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Polytec TC 432 is a thixotropic, two component, highly thermally conductive, electrically insulating epoxy for thermal management in micro and power electronics, energy engineering etc. Polytec TC 432 has an excellent adhesion to ceramic, glass, semiconductor materials, ferrous and non ferrous metals and most plastics. The material can be applied via dispensing, screen printing, or manual application.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Ceramic, Glass, Plastics

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Processing
  • For two component products the components A and B should be mixed carefully within the specified mixing ratio
  • For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler
  • Processing should be carried out rapidly after mixing the components as an indication the pot life can be used
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products)
  • Please take notice of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (23°C)24.0Hours
Curing Temperaturemin. 15°C
Cured Properties
ValueUnitsTest Method / Conditions
Degradation Temperature350.0°CTM 302
Elongation at Break0.4%TM 605
Hardnessmin. 65Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)9.0N/mm²TM 604
Temperature Resistance Continuous-55 to 180°CTM 302
Temperature Resistance Short Term-55 to 230°CTM 302
Tensile Strength36.0N/mm²TM 605
Thermal Conductivity1.6 - 2W/m.KTM 502
Young Modulus10000.0N/mm²TM 605
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy
ConsistencyThixotropic pasteTM 101
Density (A-Part)1.58g/cm³TM 201.2
Density (B-Part)0.98g/cm³TM 201.2
Density (Mix)1.5g/cm³TM 201.2
Particle Sizemax. 140μm
Mixing Ratio (Weight)1900-01-03T04:07:00+00:00
Number of Components2.0
Type of FillerBoron nitride
Viscosity Mix (10s⁻¹, 23°C)65000.0mPa.sTM 202.11
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Packaging & Availability

Standard Pack Sizes
  • 250 g, 500 g
  • 1 kg
  • Customized Packaging

Storage & Handling

Pot Life (23°C)
15 Minutes
Storage Stability (23°C)
12 Months