Polytec PU 1000

Identification & Functionality

Chemical Family

Polyurethanes (PU)

Product Type

1K (1 component) Adhesive,

Conductive Adhesive

Technologies

Ready-to-Use Products

Product Families

Ready-to-Use Products — Adhesives & Sealants

Conductive Adhesives

Features & Benefits

Ready-to-Use Product Features

Chemical Resistant,

Electrically Conductive,

Excellent Mechanical Strength,

Excellent Substrate Adhesion,

Flexible

Applications & Uses

Markets

Consumer Goods,

Electrical & Electronics

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Packaging & Assembly

Adhesives & Sealants

Application Area

Chip Module,

Credit Card

Compatible Substrates & Surfaces

Copper,

Metal,

Plastics

Cure Method

Air Dry

Processing

• Polytec PU 1000 can be dispensed directly from the syringe
• For optimum storage stability we recommend storage in a fridge at 5 - 8°C However, the product needs to be prevented from freezing, prolonged storage above 25°C should be avoided
• Plastic needles are preferred for dispensing, since steel needles are prone to clogging
• Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals

Properties

Physical Form

Paste

Typical Properties

	Value	Units	Test Method / Conditions
Curing Time (100°C)	5 - 10	Minutes	—
Curing Time (180°C)	2.0	Seconds	—
Curing Time (23°C)	0.5 - 4	Hours	—
Curing Temperature	min. 15	°C	—

Cured Properties

	Value	Units	Test Method / Conditions
Degradation Temperature	280.0	°C	TM 302
Elasticity Modulus	approx. 200	N/mm²	TM 605
Elongation at Break	approx. 1.2	%	TM 605
Hardness	35.0	Shore D	DIN EN ISO 868
Specific Volume Resistivity	2 - 4x10^-4	Ohm-cm	TM 401
Temperature Resistance Continuous	-40 to 100	°C	TM 302
Temperature Resistance Short Term	-40 to 200	°C	TM 302
Tensile Strength	approx. 8	N/mm²	TM 605
Thermal Conductivity	1.8	W/m.K	TM 502

Uncured Properties

	Value	Units	Test Method / Conditions
Chemical Basis	Polyurethane Dispersion	—	—
Consistency	Creamy Paste	—	TM 101
Density (Mix)	1.72	g/cm³	TM 201.2
Particle Size	max. 30	μm	—
Number of Components	1.0	—	—
Type of Filler	Silver	—	—
Viscosity Mix (84s⁻¹, 23°C)	12000.0	mPa.s	TM 202.1

Note

* Curing temperatures refer to the temperature in the actual bond line When choosing the respective curing conditions, time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) heat input may differ.

Polytec PU 1000 firstly sets by physical drying. Therefore curing time strongly depends on the type of substrate and bond line thickness. Thicker bond lines require longer curing times compared to thin bond lines, porous substrates accelerate the curing process.

Packaging & Availability

Standard Pack Sizes

• 3 cc / 5 g, 5 cc / 7 g, 10 cc / 17 g, 30 cc / 45 g
• Customized Packaging

Storage & Handling

Storage Stability (6-8°C)

6 Months