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Polytec TC 417-2

1 of 8 products in this brand
Polytec TC 417 2 is a two component, thermally conductive, electrically insulating epoxy It is used in various thermal management applications, especially for potting of large volumes. Polytec TC 417 2 has an excellent chemical and moisture resistance It has an excellent adhesion to glass, metal, ceramic, FR 4 and most plastics. The room temperature cure allows to bond temperature sensitive substrates very conveniently The material can be applied via dispensing or manual application.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive, Insulation Adhesive, Potting Compound, Solvent free (100% Solids) Adhesive

Compatible Substrates & Surfaces: Ceramic, Glass, Metal, Plastics

Cure Method: Air Dry

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Cure Method
Processing
  • For two component products the components A and B should be mixed carefully within the specified mixing ratio
  • For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler
  • Processing should be carried out rapidly after mixing the components as an indication the pot life can be used
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products)
  • Please take notice of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (100°C)30.0Minutes
Curing Time (23°C)24.0Hours
Curing Time (80°C)60.0Minutes
Curing Temperaturemin. 15°C
Cured Properties
ValueUnitsTest Method / Conditions
Coefficient of Thermal Expansion (<Tg)38.0ppmISO 11359-2
Coefficient of Thermal Expansion (>Tg)145.0ppmISO 11359-2
Degradation Temperature300.0°CTM 302
Dielectric Strengthmin. 10kV/mmTM 402
Elongation at Break1.1%TM 605
Glass Transition Temperature (Tg)70 - 80°CTM 501
Hardness85.0Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)To Be DeterminedN/mm²TM 604
Loss Factor0.022Ring Resonator
Permittivity3.68Ring Resonator
Temperature Resistance Continuous-55 to 180°CTM 302
Temperature Resistance Short Term-55 to 250°CTM 302
Tensile Strength46.0N/mm²TM 605
Thermal Conductivity0.8W/m.KTM 502
Water Absorption (24h, 23°C)0.1%TM 301
Young Modulus7700.0N/mm²TM 605
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy
ConsistencyFlowable pasteTM 101
Density (A-Part)2.1g/cm³TM 201.2
Density (B-Part)0.95g/cm³TM 201.2
Density (Mix)1.8g/cm³TM 201.2
Particle Sizemax. 50μm
Mixing Ratio (Volume)1900-01-03T04:27:00+00:00
Mixing Ratio (Weight)1900-01-03T04:13:00+00:00
Number of Components2.0
Type of FillerAluminiumoxide
Viscosity Mix (84s⁻¹, 23°C)4000.0mPa.sTM 202.1
Viscosity A-Part (84s⁻¹, 23°C)60000.0mPa.sTM 202.1
Viscosity B Part (84s⁻¹, 23°C)15.0mPa.sTM 202.1
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Packaging & Availability

Standard Pack Sizes
  • 250 g, 500 g
  • 1 kg, 25 kg
  • Customized Packaging
  • Also available as pre-mixed frozen product

Storage & Handling

Pot Life (15g Mixture, 23°C)
6 Hours
Storage Stability (23°C)
12 Months