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Xytron™ G3080R

1 of 22 products in this brand
Xytron™ G3080R is a high-performance plastic compound from Envalior that is based on PPS (polyphenylene sulfide). It offers extremely good chemical resistance, dimensional stability, intrinsic flame retardancy, and high stiffness. Because of its outstanding properties, it contributes to excellent performance in many different applications. A suitable processing technology for the product is injection molding.

Polymer Name: Polyphenylene Sulfide (PPS)

Processing Methods: Injection Molding

Fillers Included: Glass Fiber

Flexural Modulus: 10000.0 - 10000.0 MPa

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods
ADAS Radar Housing Application Data

Details

Envalior offers many solutions for today’s complex ADAS components, including proven material solutions such as Arnite® PBT. New Xytron™ PPS material solutions are also being developed to deliver more affordable performance compared to polyetherimide (PEI) thermoplastics.

Benefits

  • High design flexibility for molding thin-walled parts
  • High continuous use temperatures (CUT) for superior thermal load management
  • Excellent processing capabilities supporting easy injection molding
  • High hydrolytic and chemical resistance to extend part lifetimes
  • Cost-effective low Dk and Dk radome solutions
  • Medium conductivity grades minimizing reflections in midframes
  • High electric and thermal conductivity grades for back covers
  • Laser-welding options for rapidly bonding radomes and back covers

Properties

Flame Rating
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Modulus12000MPaISO 527-1/-2
Tensile Modulus (-40°C)12000MPaISO 527-1/-2
Tensile Modulus (120°C)4700MPaISO 527-1/-2
Tensile Modulus (160°C)3500MPaISO 527-1/-2
Tensile Modulus (200°C)2950MPaISO 527-1/-2
Stress at Break170MPaISO 527-1/-2
Stress at Break (-40°C)185MPaISO 527-1/-2
Stress at Break (120°C)70MPaISO 527-1/-2
Stress at Break (160°C)55MPaISO 527-1/-2
Stress at Break (200°C)45MPaISO 527-1/-2
Strain at Break2%ISO 527-1/-2
Strain at Break (at -40°C)2%ISO 527-1/-2
Strain at Break (at 120°C)4.6%ISO 527-1/-2
Strain at Break (at 160°C)5.3%ISO 527-1/-2
Strain at Break (at 200°C)5.4%ISO 527-1/-2
Flexural Modulus10000MPaISO 178
Flexural Modulus (at 120°C)4500MPaISO 178
Flexural Modulus (at 160°C)3300MPaISO 178
Flexural Modulus (at 200°C)2900MPaISO 178
Flexural Strength240MPaISO 178
Flexural Strength (at 120°C)96MPaISO 178
Flexural Strength (at 160°C)68MPaISO 178
Flexural Strength (at 200°C)56MPaISO 178
Charpy Impact Strength (at +23°C)58kJ/m²ISO 179/1eU
Charpy Impact Strength (at -30°C)56kJ/m²ISO 179/1eU
Charpy Notched Impact Strength (at +23°C)9kJ/m²ISO 179/1eA
Charpy Notched Impact Strength (at -30°C)8kJ/m²ISO 179/1eA
Weldline Strength (at thickness 4 mm)75MPaISO 527-1/-2
Weldline Strain (at thickness 4 mm)0.85%ISO 527-1/-2
Rockwell Hardness (R scale)120ISO 2039-2
Rockwell Hardness (M scale)100ISO 2039-2
Thermal Properties
ValueUnitsTest Method / Conditions
Melting Temperature (10°C/min)280°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)90°CISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)265°CISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)280°CISO 75-1/-2
Temperature of Deflection Under Load (8.00 MPa)185°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.18E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)0.5E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (parallel, above Tg)0.18E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal, above Tg)1.2E-4/°CISO 11359-1/-2
Burning Behaviour (at 3.0 mm Nominal Thickness)UL V-0classIEC 60695-11-10
Relative Temperature Index (Electrical, 0.4 mm)130°CUL746B
Relative Temperature Index (Electrical, 3 mm)130°CUL746B
Relative Temperature Index (with impact, 0.4 mm)130°CUL746B
Relative Temperature Index (with impact, 3 mm)130°CUL746B
Relative Temperature Index (without impact, 0.4 mm)130°CUL746B
Relative Temperature Index (without impact, 3 mm)130°CUL746B
Electrical Properties
ValueUnitsTest Method / Conditions
Relative Permittivity (1GHz)3.8IEC 60250
Relative Permittivity (5GHz)3.8IEC 60250
Dissipation Factor (1GHz)30E-4IEC 60250
Dissipation Factor (5GHz)45E-4IEC 60250
Volume Resistivity>1E13Ohm*mIEC 62631-3-1
Surface Resistivity>1E15OhmIEC 62631-3-2
Electric Strength34kV/mmIEC 60243-1
Comparative Tracking Index175VIEC 60112
Other Properties
ValueUnitsTest Method / Conditions
Water Absorption in Water (at 23°C after 24h)0.05%ISO 62
Humidity Absorption0.05%Sim. to ISO 62
Density1550kg/m³ISO 1183
Rheological Properties
ValueUnitsTest Method / Conditions
Molding Shrinkage (parallel)0.21%ISO 294-4
Molding Shrinkage (normal)0.65%ISO 294-4
Grade Coding for Injection Molding

Xytron™ PPS reinforced injection molding grades.

Regulatory & Compliance

Certifications & Compliance
Quality Standards

Technical Details & Test Data

Chemical Resistance
Chemical TypeChemical NameResistance
Other1% nonylphenoxy-polyethyleneoxy ethanol in water at 23°Cresistant
Other50% Oleic acid + 50% Olive Oil at 23°Cresistant
OtherAcetaldehyde (40% by mass) at 23°Cresistant
OtherAcetamide (50% by mass) at 23°Cresistant
OtherAcetamide (50% by mass) at >140°Cresistant
OtherAcetic acid (10% by mass) at 100°Cresistant
OtherAcetic acid (10% by mass) at 23°Cresistant
AcidsAcetic Acid (5% by mass) at 23°Cresistant
OtherAcetic acid (95% by mass) at 23°Cresistant
KetonesAcetone at 23°Cresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Cresistant
OtherAcetylene at 23°Cresistant
OtherAcrylic acid at 23°Cresistant
OtherAcrylonitril at 23°Cresistant
OtherAliphatic amines at 23°Cresistant
OtherAliphatic hydrocarbons at 23°Cresistant
OtherAlkylbenzenes at 23°Cresistant
OtherAllyl alcohol at 23°Cresistant
OtherAluminum acetate (saturated) at 23°Cresistant
OtherAluminum chloride (10% by mass) at 23°Cresistant
OtherAluminum hydroxide (saturated) at 23°Cresistant
OtherAluminum salts of mineral acids (saturated) at 23°Cresistant
OtherAluminum trichloride (10% by mass) at 23°Cresistant
OtherAmino acids (saturated) at 23°Cresistant
OtherAmmonia at 23°Cresistant
OtherAmmonium chloride (35% by mass) at 100°Cresistant
OtherAmmonium chloride (35% by mass) at 23°Cresistant
OtherAmmonium fluoride (saturated) at 23°Cresistant
OtherAmmonium hydroxide (10% by mass) at 23°Cresistant
BasesAmmonium Hydroxide solution (10% by mass) at 23°Cresistant
OtherAmmonium salts of mineral acids (10% by mass) at 23°Cresistant
OtherAmmonium salts of mineral acids (10% by mass) at 50°Cresistant
OtherAmmonium sulfide (saturated) at 23°Cresistant
OtherAmmonium thiocyanate (saturated) at 23°Cresistant
OtherAmyl acetate at 100°Cresistant
OtherAmyl acetate at 23°Cresistant
OtherAmyl alcohol at 23°Cresistant
OtherAniline at 23°Cresistant
OtherAnise at 23°Cresistant
OtherAnodizing liquid (HNO3/H2SO4) at 23°Cresistant
OtherAntimony trichoride (saturated) at 23°Cresistant
OtherAqua Regia (HCl/HNO3) at 23°Cresistant
OtherAromatic hydrocarbons at 23°Cresistant
OtherASTM 1 at 23°Cresistant
OtherASTM 3 at 23°Cresistant
Mineral oilsAutomatic hypoid-gear oil Shell Donax TX at 135°Cresistant
OtherBariumsalts of mineral acids at 23°Cresistant
OtherBenzaldehyde at 23°Cresistant
OtherBenzene at 23°Cresistant
OtherBenzene at 80°Cresistant
OtherBenzoic acid (20% by mass) at 23°Cresistant
OtherBenzoic acid (saturated) at 23°Cresistant
OtherBenzyl alcohol at 23°Cresistant
OtherBeverages at 23°Cresistant
OtherBleaching agent (NaOCl) at 23°Cresistant
OtherBlood at 23°Cresistant
OtherBoric acid (10% by mass) at 23°Cresistant
OtherBoron trifluoride at 23°Cresistant
OtherBrake fluids (DOT 3/4) at 23°Cresistant
OtherBromine water (saturated) at 23°Cresistant
OtherBromobenzene at 23°Cresistant
OtherBromochlorodifluoromethane at 23°Cresistant
OtherBromotrifluoromethane at 23°Cresistant
OtherBurnishing oil at 23°Cresistant
OtherButadiene at 23°Cresistant
OtherButane at 23°Cresistant
OtherButanediols at 23°Cresistant
OtherButanediols at >140°Cresistant
OtherButanols at 23°Cresistant
OtherButene glycol at 23°Cresistant
OtherButene glycol at >160°Cresistant
OtherButene-1 at 23°Cresistant
OtherButter at 23°Cresistant
OtherButyl acetate at 23°Cresistant
OtherButyl acrylate at 23°Cresistant
OtherButyl glycolate at 23°Cresistant
OtherButyl phthalate at 23°Cresistant
OtherButyric acid (20% by mass) at 23°Cresistant
OtherButyrolactone at 23°Cresistant
OtherButyrolactone at >90°Cresistant
