company tower banner
Polytec PT Company Logo
Polytec TC 301 is a standard single component metal filled, heat curing epoxy adhesive with excellent thermal conductivity. Polytec TC 301 was designed for all applications where heat transfer is essential (heat sinking, aluminum or ceramic packaging etc. It has a conveniently long pot and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Application Area: Heat Sink

Compatible Substrates & Surfaces: Ceramic, Glass, Metal, Plastics

Cure Method: Heat Cure

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Compatible Substrates & Surfaces
Cure Method
Processing
  • For two component products the components A and B should be mixed carefully within the specified mixing ratio
  • For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler
  • Processing should be carried out rapidly after mixing the components as an indication the pot life can be used
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products)
  • Please take notice of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (120°C)50 - 55Minutes
Curing Time (150°C)10 - 15Minutes
Curing Temperaturemin. 120°C
Cured Properties
ValueUnitsTest Method / Conditions
Degradation Temperature350.0°CTM 302
Elongation at Break0.8%TM 605
Hardness85.0Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)23.0N/mm²TM 604
Temperature Resistance Continuous-55 to 180°CTM 302
Temperature Resistance Short Term-55 to 280°CTM 302
Tensile Strength59.0N/mm²TM 605
Thermal Conductivity1.7 - 2.1W/m.KTM 502
Water Absorption (24h, 23°C)0.2%TM 301
Young Modulus12000.0N/mm²TM 605
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy
ConsistencyCreamy PasteTM 101
Density (Mix)2.0g/cm³TM 201.2
Particle Sizemax. 30μm
Number of Components1.0
Type of FillerAluminium
Viscosity Mix (84s⁻¹, 23°C)43000.0mPa.sTM 202.1
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Packaging & Availability

Standard Pack Sizes
  • 30cc / 60 g
  • 250 g, 500 g
  • 1 kg, 25 kg
  • Customized Packaging

Storage & Handling

Pot Life (23°C)
1 Months
Storage Stability (6-8°C)
6 Months