Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Features & Benefits
Adhesion to a wide variety of substrates
Full cure at room temperature
Easy to apply
Self-leveling
Ideal for electronic potting & encapsulation applications
Applications & Uses
- Applications
- Compatible Substrates & Surfaces
- Cure Method
- Directions for Use
- Measure volumetrically 2 parts resin to 1 part hardener. Mix thoroughly taking care not to entrap air. Adhesive can be applied and mixed by automated dispensing equipment. If using cartridges, put cartridge in dispensing gun and affix static mixing nozzle.
- Apply material. If potting; take care to fill component and not entrap air.
- If bonding a joint, assemble the parts. Parts must be joined within 20-50 minutes of mixing the two epoxy components.
- Large quantities and/or higher temperature will decrease the usable life or pot life.
- Apply pressure to the assembly by clamping for 105-120 minutes or until handling strength is obtained.
- Full cure will be obtained after a minimum of 72 hours at 25°C (77°F). Heat can be used to accelerate the curing process.
- Additional Information
This product is not recommended for use in contact with strong oxidizing materials.
Information regarding the safe handling of this material may be obtained from the safety data sheet.
Users are reminded that all materials, whether innocuous or not, should be handled in accordance with the principles of good industrial hygiene.- Surface Preparation
Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces. Some metals such as aluminum, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Physical Properties of Uncured Adhesive
Chemical composition MT382A MT382B Appearance Epoxy Resin Polyamine based Hardener
Mixed appearance Black Yellow Viscosity At 25°C Charcoal black Mixed appearance 20,000 – 45,000 mPa.s (cP) 200-400 mPa.s (cP)
Specific gravity 1.3 1 - Typical Curing Properties
Mix ratio 2:1 by volume Maximum gap fill 130:50 by weight Usable / pot lifeat 25°C 0.5 mm 0.02 in Handling time to 20-50 mins 0.1 N/mm²at 25°C 105-120 mins Full cureat 25°C ≥72 hours - Electrical Properties Curing Properties
Linear Coefficient of Thermal Expansion 112 x 10 -6 m/m C (below Tg)
170 x 10 -6 m/m C (above Tg)Dielectric Constant 6 Dielectric Strength 20 - 30 kV/ mm Volume Resistivity 1 - 3 x 1011 Ohm-cm
- Typical Performance of Cured Adhesive
Shear strength ISO4587 Mild steel: 4-7 N/mm² (600 - 1000psi)
Aluminum: 6-8 N/mm² (900-1200psi)
ABS: 4-6 N/mm² (600-900psi)
Acrylic: 2-5 N/mm² (300-700psi)
Nylon: 2-4 N/mm² (300-600psi)
Polycarbonate: 4-6 N/mm² (600-900psi)
PVC: 3-5 N/mm² (400-700psi)
FRP Glass Epoxy: 5-7 N/mm² (700-1000psi)
FRP Glass Polyester: 5-7 N/mm² (700-1000psi)
Carbon Fiber: 6-8 N/mm² (600-1200psi)Hardness (ISO868) 55-85 Shore A
20-30 Shore DElongation at break (ISO37) 150 -200% Peel strength (aluminum (ISO4578) 140-160 N/25mm (31-36 PIW)
Thermal conductivity 0.47 W/(m.K) - Strength Development
Graph shows typical strength development of bonded components at 23°C. Curing at higher or lower temperatures may affect cure speed.- Hot Strength
“Hot strength” shear strength tests performed on mild steel. Fully cured specimens conditioned to pull temperature for 30 minutes before testing at temperature.
MT382 can withstand higher temperatures for brief periods (such as for paint baking and wave soldering processes) providing the joint is not unduly stressed. The minimum temperature the cured adhesive can be exposed to is -40°C
(-40°F) depending on the materials being bonded.
Storage & Handling
- Storage Temperature
5 to 25°C (41 to 77°F)