OtherCalcium chloride (10% by mass) at 100°Cresistant
OtherCalcium chloride (10% by mass) at 23°Cresistant
OtherCalcium chloride (alcoholic) (20% by mass) at 23°Cresistant
OtherCalcium chloride (saturated) at 100°Cresistant
OtherCalcium chloride (saturated) at 23°Cresistant
OtherCalcium chloride (saturated) at 60°Cresistant
OtherCalcium hydroxide (saturated) at 23°Cresistant
OtherCalcium hypochloride (saturated) at 23°Cresistant
OtherCamphor (alcoholic) (50% by mass) at 23°Cresistant
OtherCaprolactam (50% by mass) at 23°Cresistant
OtherCaprolactam (50% by mass) at >150°Cresistant
OtherCarbon dioxide (moist) at 23°Cresistant
OtherCarbon disulfide at 23°Cresistant
OtherCarbon disulfide at 60°Cresistant
OtherCarbon tetrachloride at 23°Cresistant
OtherCasein at 23°Cresistant
OtherCastor oil at 23°Cresistant
OtherChloral hydrate at 23°Cresistant
OtherChloramines (10% by mass) at 23°Cresistant
OtherChlorinated biphenyls at 80°Cresistant
OtherChlorine gas (dry) at 23°Cresistant
OtherChlorine gas (moist) at 23°Cresistant
OtherChlorine water at 23°Cresistant
OtherChloroacetic acid (10% by mass) at 23°Cresistant
OtherChlorobenzene at 23°Cresistant
OtherChlorobenzene at 50°Cresistant
OtherChlorobromomethane at 23°Cresistant
OtherChlorodifluoroethane at 23°Cresistant
OtherChlorodifluoromethane at 23°Cresistant
OtherChlorofluoroethylene at 23°Cresistant
OtherChloroform at 23°Cresistant
OtherChlorosulfonic acid (10% by mass) at 23°Cresistant
OtherChromic acid (1% by mass) at 23°Cresistant
OtherChromic acid (10% by mass) at 23°Cresistant
AcidsChromic Acid solution (40% by mass) at 23°Cresistant
OtherChromyl chloride at 23°Cresistant
OtherCinnamon at 23°Cresistant
Othercis-2-butene at 23°Cresistant
OtherCitric acid (10% by mass) at 23°Cresistant
OtherCitric acid (20% by mass) at 80°Cresistant
AcidsCitric Acid solution (10% by mass) at 23°Cresistant
OtherCobalt salt (20% by mass) at 23°Cresistant
OtherCoolant Glysantin G48, 1:1 in water at 125°Cresistant
OtherCopper sulfate (10% by mass) at 23°Cresistant
OtherCopper(II) salt (10% by mass) at 23°Cresistant
OtherCresols at 23°Cresistant
OtherCycloalcohols (incl their esters) at 23°Cresistant
OtherCycloalkanes at 23°Cresistant
OtherCycloalkanones at 23°Cresistant
OtherCyclohexanol at 23°Cresistant
OtherDecalin at 23°Cresistant
OtherDeionized water at 90°Cresistant
OtherDeveloper (photografic) at 23°Cresistant
OtherDiamyl phthalate at 23°Cresistant
OtherDibutyl phthalate at 23°Cresistant
OtherDibutyl phthalate at 60°Cresistant
OtherDichlorobenzene at 23°Cresistant
OtherDichloroethane at 23°Cresistant
OtherDichloroethylene at 23°Cresistant
OtherDichlorofluoromethane at 23°Cresistant
OtherDichlorotetrafluoroethane at 23°Cresistant
Standard FuelsDiesel EN 590 at 100°Climited resistant, tests necessary to verify
Standard FuelsDiesel fuel (pref. ISO 1817 Liquid F) at 23°Cresistant
Standard FuelsDiesel fuel (pref. ISO 1817 Liquid F) at 90°Cresistant
Standard FuelsDiesel fuel (pref. ISO 1817 Liquid F) at >90°Climited resistant, tests necessary to verify
EthersDiethyl ether at 23°Cresistant
OtherDiethylene glycol at 23°Cresistant
OtherDiethylene glycol at >140°Cresistant
OtherDifluoromethane at 23°Cresistant
OtherDimethyl acetamide at 23°Cresistant
OtherDimethyl acetamide at >150°Cresistant
OtherDimethyl ether at 23°Cresistant
OtherDimethylamine at 23°Cresistant
OtherDimethylformamide at 23°Cresistant
OtherDimethylformamide at 90°Cresistant
OtherDimethylsilane at 23°Cresistant
OtherDimethylsulfoxide at 125°Cresistant
OtherDimethylsulfoxide at 23°Cresistant
OtherDinonyl phtalate at 23°Cresistant
OtherDioctyl phtalate at 23°Cresistant
OtherDioxan at 23°Cresistant
