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Polytec TC 351 is a single component, thermally conductive epoxy with good thermal conductivity and excellent resistance towards moisture and chemicals. It was designed for all applications where electrically insulating and thermally conductive bonds are desirable. Polytec TC 351 has a conveniently long pot and shelf life. Typical applications are bonding of sensors in metal holders and fixation of single devices on PCBs. Due to the long pot and shelf life it is ideal for high volume dispensing techniques. The material can be applied by dispensing, screen or stencil printing.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive

Application Area: Printed Circuit Boards

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Processing
  • For two component products the components A and B should be mixed carefully within the specified mixing ratio
  • For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler
  • Processing should be carried out rapidly after mixing the components as an indication the pot life can be used
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products)
  • Please take notice of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (120°C)45.0Minutes
Curing Time (150°C)10.0Minutes
Curing Temperaturemin. 120°C
Cured Properties
ValueUnitsTest Method / Conditions
Degradation Temperature350.0°CTM 302
Dielectric Strengthmin. 30kV/mm
Elongation at Break0.7%TM 605
Glass Transition Temperature (Tg)87.0°CTM 501
Hardness85.0Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)20.0N/mm²TM 604
Temperature Resistance Continuous-55 to 200°CTM 302
Temperature Resistance Short Term-55 to 300°CTM 302
Tensile Strength56.0N/mm²TM 605
Thermal Conductivity0.7 - 0.9W/m.KTM 502
Water Absorption (24h, 23°C)0.11%TM 301
Young Modulus11000.0N/mm²TM 605
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy
ConsistencyCreamy PasteTM 101
Density (Mix)1.9g/cm³TM 201.2
Particle Sizemax. 45μm
Number of Components1.0
Type of FillerAluminiumoxide
Viscosity Mix (84s⁻¹, 23°C)65000.0mPa.sTM 202.1
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Packaging & Availability

Standard Pack Sizes
  • 30cc / 60 g
  • 250 g, 500 g
  • 1 kg, 25 kg
  • Customized Packaging

Storage & Handling

Pot Life (23°C)
1 Months
Storage Stability (6-8°C)
6 Months