significant system cost reduction due to lower density up to 17% than conventional materials, part weight reduction up to 35%, cycle time down by factor 7
MCCB Housings Application Data

Details

Most grades are available with halogenfree flameretardancy, and in specific electro-gray color for housings. ForTii® Heat Deflection Temperature (HDT) of 305°C .

Benefits

  • Akulon® PA6 and ForTii® PA4T enable increased design flexibility and integrated functionality, facilitating smart assembly solutions
  • Akulon® PA6 and ForTii® PA4T allow for reliable solutions due to good dielectric aging performance at 150°C and high CTI values at 600 Volts
  • Akulon® PA6 and ForTii® PA4T allow for potential system cost reductions up to 15% ( wall thicknesses reduced leading to a volume reduction of up to 25%) compared to conventional materials
Battery Connectors Application Data

Details

Envalior offers a halogen-free alternative for ICT components that enables the latest interface technology with lower power consumption and provides higher efficiency, optimized performance and reduced environmental impact, including a lower carbon footprint vs. existing solutions and full compatibility with lead-free reflow soldering.

Benefits

  • Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high-heat resistance, a unique balance of high stiffness and good flowability and high strength and creep resistance levels leading to good pin retention
  • Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs
Micro Appliance Connector Application Data

Details

Micro dual locking latch for the application

Benefits

  • Better stiffness and toughness enhance
  • Dual locking latch performance
  • Reduce cracking rate down to 0%
  • Lowering system costs

