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ForTii® F81 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It combines good flowability with mechanical performance, and it is certified as V0 (highest flame retardancy rating) in all colors down to a thickness of 0.35 mm. The processing technology for this product is injection molding, and it offers the special features of being 15% glass-reinforced, electro-friendly, and free of red phosphorus.

Polymer Name: Polyphthalamide (PPA)

Processing Methods: Injection Molding

Fillers Included: Glass Fiber

Flexural Modulus: 7000.0 - 7000.0 MPa

Technical Data Sheet
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Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods

Properties

Flame Rating
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Modulus7000 / 7000MPaISO 527-1/-2
Stress at Break105 / 110MPaISO 527-1/-2
Strain at Break2 / 2.1%ISO 527-1/-2
Flexural Modulus7000 / 7000MPaISO 178
Flexural Strength180 / 175MPaISO 178
Charpy Impact Strength (at +23°C)30 / 30kJ/m²ISO 179/1eU
Charpy Notched Impact Strength (at +23°C)7 / 7kJ/m²ISO 179/1eA
Thermal Properties
ValueUnitsTest Method / Conditions
Melting Temperature (10°C/min)325 / *°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)125 / *°CISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)300 / *°CISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)320 / *°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.4 / *E-4/°CASTM D696
Coefficient of Linear Thermal Expansion (normal)0.55 / *E-4/°CASTM D696
Burning Behaviour (at 1.5 mm Nominal Thickness)UL V-0 / *classIEC 60695-11-10
Burning Behaviour (at 3.0 mm Nominal Thickness)UL V-0 / *classIEC 60695-11-10
Ball Pressure Temperature300 / *°CIEC 60695-10-2
Glow Wire Flammability Index (at thickness 0.35 / - mm)960 / -°CIEC 60695-2-12
Glow Wire Flammability Index (at thickness 3 / - mm)960 / -°CIEC 60695-2-12
Glow Wire Ignition Temperature (at thickness 0.35 / - mm)775 / -°CIEC 60695-2-13
Glow Wire Ignition Temperature (at thickness 0.75 / - mm)750 / -°CIEC 60695-2-13
Electrical Properties
ValueUnitsTest Method / Conditions
Electric Strength33 / -kV/mmIEC 60243-1
Comparative Tracking Index600 / -VIEC 60112
Other Properties
ValueUnitsTest Method / Conditions
Water Absorption5.2 / *%Sim. to ISO 62
Humidity Absorption2 / *%Sim. to ISO 62
Density1340 / -kg/m³ISO 1183
Rheological Properties
ValueUnitsTest Method / Conditions
Molding Shrinkage (parallel)0.5 / *%ISO 294-4
Molding Shrinkage (normal)1.2 / *%ISO 294-4
Spiral Flow Length 1.0 mm 1000 bar140 / *mm

Regulatory & Compliance

Certifications & Compliance
Quality Standards

Technical Details & Test Data

Chemical Resistance
Stress-Strain (dry)

DSM Engineering Materials ForTii F81 Stress-Strain (dry)

Machinery for Injection Molding

ForTii® grades can be processed on general injection molding machines.
Screw Geometry

  • Typically 3-zone screw designs with volumetric compression ratios of approximately 2.5 work fine.

Steel Type

  • Corrosive- and abrasive-resistant steel types which are generally used for glass fiber reinforced, halogen-free FR, high temperature, polyamide materials are also to be used for the ForTii® grades in tools, nozzles and screws.
  • Failing to do so may result in wear and/or corrosion, especially of the screw/barrel (due to the high temperatures involved there), which can lead to decreasing processing performance.
  • Suitable corrosive- and abrasive-resistant steel types are generally powder metallurgical steels containing typically more than 13% of chrome and a HRC value of 55 or higher. Furthermore, a carbide or other type of protective coating is often applied. Examples of suitable steel types for ForTii® grades are Bohler M390 or CPM 420V/590V. More detailed information on this topic is available in Envalior's leaflet "Steel recommendations for molds, screws & barrels".
  • Injection molding equipment suppliers will also have their own codings for suitable steel types. It is recommended in all cases to contact the technical service department of your injection molding equipment supplier for their specific steel type coding, using the steel requirements mentioned above.

Nozzle Temperature Control

  • Due to the combination of the typical high melting temperature of ForTii® and consequently its high processing temperature, it is necessary to have a good temperature control for the nozzle. The use of an open nozzle or, even better, a reversed tapered nozzle with good temperature control and an independently-controlled thermocouple nearby the tip and heater bands with sufficient output is recommended.
  • The nozzle temperature should be set as high as possible to prevent a cold slug, yet low enough to prevent  excessive drool.

