Products

Polytec TC 422 is a pasty, two component adhesive for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 422 has a great thermal conductivity and an excellent adhesion, especially to metals such as aluminum and stainless steel. It is also characterized by its high mechanical strength and thermal resistance. The application can be performed directly from the side-by-side cartridge with a static mixing tube, using a dispensing gun.

Polytec EC 244 is a standard two-component, solvent-free, electrically conductive epoxy adhesive with a short pot life and curing at room temperatures. Polytec EC 244 is suggested for short time processing and low temperature curing applications. Polytec EC 244 can be also cured at 50°C in 1h. The material can be applied by dispensing or manually.

Polytec TC 411 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.

Polytec TC 406 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 406 has a good thermal resistance as well an excellent thermal conductivity. The application can be performed directly from the side by side cartridge with a static mixing nozzle, using a dispensing gun.

Polytec TC 417 2 is a two component, thermally conductive, electrically insulating epoxy It is used in various thermal management applications, especially for potting of large volumes. Polytec TC 417 2 has an excellent chemical and moisture resistance It has an excellent adhesion to glass, metal, ceramic, FR 4 and most plastics. The room temperature cure allows to bond temperature sensitive substrates very conveniently The material can be applied via dispensing or manual application.

Polytec PU 1000 is a one-component, room- temperature curing, highly flexible with excellent polyurethane-adhesive electrical conductivity. Polytec PU 1000 has been specifically developed for contacting chip modules on dual interface smart cards. It is used in micro electronics, hybrid and electronic applications. Polytec PU 1000 cures at room temperature or accelerated with heat. Polytec PU 1000 stands out due to its high flexibility combined with mechanical strength. It is also suitable for electrical contacting of copper surfaces The material can be applied by dispensing, jet-dispensing or manually.