Products

Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.

Polytec TC 432 is a thixotropic, two component, highly thermally conductive, electrically insulating epoxy for thermal management in micro and power electronics, energy engineering etc. Polytec TC 432 has an excellent adhesion to ceramic, glass, semiconductor materials, ferrous and non ferrous metals and most plastics. The material can be applied via dispensing, screen printing, or manual application.

Polytec EC 151-L is a standard two- component, solvent free epoxy resin optimized for stamping application, with a long pot life, high temperature stability and excellent electrical conductivity. It can be used for high volume chip and substrate bonding, in micro-electronic, hybrid and optoelectronic application. Polytec EC 151-L can be cured at 95°C or allows rapid cure cycles at higher temperatures and will withstand reflow and wire bond processes. The material can be applied by stamping, (jet-) dispensing or manually.

Polytec TC 430 is a two component, thermally conductive, electrically insulating epoxy. It is suggested for applications where heat dissipation and insulating properties are required. Polytec TC 430 has an excellent adhesion to ceramic, glass, semiconductor materials, ferrous and non ferrous metals and most plastics. The material can be applied via dispensing, screen printing, or manual application.