company tower banner
Polytec PT Company Logo

Polytec EC 151-L

1 of 3 products in this brand
Polytec EC 151-L is a standard two- component, solvent free epoxy resin optimized for stamping application, with a long pot life, high temperature stability and excellent electrical conductivity. It can be used for high volume chip and substrate bonding, in micro-electronic, hybrid and optoelectronic application. Polytec EC 151-L can be cured at 95°C or allows rapid cure cycles at higher temperatures and will withstand reflow and wire bond processes. The material can be applied by stamping, (jet-) dispensing or manually.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Application Area: Die/Chip Attach, Stamping

Cure Method: Heat Cure

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Cure Method
Processing
  • For two component products the components A and B should be mixed carefully within the specified mixing ratio
  • For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler
  • Processing should be carried out rapidly after mixing the components as an indication the pot life can be used
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products)
  • Please take notice of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (100°C)60.0Minutes
Curing Time (120°C)15.0Minutes
Curing Time (150°C)5.0Minutes
Curing Time (180°C)60.0Seconds
Curing Temperaturemin. 95°C
Cured Properties
ValueUnitsTest Method / Conditions
Coefficient of Thermal Expansion (<Tg)40.0ppmISO 11359-2
Coefficient of Thermal Expansion (>Tg)114.0ppmISO 11359-2
Degradation Temperature400.0°CTM 302
Elasticity Modulus7000.0N/mm²TM 605
Elongation at Break0.5%TM 605
Glass Transition Temperature (Tg)75.0°CTM 501
Hardness85.0Shore DDIN EN ISO 868
Specific Volume Resistivity3 - 6x10^-4Ohm-cmDIN EN ISO 3915
Temperature Resistance Continuous-55 to 200°CTM 302
Temperature Resistance Short Term-55 to 300°CTM 302
Tensile Strength32.0N/mm²TM 605
Water Absorption (24h, 23°C)0.4%TM 301
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy
ConsistencyCreamy PasteTM 101
Density (Mix)2.81g/cm³TM 201.2
Particle Sizemax. 40μm
Mixing Ratio (Weight)3660
Number of Components2.0
Type of FillerSilver
Viscosity Mix (84s⁻¹, 23°C)5000.0mPa.sTM 202.1
Viscosity A-Part (84s⁻¹, 23°C)7500.0mPa.sTM 202.1
Viscosity B Part (84s⁻¹, 23°C)6000.0mPa.sTM 202.1
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Packaging & Availability

Standard Pack Sizes
  • 30 g, 250 g, 500 g
  • Customized Packaging

Storage & Handling

Pot Life (23°C)
48 Hours
Storage Stability (23°C)
12 Months