Properties

Flame Rating
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Modulus11500 / 12000MPaISO 527-1/-2
Tensile Modulus (-40°C)12000 / -MPaISO 527-1/-2
Tensile Modulus (40°C)11300 / -MPaISO 527-1/-2
Tensile Modulus (80°C)10800 / 7600MPaISO 527-1/-2
Tensile Modulus (100°C)10000 / -MPaISO 527-1/-2
Tensile Modulus (120°C)8000 / -MPaISO 527-1/-2
Tensile Modulus (140°C)5700 / *MPaISO 527-1/-2
Tensile Modulus (160°C)5000 / *MPaISO 527-1/-2
Tensile Modulus (Low Thickness, 1mm)10700 / -MPaISO 527-1/-2
Stress at Break150 / 140MPaISO 527-1/-2
Stress at Break (-40°C)175 / -MPaISO 527-1/-2
Stress at Break (40°C)145 / -MPaISO 527-1/-2
Stress at Break (80°C)125 / 85MPaISO 527-1/-2
Stress at Break (100°C)115 / -MPaISO 527-1/-2
Stress at Break (120°C)100 / -MPaISO 527-1/-2
Stress at Break (140°C)80 / *MPaISO 527-1/-2
Stress at Break (160°C)70 / *MPaISO 527-1/-2
Stress at Break, at low thickness160 / -MPaISO 527-1/-2
Stress at Break (Thickness tested)1 / -mmISO 527-1/-2
Strain at Break2 / 1.9%ISO 527-1/-2
Strain at Break (at -40°C)2.2 / -%ISO 527-1/-2
Strain at Break (at 40°C)1.9 / -%ISO 527-1/-2
Strain at Break (at 80°C)1.9 / 2.9%ISO 527-1/-2
Strain at Break (at 100°C)2 / -%ISO 527-1/-2
Strain at Break (at 120°C)2.6 / -%ISO 527-1/-2
Strain at Break (at 140°C)3.3 / *%ISO 527-1/-2
Strain at Break (at 160°C)3.8 / *%ISO 527-1/-2
Strain at Break, at low thickness2.1 / -%ISO 527-1/-2
Strain at Break (Thickness tested)1 / -mmISO 527-1/-2
Flexural Modulus11000 / 11500MPaISO 178
Flexural Modulus (at 80°C)10500 / 7600MPaISO 178
Flexural Modulus (at 120°C)8200 / *MPaISO 178
Flexural Modulus (at 160°C)5000 / *MPaISO 178
Flexural Strength245 / 220MPaISO 178
Flexural Strength (at 80°C)190 / 130MPaISO 178
Flexural Strength (at 120°C)150 / *MPaISO 178
Flexural Strength (at 160°C)100 / *MPaISO 178
Charpy Impact Strength (at +23°C)50 / 50kJ/m²ISO 179/1eU
Charpy Notched Impact Strength (at +23°C)7.5 / 7.5kJ/m²ISO 179/1eA
Weldline Strength (at thickness 4 / * mm)50 / 140MPaISO 527-1/-2
Weldline Strain (at thickness 4 / * mm)0.6 / 1.8%ISO 527-1/-2
Weldline Strength (at thickness 1 / * mm)60 / -MPaISO 527-1/-2
Weldline Strain (at thickness 1 / * mm)0.7 / -%ISO 527-1/-2
Thermal Properties
ValueUnitsTest Method / Conditions
Melting Temperature (10°C/min)325 / *°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)125 / *°CISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)305 / *°CISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)323 / *°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.2 / *E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.3 / *E-4/°CASTM D696
