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MG Chemicals 832FX - Black Flexible Epoxy

Black Flexible Epoxy, Encapsulating & Potting Compound 832FX is a black, 2-part, flexible epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It performs well in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

Product Type: 2K (2 component) Sealant, Epoxy Sealant, Potting Compound

Compatible Substrates & Surfaces: Ceramic, Composites, Glass, Metal, Plastics

Chemical Family: Epoxy & Epoxy Derivatives

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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Labeling Claims
Features & Benefits
  • Very low mixed viscosity of 700 cP
  • Good adhesion to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics
  • Excellent electrical insulating characteristics
  • Extreme resistance to water and humidity (allows for submersion where needed)
  • Solvent-free
Recommended Preparation
Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues.

Applications & Uses

Compatible Substrates & Surfaces
Mixing
  1. Scrape settled material free from the bottom and sides of the part A container; stir the contents until homogenous. Use a paint shaker if available.
  2. Measure 2 parts by volume of the part A and pour into the mixing container. Ensure all contents are transferred by scraping the container.
  3. Measure 1 part by volume of the part B and pour into the mixing container. Ensure all contents are transferred by scraping the container.
  4. Thoroughly and gently mix parts A and B together. Avoid introducing air bubbles.
  5. To de-air, let sit for 15 minutes or put in a vacuum chamber at 25 inHg for 2 minutes.
  6. If bubbles are present at the top, break them gently with the mixing paddle.
  7. Pour the mixture into a container holding the components to be protected.
  8. Close the part A and B containers tightly between uses to prevent skinning.

Mixing >500 g at a time decreases working life and can lead to a flash cure. Limit the size of hand-mixed batches. For large production volumes, contact MG Chemicals Technical Support for assistance.

Properties

Cured Properties
ValueUnitsTest Method / Conditions
Breakdown Voltage36300V
CTE (Prior Tg)114ppm/˚C
CTE (After Tg)218ppm/˚C
Dielectric Constant (at 1 MHz)3.1
Dielectric Strength370V/mil
Dissipation Factor (at 1 MHz)0.05
Glass Transition Temperature (Tg)8.8˚C
Hardness A88
Intermittent Temperature-50 to 150˚C
Lap Shear (aluminum)3.4N/mm2
Lap Shear (Stainless Steel)2.5N/mm2
Mix Ratio1:1Volume
Mixed Density1.06g/mL
Resistivity5.8 x 10¹²Ω·cm
Service Temperature Range-40 to 140˚C
Tensile Strength9.6N/mm2
Thermal Conductivity (at 25 ˚C)0.3W/(m·K)
Viscosity (at 25 ˚C) ⁽ᵃ⁾0.8Pa·s
Working Time2.5h
Uncured Properties
ValueUnitsTest Method / Conditions
Mix Ratio1.22:1Weight
Viscosity (at 25 ˚C) ⁽ᵇ⁾0.17Pa·s
Cure Instructions

Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:

Temperature 45 °C 65 °C 80 °C 100 °C
Time 5 h 2 h 1 h 30 min

 

Regulatory & Compliance

Technical Details & Test Data

Viscosity vs. Temperature

MG Chemicals 832FX - Black Flexible Epoxy - Viscosity Vs. Temperature

Packaging & Availability

Packaging Type
Available Packaging
Cat. No. Packaging Net Vol. Net Wt.
832FX-450ML 2 Bottle kit 450 mL 475 g
832FX-1.7L 2 Can kit 1.7 L 1.79 kg
832FX-7.4L 2 Pail kit 7.4 L 7.82 kg
832FX-7.4L 2 Pail kit 40 L 42.2 kg

Storage & Handling

Shelf Life
5 Years
Storage and Handling
Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS).