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Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Identification & Functionality

Features & Benefits

Labeling Claims

Applications & Uses

Application Area
Cure Method
Processing
  • For two component products the components A and B should be mixed carefully within the specified mixing ratio
  • For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler
  • Processing should be carried out rapidly after mixing the components as an indication the pot life can be used
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products)
  • Please take notice of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (100°C)50.0Minutes
Curing Time (120°C)15 - 20Minutes
Curing Time (130°C)7.0Minutes
Curing Time (150°C)3 - 4Minutes
Curing Time (180°C)60.0Seconds
Curing Temperaturemin. 95°C
Cured Properties
ValueUnitsTest Method / Conditions
Coefficient of Thermal Expansion (<Tg)40.0ppmISO 11359-2
Coefficient of Thermal Expansion (>Tg)114.0ppmISO 11359-2
Degradation Temperature400.0°CTM 302
Elasticity Modulus7000.0N/mm²TM 605
Electrical Conductivity1 - 0.25x10⁶S/mDIN EN ISO 3915
Elongation at Break0.5%TM 605
Glass Transition Temperature (Tg)74.0°CTM 501
Hardness85.0Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)8.0N/mm²TM 604
Specific Volume Resistivity1 - 4x10^-4Ohm-cmDIN EN ISO 3915
Temperature Resistance Continuous-55 to 200°CTM 302
Temperature Resistance Short Term-55 to 300°CTM 302
Tensile Strength34.0N/mm²TM 605
Thermal Conductivity1.3W/m.K
Water Absorption (24h, 23°C)0.4%TM 301
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy
ConsistencyCreamy PasteTM 101
Density (A-Part)2.17g/cm³TM 201.2
Density (B-Part)3.34g/cm³TM 201.2
Density (Mix)2.75g/cm³TM 201.2
Particle Sizemax. 30μm
Mixing Ratio (Volume)1900-01-03T05:05:00+00:00
Mixing Ratio (Weight)3660
Number of Components2.0
Type of FillerSilver
Viscosity Mix (84s⁻¹, 23°C)12000.0mPa.sTM 202.1
Viscosity A-Part (84s⁻¹, 23°C)15000.0mPa.sTM 202.1
Viscosity B Part (84s⁻¹, 23°C)11000.0mPa.sTM 202.1
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Standard Pack Sizes
  • 30 g, 250 g, 500 g
  • Customized Packaging

Storage & Handling

Pot Life (23°C)
48 Hours
Storage Stability (6-8°C)
12 Months