Products

Polytec TC 411 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.

Polytec TC 301 is a standard single component metal filled, heat curing epoxy adhesive with excellent thermal conductivity. Polytec TC 301 was designed for all applications where heat transfer is essential (heat sinking, aluminum or ceramic packaging etc. It has a conveniently long pot and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.

Polytec PU 1000 is a one-component, room- temperature curing, highly flexible with excellent polyurethane-adhesive electrical conductivity. Polytec PU 1000 has been specifically developed for contacting chip modules on dual interface smart cards. It is used in micro electronics, hybrid and electronic applications. Polytec PU 1000 cures at room temperature or accelerated with heat. Polytec PU 1000 stands out due to its high flexibility combined with mechanical strength. It is also suitable for electrical contacting of copper surfaces The material can be applied by dispensing, jet-dispensing or manually.