OtherDioxan at 60°Cresistant
OtherDiphenyl ether at 80°Cresistant
OtherDipropyl ether at 23°Cresistant
OtherDOT No. 4 Brake fluid at 120°Cresistant
OtherDOT No. 4 Brake fluid at 130°Cresistant
OtherDrilling oil at 23°Cresistant
OtherDuck grease at 23°Cresistant
OtherEdible fats waxes and oils at 100°Cresistant
OtherElectroplating bath (acidic) at 23°Cresistant
OtherElectroplating bath (alkali) at 23°Cresistant
OtherEssential oil at 23°Cresistant
OtherEthane at 23°Cresistant
AlcoholsEthanol at 23°Cresistant
OtherEthyl Acetate at 23°Cresistant
OtherEthyl amine at 23°Cresistant
OtherEthyl bromide at 23°Cresistant
OtherEthyl chloride at 23°Cresistant
OtherEthylene at 23°Cresistant
OtherEthylene carbonate at 100°Cresistant
OtherEthylene carbonate at 50°Cresistant
OtherEthylene chloride at 23°Cresistant
OtherEthylene chlorohydrin at 23°Cresistant
OtherEthylene Glycol (50% by mass) in water at 108°Cresistant
OtherEthylene glycol at 100°Cresistant
OtherEthylene glycol at 23°Cresistant
OtherEthylene oxide at 23°Cresistant
OtherEthylene oxide at >80°Cresistant
OtherEthylenediamine at 23°Cresistant
OtherFatty acids at 23°Cresistant
OtherFatty alcohols at 23°Cresistant
OtherFerric chloride (2,5% by mass) at 100°Cresistant
OtherFerric chloride (2,5% by mass) at 23°Cresistant
OtherFish oil at 23°Cresistant
OtherFixer (photografic) at 23°Cresistant
OtherFluorinated hydrocarbons at 70°Cresistant
OtherFluorine at 23°Cresistant
OtherFormaldehyde (30% by mass) at 23°Cresistant
OtherFormamide at 23°Cresistant
OtherFormamide at >150°Cresistant
OtherFormic acid (10% by mass) at 23°Cresistant
OtherFormic acid (10% by mass) at 50°Cresistant
OtherFormic acid (30% by mass) at 23°Cresistant
OtherFruit juices at 23°Cresistant
OtherFuel; Diesel at 85°Cresistant
OtherFuel; FAM 1A at 23°Cresistant
OtherFuel; FAM 2A at 23°Cresistant
OtherFuel; Gasoline at 85°Cresistant
OtherFuel; LPG at 23°Cresistant
OtherFurfural at 23°Cresistant
OtherFurfuryl alcohol at 23°Cresistant
OtherGlucose at 23°Cresistant
OtherGlycerol at 170°Cresistant
OtherGlycerol at 23°Cresistant
OtherGlycolic acid (30% by mass) at 23°Cresistant
OtherGlycols at 23°Cresistant
OtherGrease (based on ester oils) at <100°Cresistant
OtherGrease (based on metal soaps) at <100°Cresistant
OtherGrease (based on polyphenylester) at <100°Cresistant
OtherHardening oils at 23°Cresistant
OtherHeating oils at 23°Cresistant
OtherHeptane at 23°Cresistant
OtherHexachlorobenzene at 80°Cresistant
OtherHexachloroethane at 23°Cresistant
OtherHexafluoroisopropanol at 23°Cresistant
OtherHexamethylenetetramine at 23°Cresistant
OtherHexane at 23°Cresistant
OtherHydraulic fluids at 100°Cresistant
Mineral oilsHydraulic oil Pentosin CHF 202 at 125°Cresistant
OtherHydrobromic acid (10% by mass) at 23°Cresistant
OtherHydrochloric acid (10% by mass) at 23°Cresistant
OtherHydrochloric acid (20% by mass) at 23°Cresistant
AcidsHydrochloric Acid (36% by mass) at 23°Cresistant
OtherHydrochloric acid (conc.% by mass) at 23°Cresistant
OtherHydrofluoric acid (40% by mass) at 23°Cnot resistant
OtherHydrofluoric acid (5% by mass) at 23°Cresistant
OtherHydrogen at 23°Cresistant
OtherHydrogen peroxide (0.5% by mass) at 23°Cresistant
OtherHydrogen peroxide (1% by mass) at 23°Cresistant
OtherHydrogen peroxide (3% by mass) at 23°Cresistant
OtherHydrogen peroxide (30% by mass) at 23°Cresistant
OtherHydrogen peroxide at 23°Cresistant
OtherHydrogen sulfide (10% by mass) at 23°Cresistant
OtherHydroiodic acid at 23°Cresistant
OtherHydroquinone (5% by mass) at 23°Cresistant
OtherImpregnating oils at 23°Cresistant
OtherInk at 23°Cresistant
Mineral oilsInsulating Oil at 23°Cresistant
OtherIodine (alcoholic) at 23°Cresistant
