Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Features
- Nonwoven Fiberglass Reinforcement
- Low Dielectric Constant
- Extremely Low Loss
- Benefits
- Less Rigid than Woven Fiberglass
- Highly Isotropic in X,Y and Z Directions
Applications & Uses
- Applications
- Recommended Applications
- Conformal Antennas
- Stripline and Microstrip Circuits
- Missile Guidance Systems
- Radar and Electronic Wafare Systems
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant at 10GHz | 2.17, 2.20 | — | IPC TM-650 2.5.5.5 |
| Surface Resistivity | 10 x 10^8 | MΩ | IPC TM-650 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0013 | — | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 150 x 10^8 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Thermal Coefficient of εr | -157 | ppm/°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength | 10 | lb/in | IPC TM-650 2.4.8 |
| Arc Resistance | min. 180 | seconds | ASTM D-495 |
| Tensile Modulus | 133, 120 | kpsi | ASTM D-638 |
| Tensile Strength | 4.3, 3.8 | kpsi | ASTM D-882 |
| Compressive Modulus | 182 | kpsi | ASTM D-695 |
| Flexural Modulus | 213 | kpsi | ASTM D-790 |
| Dielectric Breakdown | min. 45 | kV | ASTM D-149 |
| Density | 2.23 | g/cm3 | ASTM D-792 Method A |
| Water Absorption | 0.04 | % | MIL-S-13949H 3.7.7 and IPC TM-650 2.6.2.2 |
| Coefficient of Thermal Expansion - X Axis | 46 | ppm/°C | IPC TM-650 2.4.24 |
| Coefficient of Thermal Expansion - Y Axis | 47 | ppm/°C | IPC TM-650 2.4.24 |
| Coefficient of Thermal Expansion Z Axis | 236 | ppm/°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.263 | — | ASTM E-1225 |
| Outgassing Total Mass Loss | 0.02 | % | NASA SP-R-0022A |
| Outgassing Collected Volatile Condensable Material | 0 | % | NASA SP-R-0022A |
| Outgassing Water Vapor Regain | 0.02 | % | NASA SP-R-0022A |
Technical Details & Test Data
- Dielectric Constant vs. Frequency
Demonstrates the Stability of Dielectric Constant across Frequency. This information was correlated from data generated by using a free space and circular resonator cavity. This characteristic demonstrates the inherent robustness of ArloQ Laminates across Frequency, thus simplifying the final design process when working across EM spectrum. The stability of the Dielectric Constant of IsoClad over frequency insures easy design transition and scalability of design.
- Dissipation Factor vs. Frequency
Demonstrates the Stability of dissipation factors across Frequency. This characteristic demonstrates the inherent robustness of Arlon Laminates across Frequency, providing a stable platform for high frequency applications where signal integrity is critical to the overall performance of the application.
Packaging & Availability
- Material Availability
IsoClad laminates are supplied with 1/2, 1 or 2 ounce electrodeposited copper on both sides. Other copper weights and rolled copper foil are available. IsoClad is available bonded to a heavy metal ground plane. Aluminum, brass or copper plates also provide an integral heat sink and mechanical support to the substrate. When ordering IsoClad products, please specify dielectric cons t a n t , t h i c k n e s s , c l a d d i n g , p a n e l s i z e a n d a n y o t h e r s p e c i a l considerations. Available master sheet sizes include 36" x 48".