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PERMABOND® ES569

1 of 20 products in this brand
PERMABOND® ES569 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace mechanical fastening, soldering, brazing or welding. ES569 has been designed to be non-sagging, allowing the product to be used in large gaps and on vertical surfaces. It is also ideal for bonding electronic components as it has high wet strength and is non-stringing and produces an excellent drop profile as well as withstanding solder reflow processes.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Composites, Metal

Cure Method: Heat Cure

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Features & Benefits
  • Excellent adhesive strength
  • Excellent resistance to vibration
  • Easy to use – no mixing required
  • High shear and peel strength
  • High temperature resistance
  • Good resistance to chemicals
  • Non-sag, thixotropic

Applications & Uses

Compatible Substrates & Surfaces
Cure Method
Surface Preparation

Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces. Some metals such as aluminum, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.

Directions for Use
  • The adhesive should be dispensed from the bottle via the nozzle supplied (this can be cut to give the appropriate sized bead to cover the bond area).
  • Apply the adhesive to one surface and avoid entrapping air.
  • Assemble parts applying sufficient pressure to ensure the adhesive spreads to cover the entire bond area.
  • Use a jig / clamp to prevent parts moving during cure.
  • It is advisable not to disturb the joint until the adhesive is fully cured.
  • Cure with heat – see page one for cure schedule.

Properties

Physical Form

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Physical Properties of Uncured Adhesive
Chemical composition Epoxy Resin
Appearance Black paste
Viscosity at 25°C 250,000 to 500,000 mPa.s (cP)
Specific gravity 1.2
Typical Curing Properties
Flow at high temperature No flow, high wet strength
Maximum gap fill 5 mm 0.2 in
Cure speed (oven) * 130° C (266°F): 75 minutes
150°C (300°F): 60 minutes
170°C (338°F): 40 minutes
Cure speed (induction) <3 minutes
Typical Performance of Cured Adhesive
Shear strength* (ISO4587)

Steel 27 – 41 N/mm² (4000 – 6000 psi)
Aluminum 17 - 31 N/mm² (2500 – 4500 psi)
Zinc 14 - 27 N/mm² (2000 – 4000 psi)
FRP Glass/Epoxy 9-11 N/mm² (1300–1600psi)
Carbon Fiber 10-12 N/mm² (1450–1700psi)

Peel strength (aluminum) (ISO 4578) 100-120 N/25mm
Hardness (ISO868) 80-85 Shore D
Coefficient of thermal expansion 90 x 10-6 mm/mm/°C (under Tg)
180 x 10-6 mm/mm/°C (above Tg)
Thermal conductivity 0.5 W/(m.K)
Glass transition temperature (Tg – DSC) 130°C (266°F)

 

Hot Strength

PERMABOND® ES569 - Hot Strength

then conditioned to pull temperature for 30 minutes before testing.
ES569 can withstand higher temperatures for brief periods (such as for paint baking and wave soldering processes) providing the joint is not unduly stressed.
The minimum temperature the cured adhesive can be exposed to is -40°C (-40°F) depending on the materials being bonded.

Chemical Resistance

PERMABOND® ES569 - Chemical Resistance

Specimens were immersed for 30 days at 85ºC and tested at room temperature.

Storage & Handling

Storage Temperature

2 to 7°C (35 to 45°F)