OtherIron(III)chloride (acidic) (10% by mass) at 23°Cresistant
OtherIron(III)chloride (neutral) (10% by mass) at 23°Cresistant
OtherIron(III)chloride (saturated) at 23°Cresistant
OtherIron(III)thiocyanate (10% by mass) at 23°Cresistant
Standard FuelsISO 1817 Liquid 1 at 60°Cresistant
Standard FuelsISO 1817 Liquid 2 at 60°Cresistant
Standard FuelsISO 1817 Liquid 3 at 60°Cresistant
Standard FuelsISO 1817 Liquid 4 at 60°Cresistant
Hydrocarbonsiso-Octane at 23°Cresistant
Otherisoamylalcohol at 23°Cresistant
OtherIsocyanates (aromatic) at 23°Cresistant
OtherIsooctane at 80°Cresistant
OtherIsopropanol at 23°Cresistant
OtherIsopropanol at 60°Cresistant
AlcoholsIsopropyl alcohol at 23°Cresistant
OtherKetones (aliphatic) at 23°Cresistant
AcidsLactic Acid (10% by mass) at 23°Cresistant
OtherLactic acid at 10°Cresistant
OtherLactic acid at 90°Cresistant
OtherLead acetate (10% by mass) at 23°Cresistant
OtherLinseed oil at 23°Cresistant
OtherLithium bromide (10% by mass) at 23°Cresistant
OtherLithium chloride (20% by mass) at 23°Cresistant
OtherLithium hydroxide (10% by mass) at 23°Cresistant
OtherLithium hydroxide (10% by mass) at 80°Cresistant
OtherLubricating oil (gear) at <130°Cresistant
OtherLubricating oil (hydraulics) at <130°Cresistant
OtherLubricating oil (transformers) at <130°Cresistant
OtherMagnesium hydroxide (10% by mass) at 23°Cresistant
OtherMagnesium salts (10% by mass) at 23°Cresistant
OtherMaleic acid (25% by mass) at 23°Cresistant
OtherMaleic acid (saturated) at 23°Cresistant
OtherManganese salts (10% by mass) at 23°Cresistant
OtherMercury at 23°Cresistant
OtherMercury(II)chloride (saturated) at 23°Cresistant
OtherMethane at 23°Cresistant
AlcoholsMethanol at 23°Cresistant
OtherMethyl acetate at 23°Cresistant
OtherMethyl chloride at 23°Cresistant
OtherMethyl ethyl ketone at 23°Cresistant
OtherMethyl formate at 23°Cresistant
OtherMethyl glycol at 23°Cresistant
OtherMethylamine at 23°Cresistant
OtherMethylaniline at 23°Cresistant
OtherMethylbromide at 23°Cresistant
OtherMethylene chloride at 23°Cresistant
OtherMethylpyrrolidone at 23°Cresistant
OtherMilk at 23°Cresistant
Mineral oilsMotor oil OS206 304 Ref.Eng.Oil, ISP at 135°Cresistant
Othern-Butyl ether at 23°Cresistant
Othern-Butyl glycol at 23°Cresistant
Hydrocarbonsn-Hexane at 23°Cresistant
OtherNaphtha at 23°Cresistant
OtherNaphthalene at 23°Cresistant
OtherNaphthalenesulfonic acids at 23°Cresistant
OtherNaphthenic acids at 23°Cresistant
OtherNaphthols at 23°Cresistant
OtherNickel nitrate (10% by mass) at 23°Cresistant
OtherNickel salts (10% by mass) at 23°Cresistant
OtherNitric acid (10% by mass) at 23°Cresistant
OtherNitric acid (2% by mass) at 23°Cresistant
OtherNitric acid (20% by mass) at 23°Cresistant
AcidsNitric Acid (40% by mass) at 23°Cresistant
OtherNitric acid (conc.% by mass) at 23°Cresistant
OtherNitrobenzene at 23°Cresistant
OtherNitrobenzene at >100°Cresistant
OtherNitrocellulose lacquers (alcoholic) at 23°Cresistant
OtherNitrocellulose lacquers (non-alcoholic) at 23°Cresistant
OtherNitrogen oxides at 23°Cresistant
OtherNitromethane at 23°Cresistant
OtherNitropropane at 23°Cresistant
OtherNitrotoluene at 23°Cresistant
OtherNitrotoluene at >100°Cresistant
OtherNitrous fumes at 23°Cresistant
OtherNitrous oxide at 23°Cresistant
OtherOctane at 23°Cresistant
OtherOctene at 23°Cresistant
OtherOil (Burmah TAF 21) at 23°Cresistant
OtherOil (Castrol TAF) at 23°Cresistant
OtherOil (Shell 10W40) at 23°Cresistant
OtherOil (Shell Dexron ATF) at 23°Cresistant
OtherOil (Shell Spirax EP90) at 23°Cresistant
OtherOil (transformers, switchgear) at 50°Cresistant
OtherOils (vegatable, mineral, ethereal) at 23°Cresistant
OtherOleic acid at 23°Cresistant