Venting Design

  • A good venting design is crucial for good molding behavior (easy filling) and low outgassing/mold deposit. Blocked vents can lead to incomplete parts and/or burning at the end of the flow path (diesel effect).
  • It is recommended to use venting on all inserts (explosive venting) and also on the runner system. Use decreased injection speeds during filling in order to make the venting as effective as possible.

Hot Runner Layout

  • The fast crystallization of ForTii® asks for specific hot runner design rules. For more details, there is also a special hot runner flyer available for all ForTii® grades. Please contact your Envalior sales or check our websites.
  • Try to achieve a close contact with your hot runner supplier and Envalior as the material supplier, to ensure that the right hot runner system is chosen.
  • When processing ForTii® with hot runners, keep in mind these basic rules:
  1. Central bushing heated separately
  2. Only use external heated system
  3. Manifold heated from both sides
  4. Tip with thermocouple in front (near gate)
  5. Very accurate temperature control in the gate area
Temperature Settings For Injection Molding

Mold Temperature

  • ForTii® can be used with a wide range of tool temperatures (80 - 150°C / 176 - 302°F). However, to achieve optimal mechanical properties and stable dimensional parts with optimal surface quality, it is recommended to apply a tooling temperature above the glass transition temperature (Tg) of ForTii® (125°C / 257°F), preferably 140°C/284°F.

Barrel Temperature

  • Due to the high melting point of ForTii® this temperature should be set high enough to provide a homogeneous melt without getting too near to the degradation temperature of 350°C / 662°F. A flat or rising temperature profile is recommended. Optimal settings are governed by barrel size and residence time. Furthermore, the temperature settings for small parts/machines can typically be 5-10°C lower to avoid excessive outgassing/mold deposit.