Coefficient of Linear Thermal Expansion (normal)0.65 / *E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)0.35 / *E-4/°CASTM D696
Thermal Conductivity in Plane0.4 / *W/(m K)ASTM E1461
Burning Behaviour (at 1.5 mm Nominal Thickness)UL V-0 / *classIEC 60695-11-10
Burning Behaviour (at 3.0 mm Nominal Thickness)UL V-0 / *classIEC 60695-11-10
Burning Behaviour (at 0.2 mm Thickness h)UL V-0 / *classIEC 60695-11-10
Oxygen Index39 / *%ISO 4589-1/-2
Ball Pressure Temperature305 / *°CIEC 60695-10-2
Glow Wire Flammability Index (at thickness 3 / - mm)960 / -°CIEC 60695-2-12
Glow Wire Flammability Index (at thickness 0.25 / - mm)960 / -°CIEC 60695-2-12
Glow Wire Ignition Temperature (at thickness 3 / - mm)800 / -°CIEC 60695-2-13
Glow Wire Ignition Temperature (at thickness 0.75 / - mm)800 / -°CIEC 60695-2-13
Relative Temperature Index (Electrical, 0.75 / * mm)140 / *°CUL746B
Relative Temperature Index (Electrical, 0.2 / * mm)130 / *°CUL746B
Relative Temperature Index (with impact, 0.35 / * mm)130 / *°CUL746B
Relative Temperature Index (with impact, 3 / * mm)130 / *°CUL746B
Relative Temperature Index (without impact, 0.35 / * mm)130 / *°CUL746B
Relative Temperature Index (without impact, 3 / * mm)130 / *°CUL746B
Thermal Index (2500 hrs)181 / *°CIEC 60216/ISO 527-1/-2
Thermal Index (5000 hrs)170 / *°CIEC 60216/ISO 527-1/-2
Thermal Index (10000 hrs)159 / *°CIEC 60216/ISO 527-1/-2
Thermal Index (20000 hrs)149 / *°CIEC 60216/ISO 527-1/-2
Electrical Properties
ValueUnitsTest Method / Conditions
Relative Permittivity (100Hz)4.2 / 4.2IEC 62631-2-1
Relative Permittivity (1 MHz)3.9 / 3.9IEC 62631-2-1
Relative Permittivity (1GHz)3.8 / 3.9IEC 60250
Relative Permittivity (10GHz)3.8 / 3.9IEC 60250
Dissipation Factor (100 Hz)64 / 64E-4IEC 62631-2-1
Dissipation Factor (1 MHz)176 / 176E-4IEC 62631-2-1
Dissipation Factor (1GHz)130 / 130E-4IEC 60250
Dissipation Factor (10GHz)110 / 130E-4IEC 60250
Volume Resistivity>1E13 / >1E13Ohm*mIEC 62631-3-1
Surface Resistivity- / >1E15OhmIEC 62631-3-2
Electric Strength33 / 33kV/mmIEC 60243-1
Comparative Tracking Index600 / -VIEC 60112
Material Specific Properties
ValueUnitsTest Method / Conditions
Viscosity Number86 / *cm³/gISO 307, 1157, 1628
Other Properties
ValueUnitsTest Method / Conditions
Water Absorption4.1 / *%Sim. to ISO 62
Water Absorption in Water (at 23°C after 24h)0.3 / *%ISO 62
Humidity Absorption1.6 / *%Sim. to ISO 62
Density1460 / -kg/m³ISO 1183
Rheological Properties
ValueUnitsTest Method / Conditions
Molding Shrinkage (parallel)0.35 / *%ISO 294-4
Molding Shrinkage (normal)1.2 / *%ISO 294-4
Spiral Flow Length 1.0 mm 800 bar110 / *mm
Spiral Flow Length 1.0 mm 900 bar120 / *mm
Spiral Flow Length 1.0 mm 1000 bar130 / *mm

