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DISPARLON® 6100

1 of 81 products in this brand
DISPARLON® 6100 is a powdered thixotropic agent based on amide wax. Lowest activation temperature required to build a strong thixotropic network which prevents slumping of sealants and adhesives. Especially suited for MMA/MS polymer sealants.

Functions: Rheology Modifier, Thixotrope

Chemical Family: Amides, Waxes

End Uses: 2K (2 component) Coating

Compatible Polymers & Resins: Epoxies (EP), Polyurethanes (PU), Silicones

Physical Form: Powder, Solid

Technical Data Sheet
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Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies

Features & Benefits

Advantages
  • Easily imparts strong anti-slumping property by dispersed with heat.
  • Give uniform adhesion by preventing slumping.
  • Composed of 100% organic matter, still these products can provide good handling at the application and manufacturing process.

Applications & Uses

Compatible Polymers & Resins
Cure Method
Use Level
0.5 - 5 wt. % (Total Formulation)
Applications
  • Recommended for sealants (Modified silicone, Urethane, etc) and Epoxy adhesive systems.
  • Especially DISPARLON 6100 is recommended when lower activation temperature is preferred.
Incorporation
  • Dispersing equipment : Kneader, Planetary mixer or Twin screw extruder is recommended.
  • Dispersing temperature : Adjust the temperature in the range of 50~120℃. However, dispersing temperature is depending on the resin and other components. We therefore recommend 50~80℃.

Properties

Physical Form
Appearance
White to light yellow fine powder
Typical Properties
ValueUnitsTest Method / Conditions
Non Volatile Mattermin. 98wt. %
Melting Point124°C
Bulk Density0.15
Particle Sizemax. 15μm
Density1g/cm³