Products

Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.

Polytec TC 301 is a standard single component metal filled, heat curing epoxy adhesive with excellent thermal conductivity. Polytec TC 301 was designed for all applications where heat transfer is essential (heat sinking, aluminum or ceramic packaging etc. It has a conveniently long pot and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.

Polytec TC 351 is a single component, thermally conductive epoxy with good thermal conductivity and excellent resistance towards moisture and chemicals. It was designed for all applications where electrically insulating and thermally conductive bonds are desirable. Polytec TC 351 has a conveniently long pot and shelf life. Typical applications are bonding of sensors in metal holders and fixation of single devices on PCBs. Due to the long pot and shelf life it is ideal for high volume dispensing techniques. The material can be applied by dispensing, screen or stencil printing.

Polytec TC 432 is a thixotropic, two component, highly thermally conductive, electrically insulating epoxy for thermal management in micro and power electronics, energy engineering etc. Polytec TC 432 has an excellent adhesion to ceramic, glass, semiconductor materials, ferrous and non ferrous metals and most plastics. The material can be applied via dispensing, screen printing, or manual application.

Polytec TC 417 2 is a two component, thermally conductive, electrically insulating epoxy It is used in various thermal management applications, especially for potting of large volumes. Polytec TC 417 2 has an excellent chemical and moisture resistance It has an excellent adhesion to glass, metal, ceramic, FR 4 and most plastics. The room temperature cure allows to bond temperature sensitive substrates very conveniently The material can be applied via dispensing or manual application.

Polytec TC 406 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 406 has a good thermal resistance as well an excellent thermal conductivity. The application can be performed directly from the side by side cartridge with a static mixing nozzle, using a dispensing gun.

Polytec TC 411 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.

Polytec EC 151-L is a standard two- component, solvent free epoxy resin optimized for stamping application, with a long pot life, high temperature stability and excellent electrical conductivity. It can be used for high volume chip and substrate bonding, in micro-electronic, hybrid and optoelectronic application. Polytec EC 151-L can be cured at 95°C or allows rapid cure cycles at higher temperatures and will withstand reflow and wire bond processes. The material can be applied by stamping, (jet-) dispensing or manually.

Polytec TC 422 is a pasty, two component adhesive for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 422 has a great thermal conductivity and an excellent adhesion, especially to metals such as aluminum and stainless steel. It is also characterized by its high mechanical strength and thermal resistance. The application can be performed directly from the side-by-side cartridge with a static mixing tube, using a dispensing gun.

Polytec TC 430 is a two component, thermally conductive, electrically insulating epoxy. It is suggested for applications where heat dissipation and insulating properties are required. Polytec TC 430 has an excellent adhesion to ceramic, glass, semiconductor materials, ferrous and non ferrous metals and most plastics. The material can be applied via dispensing, screen printing, or manual application.

Polytec EC 244 is a standard two-component, solvent-free, electrically conductive epoxy adhesive with a short pot life and curing at room temperatures. Polytec EC 244 is suggested for short time processing and low temperature curing applications. Polytec EC 244 can be also cured at 50°C in 1h. The material can be applied by dispensing or manually.

Polytec PU 1000 is a one-component, room- temperature curing, highly flexible with excellent polyurethane-adhesive electrical conductivity. Polytec PU 1000 has been specifically developed for contacting chip modules on dual interface smart cards. It is used in micro electronics, hybrid and electronic applications. Polytec PU 1000 cures at room temperature or accelerated with heat. Polytec PU 1000 stands out due to its high flexibility combined with mechanical strength. It is also suitable for electrical contacting of copper surfaces The material can be applied by dispensing, jet-dispensing or manually.