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Chemical Resistance
Arrhenius Ageing Tensile Strength

DSM Engineering Materials ForTii F11 Arrhenius Aging Tensile Strength

Dynamic Shear Modulus (G)-Temperature (dry)

DSM Engineering Materials ForTii F11 Dynamic Shear Modulus (G)-Temperature (dry)

Dynamic Tensile Modulus (E)-Temperature (cond.)

DSM Engineering Materials ForTii F11 Dynamic Tensile Modulus (E)-Temperature (cond.)

Dynamic Tensile Modulus (E)-Temperature (dry)

DSM Engineering Materials ForTii F11 Dynamic Tensile Modulus (E)-Temperature (dry)

Specific Volume-Temperature (pvT)

DSM Engineering Materials ForTii F11 Specific Volume-Temperature (pvT)

Stress-Strain (cond.)

DSM Engineering Materials ForTii F11 Stress-Strain (cond.)

Stress-Strain (dry)

DSM Engineering Materials ForTii F11 Stress-Strain (dry)

Viscosity-Shear Rate

DSM Engineering Materials ForTii F11 Viscosity-Shear Rate

Packaging & Availability

Chemical TypeChemical NameResistance
OtherAcetaldehyde (40% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at >140°Cnot resistant
OtherAcetic acid (10% by mass) at 100°Cnot resistant
OtherAcetic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetic acid (95% by mass) at 23°Cnot resistant
OtherAcetic anhydridelimited resistant, tests necessary to verify
KetonesAcetone at 23°Cresistant
OtherAcetonitrileresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Cnot resistant
OtherAcetylene at 23°Cresistant
OtherAcrylic acid at 23°Cnot resistant
OtherAdBlue®resistant
OtherAliphatic amines at 23°Cresistant
OtherAliphatic hydrocarbons at 23°Cresistant
OtherAlkylbenzenes at 23°Cresistant
OtherAllyl alcohol at 23°Climited resistant, tests necessary to verify
OtherAluminum acetate (saturated) at 23°Cresistant
OtherAluminum chloride (10% by mass) at 23°Cresistant
OtherAluminum hydroxide (saturated) at 23°Cresistant
OtherAluminum salts of mineral acids (saturated) at 23°Climited resistant, tests necessary to verify
OtherAluminum trichloride (10% by mass) at 23°Cresistant
OtherAmino acids (saturated) at 23°Cresistant
OtherAmmonia at 23°Cresistant
OtherAmmonium chloride (35% by mass) at 100°Climited resistant, tests necessary to verify
OtherAmmonium chloride (35% by mass) at 23°Cresistant
OtherAmmonium salts of mineral acids (10% by mass) at 23°Cresistant
OtherAmmonium salts of mineral acids (10% by mass) at 50°Climited resistant, tests necessary to verify
OtherAmmonium thiocyanate (saturated) at 23°Cresistant
OtherAmyl acetate at 100°Cnot resistant
OtherAmyl acetate at 23°Cresistant
OtherAmyl alcohol at 23°Cresistant
OtherAniline at 23°Cnot resistant
OtherAnodizing liquid (HNO3/H2SO4) at 23°Climited resistant, tests necessary to verify
OtherAntimony trichoride (saturated) at 23°Cnot resistant
OtherAqua Regia (HCl/HNO3) at 23°Cnot resistant
OtherAromatic hydrocarbons at 23°Cresistant
OtherBariumsalts of mineral acids at 23°Climited resistant, tests necessary to verify
OtherBenzaldehyde at 23°Climited resistant, tests necessary to verify
OtherBenzene at 23°Cresistant
OtherBenzene at 80°Cresistant
OtherBenzoic acid (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherBenzoic acid (saturated) at 23°Cnot resistant
OtherBenzyl alcohol at 23°Climited resistant, tests necessary to verify
OtherBeverages at 23°Cresistant
OtherBleaching agent (NaOCl) at 23°Cnot resistant
OtherBoric acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherBoron trifluoride at 23°Cnot resistant
OtherBrake fluids (DOT 3/4) at 23°Climited resistant, tests necessary to verify
OtherBromine water (saturated) at 23°Cnot resistant
OtherBromochlorodifluoromethane at 23°Cresistant
OtherBromotrifluoromethane at 23°Cresistant
OtherButadiene at 23°Cresistant
OtherButane at 23°Cresistant
OtherButanediols at 23°Cresistant
OtherButanediols at >140°Climited resistant, tests necessary to verify
OtherButanols at 23°Cresistant
OtherButene glycol at 23°Cresistant
