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AD1000™ Laminates

1 of 1 products in this brand
AD1000 is a high dielectric constant substrate that permits circuit miniaturization, compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.AD1000 is a woven glass reinforced laminate. This allows for Greater Dimensional Stability and Mechanical Robustness than other 10 Dk Products. Its large panel size is also advantageous for “multi-circuits per panel” processing.

Functions: Laminate

Reinforcement Material: Glass Fibers

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Identification & Functionality

Chemical Family
Reinforcement Material
Composite Materials Functions

Features & Benefits

Product Highlights

AD1000 is a high dielectric constant substrate that permits circuit miniaturization, compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines. AD1000 is a woven glass reinforced laminate. This allows for Greater Dimensional Stability and Mechanical Robustness than other 10 Dk Products. Its large panel size is also advantageous for “multi-circuits per panel” processing. AD1000 is considered a “soft substrate” and is relatively insensitive to vibrational stress. This allows miniaturized circuitry without requiring the complicated processing or special handling associated with brittle pure ceramic or ceramic hydrocarbon materials. AD1000 is compatible with processing used for standard PTFE based printed circuit board substrates. In addition, the low Z-axis thermal expansion provided by the ceramic loading will improve plated through hole reliability, compared to typical PTFE based laminates. The low X-Y thermal expansion provides excellent matching to ceramic chip carriers and other ceramic components. AD1000 was specifically developed for Miniaturized Circuitry for compact devices (i.e., GPS Receivers), Patch Antennas (where smaller size is required), Satellite Communications Systems, Power Amplifiers (PAs), Low Noise Amplifiers (LNAs), Low Noise Block Downconverters (LNBs), Radar Modules and Manifolds, Aircraft Collision Avoidance Systems (TCAS), and Ground Based Radar Systems.

Features
  • Only Woven Glass Reinforced PTFE/ Ceramic with Dk of 10.2 or greater
  • Thermal Conductivity is “Best-in-Class”
  • High copper peel strength allows for thinner etched line widths
  • Lowest Insertion Loss Available
  • Larger Panel Sizes Available
  • Low Moisture Absorption
  • Excellent CTE Values lead to highly reliability ceramic component attachment and PTH reliability
Benefits
  • Mechanically Robust
  • Greater Dimensional Stability than Other 10 Dk Products
  • Circuit Miniaturization Leads to Weight Savings
  • Heat Dissipation and Management
  • Greater Signal Integrity
  • Cost-Effective Board Layout and Board Processing
  • Low Loss in Humid Environments

Applications & Uses

Recommended Applications
  • Ideal for X-Band and Below
  • Radar Modules and Manifolds
  • Aircraft Collision Avoidance Systems (TCAS)
  • Ground Based Radar Surveillance Systems
  • Miniaturized Circuitry & Patch Antennas
  • Power Amplifiers (PAs)
  • Low Noise Amplifiers (LNAs)

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant at 10 GHz10.2IPC-TM-650 2.5.5.5
Surface Resistivity (E24/125)3.16 x 10^8MΩIPC-TM-650, 2.5.17.1
Dissipation Factor tan d, at 10 GHz0.0023IPC-TM-650 2.5.5.5
Surface Resistivity (C96/35/90)1.8 x 10^9MΩIPC-TM-650, 2.5.17.1
Thermal Coefficient of εr-380ppm/°CIPC-TM-650 2.5.5.5
Volume Resistivity (E24/125)5.36 x 10^7MΩ-cmIPC-TM-650, 2.5.17.1
Volume Resistivity (C96/35/90)1.4 x 10^9MΩ-cmIPC-TM-650, 2.5.17.1
Electrical Strength24.5kV/mmIPC TM-650 2.5.6.2
Dielectric Breakdownmin. 45kVIPC TM-650 2.5.6
Arc Resistancemin. 180secondsIPC TM-650 2.5.1
Td, Initialmin. 500°CIPC TM-650 2.4.24.6
Td, 5%min. 500°CIPC TM-650 2.4.24.6
T260min. 60minIPC TM-650 2.4.24.1
Time to Delamination (T288)min. 60minIPC TM-650 2.4.24.1
T300min. 60minIPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC8, 10ppm/°CIPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC20ppm/°CIPC TM-650 2.4.24
Peel Strength to Copper after thermal stress2.1N/mmIPC TM-650 2.4.8
Peel Strength to Copper at elevated temperatures2.4N/mmIPC TM-650 2.4.8.2
Young’s Modulus200kpsiIPC TM-650 2.4.18.3
Flexural Strength9.9/7.5kpsiIPC TM-650 2.4.4
Tensile Strength5.1/4.3kpsiIPC TM-650 2.4.18.3
Compressive Modulusmin. 425kpsiASTM D-3410
Poisson’s Ratio0.16ASTM D-3039
Water Absorption0.03%IPC TM-650 2.6.2.1
Density3.2g/cm3ASTM D792 Method A
Thermal Conductivity0.81W/m/°KASTM E1461
Outgassing Total Mass Loss0.01%NASA SP-R-0022A
Outgassing Collected Volatile Condensable Material0%NASA SP-R-0022A
Outgassing Water Vapor Recovered0%NASA SP-R-0022A

Technical Details & Test Data

Dielectric Constant vs. Frequency

AD1000™ Laminates - Dielectric Constant Vs. Frequency

Demonstrates the Stability of Dielectric Constant across Frequency. This information was correlated from data generated by using a free space and circular resonator cavity. This characteristic demonstrates the inherent robustness of Arlon Laminates across Frequency, thus simplifying the final design process when working across EM spectrum. The stability of the Dielectric Constant of AD1000 over frequency ensures easy design transition and scalability of design.

Dissipation Factor vs. Frequency

AD1000™ Laminates - Dissipation Factor Vs. Frequency

Demonstrates the Stability of Dissipation Factor across Frequency. This characteristic demonstrates the inherent robustness of Arlon Laminates across Frequency, providing a stable platform for high frequency applications where signal integrity is critical to the overall performance of the application.

Packaging & Availability

Material Availability

AD1000 laminates are available in a range of thicknesses from 0.020” to 0.127” (and beyond). AD1000 is supplied with 1/2, 1 or 2 ounce standard or reverse treat electrodeposited (ED) copper on both sides. Other copper weights and rolled copper foil are available. AD1000 is available bonded to heavy metal ground planes. Aluminum, brass or copper plates also provide an integral heat sink and mechanical support to the substrate. Other combinations of thickness and cladding may be available. Contact Arlon with any requests for nonstandard materials. When ordering AD1000, please specify thickness, cladding, panel size, and any other special considerations. Standard panel sizes include: 18” x 24”, 12” x 18” and 16” x 18”. Contact Arlon Customer Service for other panel sizes.