ForTii® F81 - Temperature Settings For Injection Molding

Chemical TypeChemical NameResistance
OtherAcetaldehyde (40% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at >140°Cnot resistant
OtherAcetic acid (10% by mass) at 100°Cnot resistant
OtherAcetic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetic acid (95% by mass) at 23°Cnot resistant
OtherAcetic anhydridelimited resistant, tests necessary to verify
KetonesAcetone at 23°Cresistant
OtherAcetonitrileresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Cnot resistant
OtherAcetylene at 23°Cresistant
OtherAcrylic acid at 23°Cnot resistant
OtherAdBlue®resistant
OtherAliphatic amines at 23°Cresistant
OtherAliphatic hydrocarbons at 23°Cresistant
OtherAlkylbenzenes at 23°Cresistant
OtherAllyl alcohol at 23°Climited resistant, tests necessary to verify
OtherAluminum acetate (saturated) at 23°Cresistant
OtherAluminum chloride (10% by mass) at 23°Cresistant
OtherAluminum hydroxide (saturated) at 23°Cresistant
OtherAluminum salts of mineral acids (saturated) at 23°Climited resistant, tests necessary to verify
OtherAluminum trichloride (10% by mass) at 23°Cresistant
OtherAmino acids (saturated) at 23°Cresistant
OtherAmmonia at 23°Cresistant
OtherAmmonium chloride (35% by mass) at 100°Climited resistant, tests necessary to verify
OtherAmmonium chloride (35% by mass) at 23°Cresistant
OtherAmmonium salts of mineral acids (10% by mass) at 23°Cresistant
OtherAmmonium salts of mineral acids (10% by mass) at 50°Climited resistant, tests necessary to verify
OtherAmmonium thiocyanate (saturated) at 23°Cresistant
OtherAmyl acetate at 100°Cnot resistant
OtherAmyl acetate at 23°Cresistant
OtherAmyl alcohol at 23°Cresistant
OtherAniline at 23°Cnot resistant
OtherAnodizing liquid (HNO3/H2SO4) at 23°Climited resistant, tests necessary to verify
OtherAntimony trichoride (saturated) at 23°Cnot resistant
OtherAqua Regia (HCl/HNO3) at 23°Cnot resistant
OtherAromatic hydrocarbons at 23°Cresistant
OtherBariumsalts of mineral acids at 23°Climited resistant, tests necessary to verify
OtherBenzaldehyde at 23°Climited resistant, tests necessary to verify
OtherBenzene at 23°Cresistant
OtherBenzene at 80°Cresistant
OtherBenzoic acid (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherBenzoic acid (saturated) at 23°Cnot resistant
OtherBenzyl alcohol at 23°Climited resistant, tests necessary to verify
OtherBeverages at 23°Cresistant
OtherBleaching agent (NaOCl) at 23°Cnot resistant
OtherBoric acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherBoron trifluoride at 23°Cnot resistant
OtherBrake fluids (DOT 3/4) at 23°Climited resistant, tests necessary to verify
OtherBromine water (saturated) at 23°Cnot resistant
OtherBromochlorodifluoromethane at 23°Cresistant
OtherBromotrifluoromethane at 23°Cresistant
OtherButadiene at 23°Cresistant
OtherButane at 23°Cresistant
OtherButanediols at 23°Cresistant
OtherButanediols at >140°Climited resistant, tests necessary to verify
OtherButanols at 23°Cresistant
OtherButene glycol at 23°Cresistant
OtherButene glycol at >160°Climited resistant, tests necessary to verify
OtherButene-1 at 23°Cresistant
OtherButter at 23°Cresistant
OtherButyl acetate at 23°Cresistant
OtherButyl acrylate at 23°Cresistant
OtherButyl glycolate at 23°Cresistant
OtherButyl phthalate at 23°Cresistant
OtherButyric acid (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherButyrolactone at 23°Cresistant
OtherButyrolactone at >90°Climited resistant, tests necessary to verify
OtherCalcium chloride (10% by mass) at 100°Climited resistant, tests necessary to verify
OtherCalcium chloride (10% by mass) at 23°Cresistant
OtherCalcium chloride (alcoholic) (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherCalcium chloride (saturated) at 100°Cnot resistant
OtherCalcium chloride (saturated) at 23°Cresistant
OtherCalcium chloride (saturated) at 60°Climited resistant, tests necessary to verify
OtherCalcium hydroxide (saturated) at 23°Cresistant
OtherCalcium hypochloride (saturated) at 23°Cnot resistant
OtherCamphor (alcoholic) (50% by mass) at 23°Cresistant
OtherCaprolactam (50% by mass) at 23°Cresistant
OtherCaprolactam (50% by mass) at >150°Climited resistant, tests necessary to verify
OtherCarbon disulfide at 23°Cresistant
OtherCarbon disulfide at 60°Cnot resistant
OtherCarbon tetrachloride at 23°Cresistant
OtherCasein at 23°Cresistant
OtherChloral hydrate at 23°Cnot resistant
OtherChloramines (10% by mass) at 23°Cnot resistant
OtherChlorinated biphenyls at 80°Climited resistant, tests necessary to verify
OtherChlorine water at 23°Cnot resistant
OtherChloroacetic acid (10% by mass) at 23°Cnot resistant
OtherChlorobenzene at 23°Cresistant
OtherChlorobenzene at 50°Cresistant
OtherChlorobromomethane at 23°Climited resistant, tests necessary to verify