OtherButene glycol at >160°Climited resistant, tests necessary to verify
OtherButene-1 at 23°Cresistant
OtherButter at 23°Cresistant
OtherButyl acetate at 23°Cresistant
OtherButyl acrylate at 23°Cresistant
OtherButyl glycolate at 23°Cresistant
OtherButyl phthalate at 23°Cresistant
OtherButyric acid (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherButyrolactone at 23°Cresistant
OtherButyrolactone at >90°Climited resistant, tests necessary to verify
OtherCalcium chloride (10% by mass) at 100°Climited resistant, tests necessary to verify
OtherCalcium chloride (10% by mass) at 23°Cresistant
OtherCalcium chloride (alcoholic) (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherCalcium chloride (saturated) at 100°Cnot resistant
OtherCalcium chloride (saturated) at 23°Cresistant
OtherCalcium chloride (saturated) at 60°Climited resistant, tests necessary to verify
OtherCalcium hydroxide (saturated) at 23°Cresistant
OtherCalcium hypochloride (saturated) at 23°Cnot resistant
OtherCamphor (alcoholic) (50% by mass) at 23°Cresistant
OtherCaprolactam (50% by mass) at 23°Cresistant
OtherCaprolactam (50% by mass) at >150°Climited resistant, tests necessary to verify
OtherCarbon disulfide at 23°Cresistant
OtherCarbon disulfide at 60°Cnot resistant
OtherCarbon tetrachloride at 23°Cresistant
OtherCasein at 23°Cresistant
OtherChloral hydrate at 23°Cnot resistant
OtherChloramines (10% by mass) at 23°Cnot resistant
OtherChlorinated biphenyls at 80°Climited resistant, tests necessary to verify
OtherChlorine water at 23°Cnot resistant
OtherChloroacetic acid (10% by mass) at 23°Cnot resistant
OtherChlorobenzene at 23°Cresistant
OtherChlorobenzene at 50°Cresistant
OtherChlorobromomethane at 23°Climited resistant, tests necessary to verify
OtherChlorodifluoroethane at 23°Cresistant
OtherChlorodifluoromethane at 23°Cresistant
OtherChlorofluoroethylene at 23°Cresistant
OtherChloroform at 23°Cnot resistant
OtherChlorosulfonic acid (10% by mass) at 23°Cnot resistant
OtherChromic acid (1% by mass) at 23°Climited resistant, tests necessary to verify
OtherChromic acid (10% by mass) at 23°Cnot resistant
OtherChromyl chloride at 23°Cnot resistant
Othercis-2-butene at 23°Cresistant
OtherCitric acid (10% by mass) at 23°Cresistant
OtherCitric acid (20% by mass) at 80°Climited resistant, tests necessary to verify
OtherCobalt salt (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherCopper sulfate (10% by mass) at 23°Cresistant
OtherCopper(II) salt (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherCresols at 23°Cnot resistant
OtherCycloalcohols (incl their esters) at 23°Cresistant
OtherCycloalkanes at 23°Cresistant
OtherCycloalkanones at 23°Cresistant
OtherCyclohexanol at 23°Climited resistant, tests necessary to verify
OtherDecalin at 23°Cresistant
OtherDeveloper (photografic) at 23°Cresistant
OtherDibutyl phthalate at 23°Cresistant
OtherDibutyl phthalate at 60°Cresistant
OtherDichlorobenzene at 23°Cresistant
OtherDichloroethane at 23°Cresistant
OtherDichloroethylene at 23°Cresistant
OtherDichlorofluoromethane at 23°Cresistant
OtherDichlorotetrafluoroethane at 23°Cresistant
EthersDiethyl ether at 23°Cresistant
OtherDiethylene glycol at 23°Cresistant
OtherDiethylene glycol at >140°Cnot resistant
OtherDifluoromethane at 23°Cresistant
OtherDimethyl acetamide at 23°Cresistant
OtherDimethyl acetamide at >150°Cnot resistant
OtherDimethyl ether at 23°Cresistant
OtherDimethylamine at 23°Cresistant
OtherDimethylformamide at 23°Cresistant
OtherDimethylformamide at 90°Climited resistant, tests necessary to verify
OtherDimethylsilane at 23°Cresistant
OtherDimethylsulfoxide at 125°Cnot resistant
OtherDimethylsulfoxide at 23°Cresistant
OtherDioctyl phtalate at 23°Cresistant
OtherDioxan at 23°Cresistant
OtherDioxan at 60°Cresistant
OtherDiphenyl ether at 80°Cresistant
OtherDipropyl ether at 23°Cresistant
OtherEdible fats waxes and oils at 100°Cresistant
OtherElectroplating bath (acidic) at 23°Cnot resistant
