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DISPARLON® 6200

1 of 81 products in this brand
DISPARLON® 6200 is a powdered thixotropic agent based on amide wax. The low activation temperature required to build a strong thixotropic network prevents slumping of sealants and adhesives. It is especially effective in MS polymer and epoxy systems.

Functions: Rheology Modifier, Thixotrope

Chemical Family: Amides, Waxes

Compatible Polymers & Resins: Epoxies (EP), Polyurethanes (PU), Silicones

Physical Form: Powder, Solid

Technical Data Sheet
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Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies

Features & Benefits

Advantages
  • Easily imparts strong anti-slumping property by dispersed with heat.
  • Give uniform adhesion by preventing slumping.
  • Composed of 100% organic matter, still these products can provide good handling at the application and manufacturing process.

Applications & Uses

Compatible Polymers & Resins
Cure Method
Applications

Recommended for sealants (Modified silicone, Urethane, etc) and Epoxy adhesive systems.

Incorporation

Additive levels : 0.5~5.0% by total formulation. This recommended level can be used for orientation. The optimal level should be determined by your laboratory tests.

Dispersing equipment : Kneader, Planetary mixer or Twin screw extruder is recommended.

Dispersing temperature : Adjust the temperature in the range of 50~120 ℃. However, dispersing temperature is depending on the resin and other components. We therefore recommend 50~100 ℃.

Properties

Physical Form
Appearance
White to light yellow powder
Typical Properties
ValueUnitsTest Method / Conditions
Non Volatile Mattermin. 98wt. %
Melting Point128°C
Bulk Density0.15
Particle Sizemax. 15μm
Density1.01g/cm³