OtherOleum (H2SO4+SO3) at 23°Cresistant
OtherOxalic acid (10% by mass) at 23°Cresistant
OtherOxalic acid (10% by mass) at 80°Cresistant
OtherOzone at 23°Cresistant
OtherPaint solvents at 23°Cresistant
OtherPalmatic acid at 80°Cresistant
OtherParaffin at 23°Cresistant
OtherPentane at 23°Cresistant
OtherPentasin CHF 11 (S) at 23°Cresistant
OtherPentasin CHF 7.1 at 23°Cresistant
OtherPeracetic acid at 23°Cresistant
OtherPerchloric acid (10% by mass) at 23°Cresistant
OtherPerchloric acid (conc.% by mass) at 23°Cresistant
OtherPerchloro ethylene at 23°Cresistant
OtherPetroleum at 23°Cresistant
OtherPetroleum ether and solvents at 80°Cresistant
OtherPhenol (alc. sol.) (70% by mass) at 23°Cresistant
OtherPhenol (conc.% by mass) at 23°Cresistant
OtherPhenol at >40°Cresistant
OtherPhenol solution (5% by mass) at 23°Cresistant
OtherPhenyl ether at 23°Cresistant
OtherPhenyl ethyl alcohol at 23°Cresistant
OtherPhenyl ethyl alcohol at >160°Cnot resistant
OtherPhosphate sol. (neutral, alkaline) (10% by mass) at 23°Cresistant
OtherPhosphine at 23°Cresistant
OtherPhosphoric acid (10% by mass) at 23°Cresistant
OtherPhosphoric acid (3% by mass) at 23°Cresistant
OtherPhosphoric acid (conc.% by mass) at 23°Cresistant
OtherPhosphorous acid (conc.% by mass) at 23°Cresistant
OtherPhosphorous oxychloride at 23°Cresistant
OtherPhosphorous trichloride at 23°Cresistant
OtherPhthalic acid (saturated) at 23°Cresistant
OtherPolyols at 23°Cresistant
OtherPotassium bromide (10% by mass) at 23°Cresistant
OtherPotassium bromide (saturated) at 23°Cresistant
OtherPotassium carbonate (saturated) at 23°Cresistant
OtherPotassium chloride (10% by mass) at 23°Cresistant
OtherPotassium chloride (10% by mass) at 70°Cresistant
OtherPotassium chloride (saturated) at 23°Cresistant
OtherPotassium cyanide at 23°Cresistant
OtherPotassium dichromate (5% by mass) at 23°Cresistant
OtherPotassium dichromate (saturated) at 23°Cresistant
OtherPotassium hydroxide (50% by mass) at 23°Cresistant
OtherPotassium nitrate (10% by mass) at 23°Cresistant
OtherPotassium perchlorate (10% by mass) at 23°Cresistant
OtherPotassium permanganate (1% by mass) at 23°Cresistant
OtherPotassium permanganate (10% by mass) at 23°Cresistant
OtherPotassium persulphate (10% by mass) at 23°Cresistant
OtherPotassium rhodanide (saturated) at 23°Cresistant
OtherPotassium thiocyanate (saturated) at 23°Cresistant
OtherPropane at 23°Cresistant
OtherPropanol at 23°Cresistant
OtherPropanol at >100°Cresistant
OtherPropene at 23°Cresistant
OtherPropionic acid (20% by mass) at 23°Cresistant
OtherPropionic acid (5% by mass) at 23°Cresistant
OtherPropionic acid (50% by mass) at 23°Cresistant
OtherPyridine at 23°Cresistant
OtherPyridine at 80°Cresistant
OtherPyrocatechol at 23°Cresistant
OtherPyrrolidone at 23°Cresistant
OtherPyruvic acid (10% by mass) at 23°Cresistant
OtherRainwater (acidic) at 23°Cresistant
OtherRapeseed oil at 23°Cresistant
OtherRefrigerator oil at 23°Cresistant
OtherResorcinol (alcoholic) (1% by mass) at 23°Cresistant
OtherResorcinol (alcoholic) (50% by mass) at 23°Cresistant
OtherRoad salts at 23°Cresistant
Mineral oilsSAE 10W40 multigrade motor oil at 130°Cresistant
Mineral oilsSAE 10W40 multigrade motor oil at 23°Cresistant
OtherSAE 80 at 23°Cresistant
Mineral oilsSAE 80/90 hypoid-gear oil at 130°Cresistant
OtherSalicylic acid (saturated) at 23°Cresistant
OtherSeawater at 23°Cresistant
OtherSewing machine oil at 23°Cresistant
OtherSilane at 23°Cresistant
OtherSilicone oils at <80°Cresistant
OtherSilicone oils at >100°Cresistant
OtherSilver nitrate (10% by mass) at 23°Cresistant
OtherSoap solution (10% by mass) at 80°Cresistant
OtherSodium
Machinery for Injection Molding