OtherElectroplating bath (alkali) at 23°Cresistant
OtherEthane at 23°Cresistant
AlcoholsEthanol at 23°Cresistant
OtherEthyl Acetate at 23°Cresistant
OtherEthyl chloride at 23°Cresistant
OtherEthylbenzen at 23Cresistant
OtherEthylene at 23°Cresistant
OtherEthylene carbonate at 100°Cnot resistant
OtherEthylene carbonate at 50°Cresistant
OtherEthylene chlorohydrin at 23°Climited resistant, tests necessary to verify
OtherEthylene glycol at 100°Cnot resistant
OtherEthylene glycol at 23°Cresistant
OtherEthylene oxide at 23°Cresistant
OtherEthylene oxide at >80°Cnot resistant
OtherEthylenediamine at 23°Cresistant
OtherFatty acids at 23°Cresistant
OtherFatty alcohols at 23°Cresistant
OtherFerric chloride (2,5% by mass) at 100°Cnot resistant
OtherFerric chloride (2,5% by mass) at 23°Climited resistant, tests necessary to verify
OtherFixer (photografic) at 23°Cresistant
OtherFluorinated hydrocarbons at 70°Cresistant
OtherFluorine at 23°Cnot resistant
OtherFormaldehyde (30% by mass) at 23°Cresistant
OtherFormamide at 23°Cresistant
OtherFormamide at >150°Cnot resistant
OtherFormic acid (10% by mass) at 23°Cnot resistant
OtherFormic acid (10% by mass) at 50°Cnot resistant
OtherFruit juices at 23°Cresistant
OtherFuel; Diesel at 85°Cresistant
OtherFuel; FAM 1A at 23°Cresistant
OtherFuel; FAM 2A at 23°Cresistant
OtherFuel; Gasoline at 85°Cresistant
OtherFuel; LPG at 23°Cresistant
OtherFurfural at 23°Cresistant
OtherFurfuryl alcohol at 23°Cresistant
OtherGlucose at 23°Cresistant
OtherGlycerol at 170°Cresistant
OtherGlycerol at 23°Cresistant
OtherGlycol-water 50/50 mixtureresistant
OtherGlycolic acid (30% by mass) at 23°Cresistant
OtherGlycols at 23°Cresistant
OtherGrease (based on ester oils) at <100°Cresistant
OtherGrease (based on metal soaps) at <100°Cresistant
OtherGrease (based on polyphenylester) at <100°Cresistant
OtherHardening oils at 23°Cresistant
OtherHeating oils at 23°Cresistant
OtherHeptane at 23°Cresistant
OtherHexachlorobenzene at 80°Cresistant
OtherHexachloroethane at 23°Cresistant
OtherHexafluoroisopropanol at 23°Cnot resistant
OtherHexane at 23°Cresistant
OtherHydraulic fluids at 100°Cresistant
OtherHydrobromic acid (10% by mass) at 23°Cnot resistant
OtherHydrochloric acid (10% by mass) at 23°Cnot resistant
OtherHydrochloric acid (20% by mass) at 23°Cnot resistant
OtherHydrochloric acid (conc.% by mass) at 23°Cnot resistant
OtherHydrofluoric acid (40% by mass) at 23°Cresistant
OtherHydrofluoric acid (5% by mass) at 23°Cnot resistant
OtherHydrogen at 23°Cresistant
OtherHydrogen peroxide (0.5% by mass) at 23°Climited resistant, tests necessary to verify
OtherHydrogen peroxide (1% by mass) at 23°Cnot resistant
OtherHydrogen peroxide (3% by mass) at 23°Cnot resistant
OtherHydrogen peroxide (30% by mass) at 23°Cnot resistant
OtherHydrogen sulfide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherHydroiodic acid at 23°Cnot resistant
OtherHydroquinone (5% by mass) at 23°Cnot resistant
OtherImpregnating oils at 23°Cresistant
OtherInk at 23°Cresistant
OtherIodine (alcoholic) at 23°Cnot resistant
OtherIron(III)chloride (acidic) (10% by mass) at 23°Cnot resistant
OtherIron(III)chloride (neutral) (10% by mass) at 23°Cresistant
OtherIron(III)chloride (saturated) at 23°Cnot resistant
OtherIron(III)thiocyanate (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherIsocyanates (aromatic) at 23°Cresistant
OtherIsooctane at 80°Cresistant
OtherIsopropanol at 23°Cresistant
OtherIsopropanol at 60°Cresistant
OtherKeroseneresistant
OtherKetones (aliphatic) at 23°Cresistant
OtherLactic acid at 10°Cresistant
OtherLactic acid at 90°Cnot resistant
OtherLead acetate (10% by mass) at 23°Cresistant
OtherLinseed oil at 23°Cresistant
OtherLithium bromide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherLithium chloride (20% by mass) at 23°Cnot resistant
OtherLithium hydroxide (10% by mass) at 23°Cresistant
OtherLithium hydroxide (10% by mass) at 80°Cnot resistant
OtherLubricating oil (gear) at <130°Cresistant