OtherChlorodifluoroethane at 23°Cresistant
OtherChlorodifluoromethane at 23°Cresistant
OtherChlorofluoroethylene at 23°Cresistant
OtherChloroform at 23°Cnot resistant
OtherChlorosulfonic acid (10% by mass) at 23°Cnot resistant
OtherChromic acid (1% by mass) at 23°Climited resistant, tests necessary to verify
OtherChromic acid (10% by mass) at 23°Cnot resistant
OtherChromyl chloride at 23°Cnot resistant
Othercis-2-butene at 23°Cresistant
OtherCitric acid (10% by mass) at 23°Cresistant
OtherCitric acid (20% by mass) at 80°Climited resistant, tests necessary to verify
OtherCobalt salt (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherCopper sulfate (10% by mass) at 23°Cresistant
OtherCopper(II) salt (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherCresols at 23°Cnot resistant
OtherCycloalcohols (incl their esters) at 23°Cresistant
OtherCycloalkanes at 23°Cresistant
OtherCycloalkanones at 23°Cresistant
OtherCyclohexanol at 23°Climited resistant, tests necessary to verify
OtherDecalin at 23°Cresistant
OtherDeveloper (photografic) at 23°Cresistant
OtherDibutyl phthalate at 23°Cresistant
OtherDibutyl phthalate at 60°Cresistant
OtherDichlorobenzene at 23°Cresistant
OtherDichloroethane at 23°Cresistant
OtherDichloroethylene at 23°Cresistant
OtherDichlorofluoromethane at 23°Cresistant
OtherDichlorotetrafluoroethane at 23°Cresistant
EthersDiethyl ether at 23°Cresistant
OtherDiethylene glycol at 23°Cresistant
OtherDiethylene glycol at >140°Cnot resistant
OtherDifluoromethane at 23°Cresistant
OtherDimethyl acetamide at 23°Cresistant
OtherDimethyl acetamide at >150°Cnot resistant
OtherDimethyl ether at 23°Cresistant
OtherDimethylamine at 23°Cresistant
OtherDimethylformamide at 23°Cresistant
OtherDimethylformamide at 90°Climited resistant, tests necessary to verify
OtherDimethylsilane at 23°Cresistant
OtherDimethylsulfoxide at 125°Cnot resistant
OtherDimethylsulfoxide at 23°Cresistant
OtherDioctyl phtalate at 23°Cresistant
OtherDioxan at 23°Cresistant
OtherDioxan at 60°Cresistant
OtherDiphenyl ether at 80°Cresistant
OtherDipropyl ether at 23°Cresistant
OtherEdible fats waxes and oils at 100°Cresistant
OtherElectroplating bath (acidic) at 23°Cnot resistant
OtherElectroplating bath (alkali) at 23°Cresistant
OtherEthane at 23°Cresistant
AlcoholsEthanol at 23°Cresistant
OtherEthyl Acetate at 23°Cresistant
OtherEthyl chloride at 23°Cresistant
OtherEthylbenzen at 23Cresistant
OtherEthylene at 23°Cresistant
OtherEthylene carbonate at 100°Cnot resistant
OtherEthylene carbonate at 50°Cresistant
OtherEthylene chlorohydrin at 23°Climited resistant, tests necessary to verify
OtherEthylene glycol at 100°Cnot resistant
OtherEthylene glycol at 23°Cresistant
OtherEthylene oxide at 23°Cresistant
OtherEthylene oxide at >80°Cnot resistant
OtherEthylenediamine at 23°Cresistant
OtherFatty acids at 23°Cresistant
OtherFatty alcohols at 23°Cresistant
OtherFerric chloride (2,5% by mass) at 100°Cnot resistant
OtherFerric chloride (2,5% by mass) at 23°Climited resistant, tests necessary to verify
OtherFixer (photografic) at 23°Cresistant
OtherFluorinated hydrocarbons at 70°Cresistant
OtherFluorine at 23°Cnot resistant
OtherFormaldehyde (30% by mass) at 23°Cresistant
OtherFormamide at 23°Cresistant
OtherFormamide at >150°Cnot resistant
OtherFormic acid (10% by mass) at 23°Cnot resistant
OtherFormic acid (10% by mass) at 50°Cnot resistant
OtherFruit juices at 23°Cresistant
OtherFuel; Diesel at 85°Cresistant
OtherFuel; FAM 1A at 23°Cresistant
OtherFuel; FAM 2A at 23°Cresistant
OtherFuel; Gasoline at 85°Cresistant
OtherFuel; LPG at 23°Cresistant
OtherFurfural at 23°Cresistant
OtherFurfuryl alcohol at 23°Cresistant
OtherGlucose at 23°Cresistant
OtherGlycerol at 170°Cresistant
OtherGlycerol at 23°Cresistant
OtherGlycol-water 50/50 mixtureresistant
OtherGlycolic acid (30% by mass) at 23°Cresistant
OtherGlycols at 23°Cresistant
OtherGrease (based on ester oils) at <100°Cresistant
OtherGrease (based on metal soaps) at <100°Cresistant
OtherGrease (based on polyphenylester) at <100°Cresistant
OtherHardening oils at 23°Cresistant
OtherHeating oils at 23°Cresistant
OtherHeptane at 23°Cresistant
OtherHexachlorobenzene at 80°Cresistant
OtherHexachloroethane at 23°Cresistant
OtherHexafluoroisopropanol at 23°Cnot resistant
OtherHexane at 23°Cresistant
OtherHydraulic fluids at 100°Cresistant
OtherHydrobromic acid (10% by mass) at 23°Cnot resistant
OtherHydrochloric acid (10% by mass) at 23°Cnot resistant
OtherHydrochloric acid (20% by mass) at 23°Cnot resistant
OtherHydrochloric acid (conc.% by mass) at 23°Cnot resistant
OtherHydrofluoric acid (40% by mass) at 23°Cresistant
OtherHydrofluoric acid (5% by mass) at 23°Cnot resistant
OtherHydrogen at 23°Cresistant