Xytron™ grades can be processed on general injection molding machines.
Screw Geometry

  • Typically 3-zone screw designs with volumetric compression ratios of approximately 2.5 work fine.

Steel Type

  • Abrasive-resistant steel types which are generally used for glass fiber reinforced, high temperature, polyamide or PPS materials are also to be used for the Xytron™ grades in tools, nozzles and screws. Failing to do so may result in wear, especially of the screw/barrel (due to the high temperatures involved there), which can lead to decreasing processing performance.

Nozzle Temperature Control

  • The use of an open nozzle with good temperature control and an independently-controlled thermocouple nearby the tip and heater bands with sufficient output is recommended.

Hot Runner Layout

  • Try to achieve a close contact with your hot runner supplier and Envalior as the material supplier, to be sure that the right hot runner system is chosen.
  • When processing Xytron™ with hot runners, keep in mind these basic rules:
  1. Central bushing heated separately
  2. Only use external heated system
  3. Manifold heated from both sides
  4. Tip with thermocouple in front (near gate)
  5. Very accurate temperature control in the gate area
Dynamic Shear Modulus (G)-Temperature

DSM Engineering Materials Xytron G3080R Dynamic Shear Modulus (G)-Temperature

Temperature Settings for Injection Molding

Mold Temperature

  • Xytron™ can be used with a wide range of tool temperatures (140 - 150°C / 284 - 302°F). However, we recommend a low mold temperature for parts with thick walls and a high mold temperature for good dimensional stability, flow properties and surface esthetics.

Barrel Temperature

  • Optimal settings are governed by barrel size and residence time. Furthermore, the level of glass and/or mineral reinforcement has to be taken into account.

Xytron™ G3080R - Temperature Settings For Injection Molding

 

Mold/Tool Measured melt Nozzle Front Center Rear
140 - 150°C
284 - 302°F
310-340°C
590-644°F
310-340°C
590-644°F
320-340°C
608-644°F
310-330°C
590-626°F
300-320°C
572-608°F

Melt Temperature

  • To generate a good and homogeneous melt, the melt temperature should always be above 310°C / 590°F. Optimal mechanical properties will be achieved at melt temperatures between 310-340°C / 590-644°F.
  • We advise to frequently measure the melt temperature by pouring the melt in a Teflon cup and inserting a thermo probe into the melt.

Hot Runner Temperature

  • A hot runner temperature set to the same level as the nozzle temperature should work fine and not lead to excessive overheat of the Xytron™ grade. When starting up, an increased tip temperature may be necessary to overcome a frozen nozzle.
Stress-Strain

DSM Engineering Materials Xytron G3080R Stress-Strain

Viscosity-Shear Rate

DSM Engineering Materials Xytron G3080R Viscosity-Shear Rate

General Processing Settings for Injection Molding

Screw Rotation Speed

  • To realize a good and homogeneous melt, it is advised to set a screw rotation speed resulting in a plasticizing time that is just within the cooling time.
  • The rotational speed of the screw should not exceed 6500 / D RPM (where D is the screw diameter in mm).