OtherLubricating oil (hydraulics) at <130°Cresistant
OtherLubricating oil (transformers) at <130°Cresistant
OtherMagnesium hydroxide (10% by mass) at 23°Cresistant
OtherMagnesium salts (10% by mass) at 23°Cresistant
OtherMaleic acid (25% by mass) at 23°Climited resistant, tests necessary to verify
OtherMaleic acid (saturated) at 23°Cresistant
OtherManganese salts (10% by mass) at 23°Cresistant
OtherMercury at 23°Cresistant
OtherMercury(II)chloride (saturated) at 23°Cnot resistant
OtherMethane at 23°Cresistant
AlcoholsMethanol at 23°Cresistant
OtherMethyl acetate at 23°Cresistant
OtherMethyl chloride at 23°Cresistant
OtherMethyl ethyl ketone at 23°Cresistant
OtherMethyl formate at 23°Cresistant
OtherMethyl glycol at 23°Cresistant
OtherMethylamine at 23°Cresistant
OtherMethylaniline at 23°Cresistant
OtherMethylbromide at 23°Cresistant
OtherMethylene chloride at 23°Climited resistant, tests necessary to verify
OtherMethylpyrrolidone at 23°Cresistant
OtherMilk at 23°Cresistant
Othern-Butyl ether at 23°Cresistant
Othern-Butyl glycol at 23°Cresistant
OtherNaphtha at 23°Cresistant
OtherNaphthalene at 23°Cresistant
OtherNaphthalenesulfonic acids at 23°Cnot resistant
OtherNaphthenic acids at 23°Cresistant
OtherNaphthols at 23°Cnot resistant
OtherNickel nitrate (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherNickel salts (10% by mass) at 23°Cresistant
OtherNitric acid (10% by mass) at 23°Cnot resistant
OtherNitric acid (2% by mass) at 23°Cnot resistant
OtherNitric acid (20% by mass) at 23°Cnot resistant
OtherNitric acid (conc.% by mass) at 23°Cnot resistant
OtherNitrobenzene at 23°Climited resistant, tests necessary to verify
OtherNitrobenzene at >100°Cnot resistant
OtherNitrocellulose lacquers (alcoholic) at 23°Climited resistant, tests necessary to verify
OtherNitrocellulose lacquers (non-alcoholic) at 23°Cresistant
OtherNitrogen oxides at 23°Climited resistant, tests necessary to verify
OtherNitromethane at 23°Climited resistant, tests necessary to verify
OtherNitropropane at 23°Climited resistant, tests necessary to verify
OtherNitrotoluene at 23°Climited resistant, tests necessary to verify
OtherNitrotoluene at >100°Cnot resistant
OtherNitrous fumes at 23°Climited resistant, tests necessary to verify
OtherNitrous oxide at 23°Cresistant
OtherOctane at 23°Cresistant
OtherOctene at 23°Cresistant
OtherOil (Shell 10W40) at 23°Cresistant
OtherOil (transformers, switchgear) at 50°Cresistant
OtherOils (vegatable, mineral, ethereal) at 23°Cresistant
OtherOleic acid at 23°Cresistant
OtherOleum (H2SO4+SO3) at 23°Cnot resistant
OtherOxalic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherOxalic acid (10% by mass) at 80°Cnot resistant
OtherOzone at 23°Cnot resistant
OtherPaint solvents at 23°Cresistant
OtherPalmatic acid at 80°Cresistant
OtherParaffin at 23°Cresistant
OtherPeracetic acid at 23°Cnot resistant
OtherPerchloric acid (10% by mass) at 23°Cnot resistant
OtherPetroleum at 23°Cresistant
OtherPetroleum ether and solvents at 80°Cresistant
OtherPhenol (alc. sol.) (70% by mass) at 23°Climited resistant, tests necessary to verify
OtherPhenol (conc.% by mass) at 23°Cnot resistant
OtherPhenol at >40°Cnot resistant
OtherPhenyl ether at 23°Cnot resistant
OtherPhenyl ethyl alcohol at 23°Climited resistant, tests necessary to verify
OtherPhenyl ethyl alcohol at >160°Cnot resistant
OtherPhosphate sol. (neutral, alkaline) (10% by mass) at 23°Cresistant
OtherPhosphine at 23°Cresistant
OtherPhosphoric acid (10% by mass) at 23°Cnot resistant
OtherPhosphoric acid (conc.% by mass) at 23°Cnot resistant
OtherPhthalic acid (saturated) at 23°Climited resistant, tests necessary to verify
OtherPolyols at 23°Cresistant
OtherPotassium bromide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherPotassium chlorate (7% aquous solution) at 23Cnot resistant
OtherPotassium chloride (10% by mass) at 23°Cresistant
OtherPotassium chloride (10% by mass) at 70°Cresistant
