PERMABOND - ES578 - Permabond - 1K (1 component) Adhesive

Knowde Enhanced TDS

Identification & Functionality

Chemical Family: Epoxy & Epoxy Derivatives
Product Type: 1K (1 component) Adhesive,
Epoxy Adhesive
Technologies: Ready-to-Use Products
Product Families: Ready-to-Use Products — Adhesives & Sealants
Structural Adhesives

Features & Benefits

Ready-to-Use Product Features: Chemical Resistant,
Electrically Insulating,
Good Adhesion,
Good Bonding Strength,
Good Thermal Conductivity,
Temperature Resistance
Features & Benefits: Very good thermal conductivity

Excellent resistance to vibration

Easy to use – no mixing required

High shear and peel strength

High temperature resistance

Good resistance to chemicals

Electrically insulating

Applications & Uses

Markets: Adhesives & Sealants
Applications: Adhesives & Sealants — Other Adhesives & Sealants Applications
Compatible Substrates & Surfaces: Aluminum,
Ceramic,
Composites,
Metal
Cure Method: Heat Cure
Surface Preparation: Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces. Some metals such as aluminum, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.
Directions for Use: The adhesive should be dispensed from the bottle via the nozzle supplied (this can be cut to give the appropriate sized bead to cover the bond area).

Apply the adhesive to one surface and avoid entrapping air.

Assemble parts applying sufficient pressure to ensure the adhesive spreads to cover the entire bond area.

Use a jig / clamp to prevent parts moving during cure.

It is advisable not to disturb the joint until the adhesive is fully cured.

Cure with heat – see page one for cure schedule.

Regulatory & Compliance

Technical Details & Test Data

Physical Properties of Uncured Adhesive: Chemical composition Epoxy Resin

Appearance Black

Viscosity at 25°C 600,000 to 800,000 mPa.s (cP)

Specific gravity 1.6
Typical Curing Properties: Flow at high temperature Flowing

Maximum gap fill 5 mm 0.2 in

Cure speed (oven) * 130° C (266°F): 75 minutes
150°C (300°F): 60 minutes
170°C (338°F): 40 minutes

Cure speed (induction) <3 minutes
Typical Performance of Cured Adhesive: Shear strength* (ISO4587)
Steel 27 – 41 N/mm² (4000 – 6000 psi)
Aluminum 17 - 31 N/mm² (2500 – 4500 psi)
Zinc 14 - 27 N/mm² (2000 – 4000 psi)

Hardness (ISO868) 80-85 Shore D

Coefficient of thermal expansion 45 x 10-6 mm/mm/°C (below Tg)

Thermal conductivity 1.0 W/(m.K)

Dielectric strength 40-45 kV/mm

Glass transition temperature (Tg – DSC) 105°C (220°F)
Hot Strength: “Hot strength” shear strength tests performed on mild steel. Fully cured then conditioned to pull temperature for 30 minutes before testing.
ES578 can withstand higher temperatures for brief periods (such as for paint baking and wave soldering processes) providing the joint is not unduly stressed.
The minimum temperature the cured adhesive can be exposed to is -40°C (-40°F) depending on the materials being bonded.
Chemical Resistance: Specimens were immersed for 30 days at 85ºC and tested at room temperature.

Storage & Handling

Flow at high temperature	Flowing
Maximum gap fill	5 mm 0.2 in
Cure speed (oven) *	130° C (266°F): 75 minutes 150°C (300°F): 60 minutes 170°C (338°F): 40 minutes
Cure speed (induction)	<3 minutes

Shear strength* (ISO4587)	Steel 27 – 41 N/mm² (4000 – 6000 psi) Aluminum 17 - 31 N/mm² (2500 – 4500 psi) Zinc 14 - 27 N/mm² (2000 – 4000 psi)
Hardness (ISO868)	80-85 Shore D
Coefficient of thermal expansion	45 x 10-6 mm/mm/°C (below Tg)
Thermal conductivity	1.0 W/(m.K)
Dielectric strength	40-45 kV/mm
Glass transition temperature (Tg – DSC)	105°C (220°F)