company tower banner
Polytec PT Company Logo
Polytec TC 411 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Ceramic, Glass, Metal, Plastics

Cure Method: Air Dry

Application Method: Gun

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Method
Compatible Substrates & Surfaces
Cure Method
Processing
  • The processing of two component products from side by side cartridges is very simple
  • The cartridge is inserted into a suitable dispensing gun. The closing cap of the cartridge is then removed and replaced by an according static mixing nozzle
  • By activating the trigger of the dispensing gun, the two components are pressed out and automatically mixed in the static mixer
  • In order to prevent mixing errors, dispose the first half of the content in the mixing nozzel prior to application
  • Processing should be carried out rapidly after mixing the components as an indication, the pot life can be used
  • When the pot life is exceeded, the mixing tube should be replaced with a new one
  • Close the cartridge with the cap after use
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • Please take care of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (23°C)48.0Hours
Curing Time (80°C)90.0Minutes
Curing Temperaturemin. 15°C
Cured Properties
ValueUnitsTest Method / Conditions
Degradation Temperature280.0°CTM 302
Elongation at Break11.0%TM 605
Glass Transition Temperature (Tg)max. 20°CTM 501
Hardness38.0Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)7.0N/mm²TM 604
Maximum Service Temperature (Continuous)-55 to 120°CTM 302
Maximum Service Temperature (Short-Term)-55 to 220°CTM 302
Tensile Strength3.0N/mm²TM 605
Thermal Conductivity1.3 - 1.5W/m.KTM 502
Young's ModulusN.BN/mm²TM 605
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy
ConsistencyCreamy pasteTM 101
Density (A-Part)1.5g/cm³TM 201.2
Density (B-Part)1.3g/cm³TM 201.2
Density (Mix)1.5g/cm³TM 201.2
Mixing Ratio (Volume)7260
Number of Components2.0
Type of FillerBoron nitride
Viscosity Mix (84s⁻¹, 23°C)140000.0mPa.sTM 202.1
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Packaging & Availability

Standard Pack Sizes
  • 50 mL 2K cartridges
  • Customized Packaging

Storage & Handling

Pot Life (23°C)
12 Minutes
Shelf Life
12 months at 23°C