OtherPotassium dichromate (5% by mass) at 23°Climited resistant, tests necessary to verify
OtherPotassium hydroxide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherPotassium nitrate (10% by mass) at 23°Cresistant
OtherPotassium permanganate (1% by mass) at 23°Cnot resistant
OtherPotassium thiocyanate (saturated) at 23°Cnot resistant
OtherPropane at 23°Cresistant
OtherPropanol at 23°Cresistant
OtherPropanol at >100°Cnot resistant
OtherPropene at 23°Cresistant
OtherPropionic acid (5% by mass) at 23°Cresistant
OtherPropionic acid (50% by mass) at 23°Cnot resistant
OtherPyridine at 23°Cresistant
OtherPyridine at 80°Climited resistant, tests necessary to verify
OtherPyrocatechol at 23°Cnot resistant
OtherPyrrolidone at 23°Cresistant
OtherPyruvic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherRainwater (acidic) at 23°Cresistant
OtherRefrigerator oil at 23°Cresistant
OtherResorcinol (alcoholic) (1% by mass) at 23°Cnot resistant
OtherRoad salts at 23°Cresistant
OtherSalicylic acid (saturated) at 23°Cresistant
OtherSeawater at 23°Cresistant
OtherSilane at 23°Cresistant
OtherSilicone oils at <80°Cresistant
OtherSilicone oils at >100°Climited resistant, tests necessary to verify
OtherSilver nitrate (10% by mass) at 23°Cresistant
OtherSoap solution (10% by mass) at 80°Cresistant
OtherSodium bichromate (10% by mass) at 23°Cresistant
OtherSodium bichromate (5% by mass) at 23°Cresistant
OtherSodium bromide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium cabonate (20% by mass) at 100°Climited resistant, tests necessary to verify
OtherSodium carbonate (10% by mass) at 23°Cresistant
OtherSodium chlorate (10% by mass) at 23°Cresistant
OtherSodium chloride (10% by mass) at 23°Cresistant
OtherSodium chloride (saturated) at 23°Cresistant
OtherSodium chlorite (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium cyanide (10% by mass) at 23°Cresistant
OtherSodium dichromate (10% by mass) at 23°Cresistant
OtherSodium dodecylbenzenesulfonate at 23°Cresistant
OtherSodium hydrogen carbonate (10% by mass) at 23°Cresistant
OtherSodium hydrogen sulfate (10% by mass) at 23°Cresistant
OtherSodium hydrogen sulfite (10% by mass) at 23°Cresistant
OtherSodium hydroxide (10% by mass) at 23°Cresistant
OtherSodium hydroxide (10% by mass) at 80°Cnot resistant
OtherSodium hydroxide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium hypochlorite (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium hypophosphite (10% by mass) at 23°Cresistant
OtherSodium lauryl sulfate (30% by mass) at 23°Cresistant
OtherSodium lignosulfonate at 23°Cresistant
OtherSodium nitrilotriacetate (10% by mass) at 23°Cresistant
OtherSodium oleate at 23°Cresistant
OtherSodium pentachlorophenolate at 23°Cresistant
OtherSodium pyrosulfite (10% by mass) at 23°Cresistant
OtherSodium salts (nitrate, sulfate) (10% by mass) at 23°Cresistant
OtherStearate at 23°Cresistant
OtherStearic acid at 23°Cresistant
OtherStyrene at 80°Cresistant
OtherSulfonates (10% by mass) at 23°Cresistant
OtherSulfur at 23°Cresistant
OtherSulfur dioxide (dry) at 23°Cresistant
OtherSulfur dioxide (moist) at 23°Climited resistant, tests necessary to verify
OtherSulfur hexafluoride at 23°Cresistant
OtherSulfuric acid (2% by mass) at 23°Cnot resistant
OtherSulfuric acid (30% by mass) at 23°Cnot resistant
OtherSulfuric acid (50% by mass) at 23°Cnot resistant
OtherSulfuric acid (conc.% by mass) at 23°Cnot resistant
OtherSulfurous acid (saturated) at 23°Climited resistant, tests necessary to verify
OtherTartaric acid (10% by mass) at 23°Cresistant
OtherTartaric acid (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherTetrachloroethylene at 23°Climited resistant, tests necessary to verify
OtherTetrachloroethylene at 80°Cnot resistant
OtherTetrachloromethane at 23°Cresistant
OtherTetrafluoromethane at 23°Cresistant
OtherTetrafluoropropanol at 23°Cnot resistant
OtherTetrahydrofuran at 23°Cresistant
OtherTetralin at 23°Cresistant
OtherTetramethylenesulfone at 23°Cresistant