Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Features & Benefits
- Adhesion to a wide variety of substrates
- Fast cure at room temperature
- No mix application
- High shear and peel strength
- Good impact strength
- Good chemical resistance
- Product Highlights
Permabond TA430 provides high strength while maintaining excellent flexibility, resulting in tough, durable bonds with outstanding impact and peel resistance. Handling strength is achieved in a few minutes at room temperature by using Permabond Initiator 41.
Applications & Uses
- Markets
- Cure Method
- Additional Information
This product is not recommended for use in contact with strong oxidizing materials. This product may affect some thermoplastics and users must check compatibility of the product with such substrates.
Information regarding the safe handling of this material may be obtained from the Safety Data Sheet.
Users are reminded that all materials, whether innocuous or not, should be handled in accordance with the principles of good industrial hygiene.- Surface Preparation
Surfaces should be clean, dry and grease-free before applying the adhesive. Permabond Cleaner A is recommended for the degreasing of most surfaces. Some metals such as aluminum, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.
- Directions for Use
- Surfaces must be clean, dry and grease-free. Apply Initiator 41 to one surface.
- Apply adhesive to the other surface.
- Assemble the components using sufficient force to spread the adhesive thinly. Parts should be bonded immediately and within a maximum of two hours of applying the Initiator.
- Maintain pressure until handling strength is achieved. The time required will vary according to the joint design, gap and surfaces being bonded.
- Allow 24 hours for adhesive to fully cure. Accelerated cure times may be achieved by heating.
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Physical Properties of Uncured Adhesive
Chemical composition Modified acrylic – solvent free
Appearance Transparent amber liquid
Viscosity at 25°C 20rpm: 15,000 – 30,000 mPa.s (cP)
2.5rpm: 45,000 – 80,000 mPa.s (cP)Specific gravity (resin) 1.1 - Typical Performance of Cured Adhesive
Shear strength (ISO4587)* Mild steel: 15-25 N/mm (2200-3600 psi)
Zinc: 10-15 N/mm² (1450-2200 psi)Peel strength (aluminum) (ISO 4578) 45-65 N/25mm (10-14 PIW)
Tensile strength (ISO37) 25N/mm² (3600 psi)
Impact strength (ASTM D-950) 10-15 kJ/m² Coefficient of thermal expansion (ASTM D-696) 80 x 10-6 1/K Thermal conductivity (ASTM C-177) 0.1 W/(m.K) Dielectric constant (ASTM D-150) 4.6 Dielectric strength (ASTM D-149) 30-50 kV/mm Volume resistivity (ASTM D-257) 2 x 1013 Ohm.cm
- Typical Curing Properties (with Initiator 41)
Ratio of use 10:1.5 approximately
Maximum gap fill 0.5 mm (0.02 in) Fixture time (zinc) at 23°C* 1-2 mins Handling time (zinc)
(0.3 N/mm² shear strength is achieved) at 23°C*3-5 mins Working strength (zinc) at 23°C* 40-60 mins Full cure at 23°C 24 hours - Environmental Resistance
All values were generated on as received steel lap shears as described in ISO4587. Adhesive was cured at room temperature for 48 hours prior to environmental exposure. Test pieces were assembled with no induced gap and subjected to continuous exposure for 1000 hours at the testing temperature and then the shear strength was tested at room temperature.
1000 hours % strength retention 95°C 110% * 120°C 118% * 150°C 132% * 175°C 127% * 205°C 87% - Strength Development
Graph shows typical strength development of bonded components at 23°C. Curing at higher or lower temperatures may affect cure speed.
- Hot Strength
Hot strength” shear strength tests performed on mild steel. Fully cured specimens conditioned to pull temperature for 30 minutes before testing at temperature.
TA430 can withstand higher temperatures for brief periods (such as for paint baking and wave soldering processes) providing the joint is not unduly stressed. The minimum temperature the cured adhesive can be exposed to is -55°C (-65°F) depending on the materials being bonded.- Chemical Resistance
Specimens were immersed for 30 days at 85ºC and tested at room temperature.