OtherHydrogen peroxide (0.5% by mass) at 23°Climited resistant, tests necessary to verify
OtherHydrogen peroxide (1% by mass) at 23°Cnot resistant
OtherHydrogen peroxide (3% by mass) at 23°Cnot resistant
OtherHydrogen peroxide (30% by mass) at 23°Cnot resistant
OtherHydrogen sulfide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherHydroiodic acid at 23°Cnot resistant
OtherHydroquinone (5% by mass) at 23°Cnot resistant
OtherImpregnating oils at 23°Cresistant
OtherInk at 23°Cresistant
OtherIodine (alcoholic) at 23°Cnot resistant
OtherIron(III)chloride (acidic) (10% by mass) at 23°Cnot resistant
OtherIron(III)chloride (neutral) (10% by mass) at 23°Cresistant
OtherIron(III)chloride (saturated) at 23°Cnot resistant
OtherIron(III)thiocyanate (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherIsocyanates (aromatic) at 23°Cresistant
OtherIsooctane at 80°Cresistant
OtherIsopropanol at 23°Cresistant
OtherIsopropanol at 60°Cresistant
OtherKeroseneresistant
OtherKetones (aliphatic) at 23°Cresistant
OtherLactic acid at 10°Cresistant
OtherLactic acid at 90°Cnot resistant
OtherLead acetate (10% by mass) at 23°Cresistant
OtherLinseed oil at 23°Cresistant
OtherLithium bromide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherLithium chloride (20% by mass) at 23°Cnot resistant
OtherLithium hydroxide (10% by mass) at 23°Cresistant
OtherLithium hydroxide (10% by mass) at 80°Cnot resistant
OtherLubricating oil (gear) at <130°Cresistant
OtherLubricating oil (hydraulics) at <130°Cresistant
OtherLubricating oil (transformers) at <130°Cresistant
OtherMagnesium hydroxide (10% by mass) at 23°Cresistant
OtherMagnesium salts (10% by mass) at 23°Cresistant
OtherMaleic acid (25% by mass) at 23°Climited resistant, tests necessary to verify
OtherMaleic acid (saturated) at 23°Cresistant
OtherManganese salts (10% by mass) at 23°Cresistant
OtherMercury at 23°Cresistant
OtherMercury(II)chloride (saturated) at 23°Cnot resistant
OtherMethane at 23°Cresistant
AlcoholsMethanol at 23°Cresistant
OtherMethyl acetate at 23°Cresistant
OtherMethyl chloride at 23°Cresistant
OtherMethyl ethyl ketone at 23°Cresistant
OtherMethyl formate at 23°Cresistant
OtherMethyl glycol at 23°Cresistant
OtherMethylamine at 23°Cresistant
OtherMethylaniline at 23°Cresistant
OtherMethylbromide at 23°Cresistant
OtherMethylene chloride at 23°Climited resistant, tests necessary to verify
OtherMethylpyrrolidone at 23°Cresistant
OtherMilk at 23°Cresistant
Othern-Butyl ether at 23°Cresistant
Othern-Butyl glycol at 23°Cresistant
OtherNaphtha at 23°Cresistant
OtherNaphthalene at 23°Cresistant
OtherNaphthalenesulfonic acids at 23°Cnot resistant
OtherNaphthenic acids at 23°Cresistant
OtherNaphthols at 23°Cnot resistant
OtherNickel nitrate (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherNickel salts (10% by mass) at 23°Cresistant
OtherNitric acid (10% by mass) at 23°Cnot resistant
OtherNitric acid (2% by mass) at 23°Cnot resistant
OtherNitric acid (20% by mass) at 23°Cnot resistant
OtherNitric acid (conc.% by mass) at 23°Cnot resistant
OtherNitrobenzene at 23°Climited resistant, tests necessary to verify
OtherNitrobenzene at >100°Cnot resistant
OtherNitrocellulose lacquers (alcoholic) at 23°Climited resistant, tests necessary to verify
OtherNitrocellulose lacquers (non-alcoholic) at 23°Cresistant
OtherNitrogen oxides at 23°Climited resistant, tests necessary to verify
OtherNitromethane at 23°Climited resistant, tests necessary to verify
OtherNitropropane at 23°Climited resistant, tests necessary to verify
OtherNitrotoluene at 23°Climited resistant, tests necessary to verify
OtherNitrotoluene at >100°Cnot resistant
OtherNitrous fumes at 23°Climited resistant, tests necessary to verify
OtherNitrous oxide at 23°Cresistant
OtherOctane at 23°Cresistant
OtherOctene at 23°Cresistant
OtherOil (Shell 10W40) at 23°Cresistant
OtherOil (transformers, switchgear) at 50°Cresistant
OtherOils (vegatable, mineral, ethereal) at 23°Cresistant
OtherOleic acid at 23°Cresistant
OtherOleum (H2SO4+SO3) at 23°Cnot resistant
OtherOxalic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherOxalic acid (10% by mass) at 80°Cnot resistant
OtherOzone at 23°Cnot resistant
OtherPaint solvents at 23°Cresistant
OtherPalmatic acid at 80°Cresistant
OtherParaffin at 23°Cresistant
OtherPeracetic acid at 23°Cnot resistant
OtherPerchloric acid (10% by mass) at 23°Cnot resistant
OtherPetroleum at 23°Cresistant
OtherPetroleum ether and solvents at 80°Cresistant
OtherPhenol (alc. sol.) (70% by mass) at 23°Climited resistant, tests necessary to verify
OtherPhenol (conc.% by mass) at 23°Cnot resistant
OtherPhenol at >40°Cnot resistant
OtherPhenyl ether at 23°Cnot resistant
OtherPhenyl ethyl alcohol at 23°Climited resistant, tests necessary to verify
OtherPhenyl ethyl alcohol at >160°Cnot resistant
