ForTii® has unique PPA technology with high amide density.
The ForTii® platform includes polymers that are the highest crystalline, highest melting point and highest glass transition temperature among all PPA resulting in:
Identification
Features & Benefits
Applications & Uses
ForTii® is a PPA with high mechanical properties and good chemical resistance. The ForTii® grades have a melting temperature of 325°C and a glass transition temperature of 125°C.
Key Properties:
Superior Mechanical Performance at Elevated Temperatures
The aromatic structure of ForTii® combined with our unique C4 chemistry results in a polymer with a very high melting point of 325°C, complete with high stiffness across a wide temperature range. This in turn makes the heat distortion temperature for ForTii® grades among the best in the industry.
Vs. Metal:
ForTii® can replace metal at just 50% of the weight over a wide range of temperatures with no compromise on performance. With the highest stiffness to density ratio at elevated temperatures, ForTii® Ace brings the most critical metal replacement opportunities within reach.
Vs. PPA
PPA is already a well-known material in metal replacement. The base chemistry of our ForTii® MX series adds additional performance vs. standard PPAs at temperatures above Tg. If you need best in class mechanical performance, the ForTii® Ace MX series, with superior mechanical performance and chemical resistance, is what you are looking for.
Vs. PA6 & PA66
PA6 and PA66 are versatile materials for metal replacement opportunities. When mechanics at elevated temperatures (up to 150°C) are needed or the influence of moisture at moderate temperatures should be limited, DSM’s PPA ForTii® portfolio meets both challenges. ForTii® Ace with a Tg of 160°C, gives superior mechanical performance even after conditioning, for example 85%RH at 85°C. This enables engineers to realize new metal replacement opportunities are not possible with PA6, PA66 or standard PPA.
Reflow Soldering for Surface Mount Technology (SMT)
In the consumer market, there is a focus on producing smaller and lighter products with more functionality. The miniaturization of electromechanical components, like connectors and sensors, requires reflow soldering technologies since the contact pitch is so small. This causes a need for materials that can resist high temperatures up to 280°C. ForTii® solves this challenge thanks to its combination of high melt temperature (325°C) and low moisture absorption – which means that ForTii® grades perform very well in SMT applications up to peak temperatures of 288°C. Deformation is minimal, and ForTii® makes it far easier for designers to predict the warpage.
DSM’s Fortii® PPA portfolio offers a full range of reflow capable materials, ranging from HB grades to flame retardant V0 grades with full UL listing. With V0 grades DSM ForTii® ensures higher than JEDEC MSL 2 ratings on all connector and components designs. This implies a one-year shelf life without packaging.
With HB grades, Fortii® and ForTii® Ace can achieve the best moisture sensitivity level (MSL1) acc. IPC/JEDEC J-STD 020D for SMT. This implies unlimited shelf life without packaging. While offering the benefit of high mechanical and electrical performance of the PPA, DSM's Fortii® and ForTii® Ace offer a blistering resistance almost as good as an LCP material.
Where ForTii® MX1 - MX3 brings on par chemical resistance to best-in-class PPA materials, DSM’s ForTii® Ace portfolio adds an additional step-up in chemical performance. For highest chemical stability, DSM has developed a broad portfolio in ForTii® Ace, which includes injection moldable grades in 30%, 40% and 50% glass fiber.
Creep
Vs. Metal
Whether you intend to convert your current metal design into plastic to achieve weight reduction up to 50% or you want to reduce cost by eliminating compression limiters or threaded inserts, the excellent creep performance of ForTii® Ace brings new metal replacement opportunities within reach. ForTii® Ace gives optimal creep performance over a wide range of temperatures.
Vs. PPA & PA66
Compared to PA66, DSM’s PPA ForTii® brings a significant advantage in terms of creep performance. ForTii® outperforms low-Tg PPA materials (eg PA6T/66) and can match high Tg competitor PPAs (eg PA6T/6I). The increased performance of ForTii® Ace provides additional creep performance at elevated temperatures up to 150°C or even in presence of moisture at lower temperatures.
Vs. Thermoset materials
Thermoset materials are known for their good chemical resistance as well as their stability under creep loading. With ForTii® Ace we provide engineers the possibility to rethink their thermoset designs into thermoplastic material solutions. Robust processing of ForTii® Ace brings better yield rates within reach, providing direct economic benefits.
