Products

Polytec EC 244 is a standard two-component, solvent-free, electrically conductive epoxy adhesive with a short pot life and curing at room temperatures. Polytec EC 244 is suggested for short time processing and low temperature curing applications. Polytec EC 244 can be also cured at 50°C in 1h. The material can be applied by dispensing or manually.

Polytec EC 151-L is a standard two- component, solvent free epoxy resin optimized for stamping application, with a long pot life, high temperature stability and excellent electrical conductivity. It can be used for high volume chip and substrate bonding, in micro-electronic, hybrid and optoelectronic application. Polytec EC 151-L can be cured at 95°C or allows rapid cure cycles at higher temperatures and will withstand reflow and wire bond processes. The material can be applied by stamping, (jet-) dispensing or manually.

Polytec TC 351 is a single component, thermally conductive epoxy with good thermal conductivity and excellent resistance towards moisture and chemicals. It was designed for all applications where electrically insulating and thermally conductive bonds are desirable. Polytec TC 351 has a conveniently long pot and shelf life. Typical applications are bonding of sensors in metal holders and fixation of single devices on PCBs. Due to the long pot and shelf life it is ideal for high volume dispensing techniques. The material can be applied by dispensing, screen or stencil printing.

Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.

Polytec TC 301 is a standard single component metal filled, heat curing epoxy adhesive with excellent thermal conductivity. Polytec TC 301 was designed for all applications where heat transfer is essential (heat sinking, aluminum or ceramic packaging etc. It has a conveniently long pot and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.