OtherPhosphate sol. (neutral, alkaline) (10% by mass) at 23°Cresistant
OtherPhosphine at 23°Cresistant
OtherPhosphoric acid (10% by mass) at 23°Cnot resistant
OtherPhosphoric acid (conc.% by mass) at 23°Cnot resistant
OtherPhthalic acid (saturated) at 23°Climited resistant, tests necessary to verify
OtherPolyols at 23°Cresistant
OtherPotassium bromide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherPotassium chlorate (7% aquous solution) at 23Cnot resistant
OtherPotassium chloride (10% by mass) at 23°Cresistant
OtherPotassium chloride (10% by mass) at 70°Cresistant
OtherPotassium dichromate (5% by mass) at 23°Climited resistant, tests necessary to verify
OtherPotassium hydroxide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherPotassium nitrate (10% by mass) at 23°Cresistant
OtherPotassium permanganate (1% by mass) at 23°Cnot resistant
OtherPotassium thiocyanate (saturated) at 23°Cnot resistant
OtherPropane at 23°Cresistant
OtherPropanol at 23°Cresistant
OtherPropanol at >100°Cnot resistant
OtherPropene at 23°Cresistant
OtherPropionic acid (5% by mass) at 23°Cresistant
OtherPropionic acid (50% by mass) at 23°Cnot resistant
OtherPyridine at 23°Cresistant
OtherPyridine at 80°Climited resistant, tests necessary to verify
OtherPyrocatechol at 23°Cnot resistant
OtherPyrrolidone at 23°Cresistant
OtherPyruvic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherRainwater (acidic) at 23°Cresistant
OtherRefrigerator oil at 23°Cresistant
OtherResorcinol (alcoholic) (1% by mass) at 23°Cnot resistant
OtherRoad salts at 23°Cresistant
OtherSalicylic acid (saturated) at 23°Cresistant
OtherSeawater at 23°Cresistant
OtherSilane at 23°Cresistant
OtherSilicone oils at <80°Cresistant
OtherSilicone oils at >100°Climited resistant, tests necessary to verify
OtherSilver nitrate (10% by mass) at 23°Cresistant
OtherSoap solution (10% by mass) at 80°Cresistant
OtherSodium bichromate (10% by mass) at 23°Cresistant
OtherSodium bichromate (5% by mass) at 23°Cresistant
OtherSodium bromide (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium cabonate (20% by mass) at 100°Climited resistant, tests necessary to verify
OtherSodium carbonate (10% by mass) at 23°Cresistant
OtherSodium chlorate (10% by mass) at 23°Cresistant
OtherSodium chloride (10% by mass) at 23°Cresistant
OtherSodium chloride (saturated) at 23°Cresistant
OtherSodium chlorite (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium cyanide (10% by mass) at 23°Cresistant
OtherSodium dichromate (10% by mass) at 23°Cresistant
OtherSodium dodecylbenzenesulfonate at 23°Cresistant
OtherSodium hydrogen carbonate (10% by mass) at 23°Cresistant
OtherSodium hydrogen sulfate (10% by mass) at 23°Cresistant
OtherSodium hydrogen sulfite (10% by mass) at 23°Cresistant
OtherSodium hydroxide (10% by mass) at 23°Cresistant
OtherSodium hydroxide (10% by mass) at 80°Cnot resistant
OtherSodium hydroxide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium hypochlorite (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherSodium hypophosphite (10% by mass) at 23°Cresistant
OtherSodium lauryl sulfate (30% by mass) at 23°Cresistant
OtherSodium lignosulfonate at 23°Cresistant
OtherSodium nitrilotriacetate (10% by mass) at 23°Cresistant
OtherSodium oleate at 23°Cresistant
OtherSodium pentachlorophenolate at 23°Cresistant
OtherSodium pyrosulfite (10% by mass) at 23°Cresistant
OtherSodium salts (nitrate, sulfate) (10% by mass) at 23°Cresistant
OtherStearate at 23°Cresistant
OtherStearic acid at 23°Cresistant
OtherStyrene at 80°Cresistant
OtherSulfonates (10% by mass) at 23°Cresistant
OtherSulfur at 23°Cresistant
OtherSulfur dioxide (dry) at 23°Cresistant
OtherSulfur dioxide (moist) at 23°Climited resistant, tests necessary to verify
OtherSulfur hexafluoride at 23°Cresistant
OtherSulfuric acid (2% by mass) at 23°Cnot resistant
OtherSulfuric acid (30% by mass) at 23°Cnot resistant
OtherSulfuric acid (50% by mass) at 23°Cnot resistant
OtherSulfuric acid (conc.% by mass) at 23°Cnot resistant
OtherSulfurous acid (saturated) at 23°Climited resistant, tests necessary to verify
OtherTartaric acid (10% by mass) at 23°Cresistant
OtherTartaric acid (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherTetrachloroethylene at 23°Climited resistant, tests necessary to verify
OtherTetrachloroethylene at 80°Cnot resistant
OtherTetrachloromethane at 23°Cresistant
OtherTetrafluoromethane at 23°Cresistant
OtherTetrafluoropropanol at 23°Cnot resistant
OtherTetrahydrofuran at 23°Cresistant
OtherTetralin at 23°Cresistant
OtherTetramethylenesulfone at 23°Cresistant
Mold/Tool Measured melt Nozzle Front Center Rear
80-150°C
176-302°F
330-340°C
626-644°F
330-335°C
626-635°F
330-335°C
626-635°F
325-335°C
617-635°F
320-330°C
608-626°F