Back Pressure

  • Back pressure should be between 30-100 bars effective. Keep it low in order to prevent nozzle-drooling, excessive shear heating and long plasticizing times.

Decompression

  • In order to prevent nozzle drool after plasticizing and retracting the nozzle from the mold, a short decompression stroke can be used. However, to prevent oxidation of the melt, which may result in surface defects on the parts, it is recommended to keep this as short as possible.

Injection Speed

  • Moderate to high injection speeds are required in order to prevent premature crystallization in the mold during injection phase and to obtain a better surface finish. The recommended injection speed profile goes from fast (for sprue and runner filling) to medium (for part filling) to avoid excessive shear heating and allow air to escape from the mold. Adequate mold venting is required to avoid burning at the end of the flow path (due to diesel effect).

Injection Pressure

  • The real injection pressure is the result of the flowability of the material (crystallization rate, flow length, wall thickness, filling speed). The set injection pressure should be high enough to maintain the set injection speed (use set injection pressure higher than the peak pressure if possible). Tooling air vents must be effective to allow optimum filling pressure and prevent burn marks.

Holding Time

  • Effective holding time is determined by part thickness and gate size. Holding time should be maintained until a constant product weight is achieved.

Holding Pressure

  • The most adequate holding pressure is the level whereby no sinkmarks or flash are visible. A too high holding pressure can lead to stresses in the part.

Cooling Time

  • Actual cooling time will depend on part geometry and dimensional quality requirements as well as the tool design (gate size).
Melt Residence Time for Injection Molding

The optimal Melt Residence Time (MRT) for Xytron™ G3080R is ≤ 6 minutes with preferably at least 50% of the maximal shot volume used. The MRT should not exceed 8 minutes.

A formula to estimate the MRT is described below:
𝑀𝑅𝑇 = (∏D³ρ/m) * (t/60)
Whereas:
MRT = Melt Residence Time [minutes]
D = Screw Diameter [cm]
p = Melt Density [g/cm3]
m = Shot Weight [g]
t = Cycle Time [s]

Please note: In the calculation above, the hotrunner volume has not been taken into account. When a hotrunner is part of the setup, please add the hotrunner volume to the calculation.

Startup/Shut Down/Cleaning for Injection Molding
  • Production has to be started and stopped with a clean machine. Cleaning can be done with PA6-GF or PA66-GF, applicable cleaning agents or HDPE. Hot runners can also be cleaned and put out of production cleaning them with PA6-GF or PA66-GF.
Production Breaks for Injection Molding
  • During production breaks longer than a few minutes, we advise emptying the barrel. The temperature of the barrel and the hot runner [if applicable) should be reduced to a level far enough below the melting point of the compound in order to stop decomposition of the compound.
  • When the hot runner, nozzle, or even the screw is blocked, be aware that under these conditions a sudden outburst of molten material can take place. Always wear personal safety protections for hand/eye/body.

Packaging & Availability

Storage & Handling

Material Handling for Injection Molding

Storage

  • In order to prevent contamination, supplied packaging should be kept closed and undamaged. For the same reason, partial bags should be re-closed before re-storage.
  • Allow the material that has been stored elsewhere to adapt to the temperature in the processing room while keeping the bag closed.

Packaging

  • Xytron™ grades are supplied in polyethylene bags.

Moisture Content as Delivered

  • Xytron™ PPS grades show hardly any moisture pick up. The moisture content is not specified.

Conditioning Before Molding

  • To prevent moisture condensing on granules, bring cold granules up to ambient temperature in the molding shop while keeping the packaging closed.

Moisture Content Before Molding

  • Since Xytron™ has a low moisture pick up and is not hygroscopic, still the advise is to dry Xytron™ G3080R for a short time. The advisable moisture level before molding is maximum 500 ppm.

Drying

  • Hot air ovens or hopper driers can be used for pre-drying Xytron™ grades, however preferred driers are dehumidified driers with dew points maintained between -30 and -40°C / -22 and -40°F. Vacuum driers with N₂ purge can also be used.
Moisture content Time Temperature
[%] [h] [°c] [°F]
as delivered 2-6 130-140 266-284

Regrind

  • Regrind can be used taking into account that this regrind must be clean/low dust content/not thermally degraded/dry, of same composition and similar particle size as the original material. The acceptable level of regrind depends on the application requirements (e.g. UL Yellow Card). Be aware that regrind can cause some small color deviations.