Given barrel temperature settings are for shot weights > 2 grams. For smaller shot weights (< 2 grams) barrel temperature settings are typically 5-10°C lower.

Melt Temperature

  • To generate a good and homogeneous melt, the melt temperature should always be above 330°C / 626°F. Optimal mechanical properties will be achieved at melt temperatures between 330-340°C / 626-644°F. Melt temperatures on the low side of this window are recommended to minimize the risk of mold deposit and corrosion.
  • We advise to frequently measure the melt temperature by pouring the melt in a Teflon cup and inserting a thermo probe into the melt.

Residence Time

  • Melt residence time for ForTii® in general should not exceed 4 minutes; preferably, melt residence time for ForTii® is <2 minutes. See also the separate section on residence time below.

Hot Runner Temperature

  • A hot runner temperature set to the same level as the nozzle temperature should work fine and not lead to excessive overheat of the ForTii® grade. When starting up, an increased tip temperature may be necessary to overcome a frozen nozzle.
General Processing Settings For Injection Molding

Screw Rotation Speed

  • To realize a good and homogeneous melt, it is advised to set a screw rotation speed resulting in a plasticizing time that is just within the cooling time.
  • The rotational speed of the screw should not exceed 6500 / D RPM (where D is the screw diameter in mm).

Back Pressure

  • Back pressure should be between 5-30 bars effective. Keep it low in order to prevent nozzle-drooling, excessive shear heating and long plasticizing times.

Decompression

  • In order to prevent nozzle drool after plasticizing and retracting the nozzle from the mold, a short decompression stroke can be used. However, to prevent oxidation of the melt, which may result in surface defects on the parts, it is recommended to keep this as short as possible.

Injection Speed

  • Moderate to high injection speeds are required in order to prevent premature crystallization in the mold during injection phase and to obtain a better surface finish. The recommended injection speed profile goes from fast (for sprue and runner filling) to medium (for part filling) to avoid excessive shear heating and allow air to escape from the mold. Adequate mold venting is required to avoid burning at the end of the flow path (due to diesel effect).

Injection Pressure

  • The real injection pressure is the result of the flowability of the material (crystallization rate, flow length, wall thickness, filling speed). The set injection pressure should be high enough to maintain the set injection speed (use set injection pressure higher than the peak pressure if possible). Tooling air vents must be effective to allow optimum filling pressure and prevent burn marks.

Holding Time

  • Effective holding time is determined by part thickness and gate size. Holding time should be maintained until a constant product weight is achieved. Due to its fast solidification, holding time for ForTii® is short compared to other engineering plastics.

Holding Pressure

  • The most adequate holding pressure is the level whereby no sinkmarks or flash are visible. A too high holding pressure can lead to stresses in the part.

Cooling Time

  • Actual cooling time will depend on part geometry and dimensional quality requirements as well as the tool design (gate size). Due to the fast crystallization of ForTii®, a short cooling time is possible.
Melt Residence Time For Injection Molding

The optimal Melt Residence Time (MRT) for ForTii® F81 is ≤ 2 minutes with preferably at least 50% of the maximal shot volume used. The MRT should not exceed 4 minutes.

A formula to estimate the MRT is described below:
𝑀𝑅𝑇 = (∏D³ρ/m) * (t/60)
Whereas:
MRT = Melt Residence Time [minutes]
D = Screw Diameter [cm]
p = Melt Density [g/cm3)
m = Shot Weight [g]
t = Cycle Time [s]

Please note: In the calculation above, the hotrunner volume has not been taken into account. When a hotrunner is part of the setup, please add the hotrunner volume to the calculation.

Startup/Shut Down/Cleaning For Injection Molding
  • Production has to be started and stopped with a clean machine. Cleaning can be done with PA6-GF or PA66-GF, applicable cleaning agents or HDPE. Hot runners can also be cleaned and put out of production cleaning them with PA6-GF or PA66-GF.
Production Breaks For Injection Molding
  • During production breaks longer than a few minutes, we advise emptying the barrel. The temperature of the barrel and the hot runner [if applicable) should be reduced to a level far enough below the melting point of the compound in order to stop decomposition of the compound.
  • When the hot runner, nozzle, or even the screw is blocked, be aware that under these conditions a sudden outburst of molten material can take place. Always wear personal safety protections for hand/eye/body.

Packaging & Availability

Storage & Handling

Material Handling For Injection Molding

Storage

  • In order to prevent moisture pick up and contamination, supplied packaging should be kept closed and undamaged. For the same reason, partial bags should be sealed before re-storage.Advisable is storage at room temperature.

Packaging

  • ForTii® grades are supplied in airtight, moisture-proof packaging.

Moisture Content as Delivered

  • ForTii® F81 is packaged at a moisture level ≤ 0.1 w%.

Conditioning Before Molding

  • To prevent moisture condensing on granules, bring cold granules up to ambient temperature in the molding shop while keeping the packaging closed.

Moisture Content Before Molding

  • ForTii® F81 is delivered at molding moisture specification (≤ 0.1 w%). We advise to pre-dry to a level of max. 500 ppm to overcome the fluctuation from package to package and minimize the corrosive effects on hardware like screw/screw tip and barrel (see drying section below). Furthermore, pre-drying is required in case the material is exposed to moisture before molding (prolonged storage or open/damaged packaging). Moisture content can be checked by water evaporation methods or manometric methods (ISO 15512).

Drying

  • ForTii® grades are hygroscopic and absorb moisture from the air relatively quickly. Moisture absorption is fully reversible under the following drying conditions without compromising material quality. Preferred driers are dehumidified driers with dew points maintained between -30 and -40°C / -22 and -40°F. Vacuum driers with N, purge can also be used. Hot air ovens or hopper driers are not suitable for pre-drying ForTii® grades; the use of such driers may result in non-optimum performance. 
Moisture content Time Temperature
[%] [h] [°c] [°F]
0.1 - 0.2
and as delivered
2 100 212
0.2 - 0.5 4-8 100 212
>0.5 <100
or 24
or4
100
110
120
212
230
248

Regrind

  • Regrind can be used taking into account that this regrind must be clean/low dust content/not thermally degraded/dry, of same composition and similar particle size as the original material. The acceptable level of regrind depends on the application requirements (e.g. UL Yellow Card). Be aware that regrind can cause some small color deviations.